Specific Process Knowledge/Thin film deposition/Deposition of Palladium - Revision history

Reet: /* Equipment comparison */

2025-07-07T21:21:29Z

Equipment comparison

← Older revision		Revision as of 23:21, 7 July 2025
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	\|10 Å - 600 nm*		\|10 Å - 600 nm*
	\|10 Å - 600 nm*		\|10 Å - 600 nm*
	\|~~10 Å - ? ''discuss~~ with staff''		\|Discuss with staff
	\|-		\|-
	\|-style="background:Lightgrey; color:black"		\|-style="background:Lightgrey; color:black"
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Comment		! Comment
	\|
	\|		\|
	\|		\|

Reet: /* Equipment comparison */

2025-07-07T21:20:59Z

Equipment comparison

← Older revision		Revision as of 23:20, 7 July 2025
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	!		!
	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|Temescal]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|Temescal]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator\|E-beam evaporator (10-pockets)]])
	~~! E-beam evaporation (~~[[~~Specific_Process_Knowledge~~/~~Thin_film_deposition~~/~~Wordentec~~\|~~Wordentec~~]])
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Sputter-System (Lesker)]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Sputter-System (Lesker)]])
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! General description		! General description
	~~\| E-beam deposition of Pd~~
	\| E-beam deposition of Pd		\| E-beam deposition of Pd
	\| Sputter deposition of Pd		\| Sputter deposition of Pd
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	\|-style="background:Lightgrey; color:black"		\|-style="background:Lightgrey; color:black"
	! Pre-clean		! Pre-clean
	\|Ar ion source		\|Ar ion source (only in E-beam Evaporator Temescal)
	\|none		\|none
	~~\|RF Ar clean~~
	\|RF Ar clean		\|RF Ar clean
	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Layer thickness		! Layer thickness
	\|10 Å - 600 nm*
	\|10 Å - 600 nm*		\|10 Å - 600 nm*
	\|10 Å - 600 nm*		\|10 Å - 600 nm*
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	! Deposition rate		! Deposition rate
	\|0.5 Å/s to 10Å/s		\|0.5 Å/s to 10Å/s
	~~\|2 Å/s to 10Å/s~~
	\|Up to 4.3 Å/s		\|Up to 4.3 Å/s
	\| ~~Not yet known - discuss~~ with staff		\| Discuss with staff
	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
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	\|		\|
	*Up to 4x6" wafers		*Up to 4x6" wafers
	*Up to 3x8" wafers ~~(ask for holder)~~		*Up to 3x8" wafers
	*smaller wafers and pieces
	\|
	*Up to 6x6" wafers (deposition on one wafer at the time)
	*Up to 6x4" wafers (deposition on one wafer at the time)
	*smaller wafers and pieces		*smaller wafers and pieces
	\|		\|
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	!Allowed materials		!Allowed materials
	\|		\|
	*~~Silicon oxide~~		*Almost any that does not degas
	*Silicon (oxy)nitride
	*Photoresist
	*PMMA
	*Mylar
	*Metals
	*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
	\|
	*Silicon oxide
	*Silicon (oxy)nitride
	*Photoresist
	*PMMA
	*Mylar
	*Metals
	*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]		*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
	\|		\|
	*~~Silicon oxide~~		*Almost any that does not degas.
	*Silicon (oxy)nitride		*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=244 cross-contamination sheet]
	*Photoresist		\| Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]
	*PMMA
	*Mylar
	*Metals
	*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=~~429~~ cross-contamination sheet]
	\| Almost any that do not degas

	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"

Reet: /* Sputtering of Palladium */

2025-07-07T21:14:36Z

Sputtering of Palladium

← Older revision		Revision as of 23:14, 7 July 2025
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	Palladium may be sputter deposited in the sputter-system (Lesker). See process results here:		Palladium may be sputter deposited in the sputter-system (Lesker). See process results here:


	*[[/Pd sputtering in Sputter System (Lesker) \|Pd sputtering in Sputter System (Lesker)]]		*[[/Pd sputtering in Sputter System (Lesker) \|Pd sputtering in Sputter System (Lesker)]]

Reet at 09:10, 9 June 2023

2023-06-09T09:10:35Z

← Older revision		Revision as of 11:10, 9 June 2023
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	<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>		<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>

			===Palladium deposition===
	Palladium can be deposited by e-beam evaporation or DC sputtering.		Palladium can be deposited by e-beam evaporation or DC sputtering at DTU Nanolab.

	==Sputtering of Palladium==		==Sputtering of Palladium==
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	*[[/Pd sputtering in Sputter System (Lesker) \|Pd sputtering in Sputter System (Lesker)]]		*[[/Pd sputtering in Sputter System (Lesker) \|Pd sputtering in Sputter System (Lesker)]]

			==Equipment comparison==
	In the chart below you can compare the different deposition equipment:		In the chart below you can compare the different deposition equipment:

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	! E-beam evaporation ([[Specific_Process_Knowledge/Thin_film_deposition/Wordentec\|Wordentec]])		! E-beam evaporation ([[Specific_Process_Knowledge/Thin_film_deposition/Wordentec\|Wordentec]])
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Sputter-System (Lesker)]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Sputter-System (Lesker)]])
			! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])

	\|-		\|-
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	\| E-beam deposition of Pd		\| E-beam deposition of Pd
	\| Sputter deposition of Pd		\| Sputter deposition of Pd
			\| Sputter deposition of Pd
	\|-		\|-
	\|-style="background:Lightgrey; color:black"		\|-style="background:Lightgrey; color:black"
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	\|none		\|none
	\|RF Ar clean		\|RF Ar clean
			\|RF Ar clean
	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
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	\|10 Å - 600 nm*		\|10 Å - 600 nm*
	\|10 Å - 600 nm*		\|10 Å - 600 nm*
			\|10 Å - ? ''discuss with staff''
	\|-		\|-
	\|-style="background:Lightgrey; color:black"		\|-style="background:Lightgrey; color:black"
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	\|2 Å/s to 10Å/s		\|2 Å/s to 10Å/s
	\|Up to 4.3 Å/s		\|Up to 4.3 Å/s
			\| Not yet known - discuss with staff
	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
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	*1x6" wafer or		*1x6" wafer or
	*several small samples		*several small samples
			\|
			*Up to 10x4" or 6" wafers
			*Many smaller pieces
	\|-		\|-
	\|-style="background:Lightgrey; color:black"		\|-style="background:Lightgrey; color:black"
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	*Metals		*Metals
	*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]		*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
			\| Almost any that do not degas

	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Comment		! Comment
			\|
	\|		\|
	\|		\|

Eves at 15:57, 1 February 2023

2023-02-01T15:57:30Z

← Older revision		Revision as of 17:57, 1 February 2023
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	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Palladium&action=edit click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Palladium&action=edit click here]'''

	<i> Unless otherwise stated, this page is written by DTU Nanolab internal</i>		<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>

Eves at 15:56, 1 February 2023

2023-02-01T15:56:54Z

← Older revision		Revision as of 17:56, 1 February 2023
Line 2:		Line 2:
	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Palladium&action=edit click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Palladium&action=edit click here]'''

			<i> Unless otherwise stated, this page is written by DTU Nanolab internal</i>

Eves at 09:53, 1 February 2023

2023-02-01T09:53:37Z

← Older revision		Revision as of 11:53, 1 February 2023
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	Palladium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment:		Palladium can be deposited by e-beam evaporation or DC sputtering.

			==Sputtering of Palladium==

			Palladium may be sputter deposited in the sputter-system (Lesker). See process results here:


			*[[/Pd sputtering in Sputter System (Lesker) \|Pd sputtering in Sputter System (Lesker)]]


			In the chart below you can compare the different deposition equipment:

Eves at 09:51, 1 February 2023

2023-02-01T09:51:19Z

← Older revision		Revision as of 11:51, 1 February 2023
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	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|Temescal]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|Temescal]])
	! E-beam evaporation ([[Specific_Process_Knowledge/Thin_film_deposition/Wordentec\|Wordentec]])		! E-beam evaporation ([[Specific_Process_Knowledge/Thin_film_deposition/Wordentec\|Wordentec]])
			! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Sputter-System (Lesker)]])

	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
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	\| E-beam deposition of Pd		\| E-beam deposition of Pd
	\| E-beam deposition of Pd		\| E-beam deposition of Pd
			\| Sputter deposition of Pd

	\|-		\|-
	\|-style="background:Lightgrey; color:black"		\|-style="background:Lightgrey; color:black"
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	\|Ar ion source		\|Ar ion source
	\|none		\|none
			\|RF Ar clean

	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
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	\|10 Å - 600 nm*		\|10 Å - 600 nm*
	\|10 Å - 600 nm*		\|10 Å - 600 nm*
			\|10 Å - 600 nm*

	\|-		\|-
	\|-style="background:Lightgrey; color:black"		\|-style="background:Lightgrey; color:black"
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	\|0.5 Å/s to 10Å/s		\|0.5 Å/s to 10Å/s
	\|2 Å/s to 10Å/s		\|2 Å/s to 10Å/s
			\|Up to 4.3 Å/s

	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"

	! Batch size		! Batch size
	\|		\|
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	*Up to 6x4" wafers (deposition on one wafer at the time)		*Up to 6x4" wafers (deposition on one wafer at the time)
	*smaller wafers and pieces		*smaller wafers and pieces
			\|
			*1x4" wafer or
			*1x6" wafer or
			*several small samples

	\|-		\|-
	\|-style="background:Lightgrey; color:black"		\|-style="background:Lightgrey; color:black"
	!Allowed materials		!Allowed materials
			\|
			*Silicon oxide
			*Silicon (oxy)nitride
			*Photoresist
			*PMMA
			*Mylar
			*Metals
			*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
	\|		\|
	*Silicon oxide		*Silicon oxide
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Comment		! Comment
			\|
	\|		\|
	\|		\|

Reet at 09:21, 21 September 2022

2022-09-21T09:21:19Z

← Older revision		Revision as of 11:21, 21 September 2022
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	'''Feedback to this page''': '''[mailto:~~pvd~~@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.~~danchip~~.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Palladium&action=edit click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Palladium&action=edit click here]'''

Reet at 09:20, 21 September 2022

2022-09-21T09:20:52Z

← Older revision		Revision as of 11:20, 21 September 2022
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	\|}		\|}

	'''*''' ''If depositing more than 600 nm, please write to metal@~~danchip~~.dtu.dk well in advance to ensure that enough material is present.''		'''*''' ''If depositing more than 600 nm, please write to metal@nanolab.dtu.dk well in advance to ensure that enough material is present.''