Specific Process Knowledge/Thin film deposition/Deposition of Gold - Revision history

Reet: /* Au deposition */

2026-02-24T13:24:35Z

Au deposition

← Older revision		Revision as of 15:24, 24 February 2026
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	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	! Deposition rate		! Deposition rate
	\|~~0.5~~-5 Å/s		\|1-5 Å/s
	\|1 Å/s (can be adjusted to around 5 Å/s)		\|1 Å/s (can be adjusted to around 5 Å/s)
	\|Depends on process parameters, 1-10 Å/s		\|Depends on process parameters, 1-10 Å/s

Reet: /* Au deposition */

2026-02-24T12:29:57Z

Au deposition

← Older revision		Revision as of 14:29, 24 February 2026
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	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
			!Heating
			\|to 250 C (in 10-pocket evaporator)
			\|no
			\|no
			\|to 600 C
			\|no
			\|no

			\|-style="background:WhiteSmoke; color:black"

	!Allowed materials		!Allowed materials

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	* All samples allowed in the SEM Supra 2 or 3		* All samples allowed in the SEM Supra 2 or 3

	\|-style="background:~~WhiteSmoke~~; color:black"		\|-style="background:LightGrey; color:black"
	! Comment		! Comment
	\|		\|

Reet: /* Au deposition */

2026-02-24T12:27:30Z

Au deposition

← Older revision		Revision as of 14:27, 24 February 2026
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	! Comment		! Comment
	\|		\|
	* For thicknesses above 600 nm permission is required
	* Pumpdown approx 20 min.		* Pumpdown approx 20 min.
	\|		\|

Reet: /* Au deposition */

2026-02-24T12:26:45Z

Au deposition

← Older revision		Revision as of 14:26, 24 February 2026
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	\|10 Å to 600 nm *		\|10 Å to 600 nm *
	\|10 Å to 200 nm		\|10 Å to 200 nm
	\|10 Å to 500 nm **		\|10 Å to 500 nm *
	\|10 Å to 500 nm **		\|10 Å to 500 nm *
	\| very thin, few nm range		\| very thin, few nm range
	\| very thin, few nm range		\| very thin, few nm range
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	'''*''' ''For thicknesses above 600 nm write to metal@nanolab.dtu.dk to ensure that there will be enough material in the machine.''		'''*''' ''For thicknesses above 200 nm write to metal@nanolab.dtu.dk as extra deposition costs a higher fee.''

	'''**''' ''For thicknesses above 200 nm write to metal@nanolab.dtu.dk ~~to ensure that there will be enough material in the machine~~.''

	== Resistive thermal evaporation of Au ==		== Resistive thermal evaporation of Au ==

Reet: /* Au deposition */

2026-02-24T12:25:37Z

Au deposition

← Older revision		Revision as of 14:25, 24 February 2026
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Layer thickness		! Layer thickness
	\|10 Å to ~~1 µm~~ *		\|10 Å to 600 nm *
	\|10 Å to 200 nm		\|10 Å to 200 nm
	\|10 Å to 500 nm **		\|10 Å to 500 nm **

Reet at 12:36, 24 June 2025

2025-06-24T12:36:58Z

← Older revision		Revision as of 14:36, 24 June 2025
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	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold click here]'''

	~~'''All links to Labmanager Including APV and QC requires login.'''~~

	Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. We also describe the temperature rise on the wafer during gold deposition, the adhesion layers that can be used for gold deposition, the roughness of gold deposited in the Wordentec, and issues with particulates on the gold films in the Temescal and the Wordentec.		Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. We also describe the temperature rise on the wafer during gold deposition, the adhesion layers that can be used for gold deposition, the roughness of gold deposited in the Wordentec, and issues with particulates on the gold films in the Temescal and the Wordentec.

Reet: /* Quality control of e-beam evaporated TiAu films */

2025-06-24T12:36:36Z

Quality control of e-beam evaporated TiAu films

← Older revision		Revision as of 14:36, 24 June 2025
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	\|-		\|-
	\|		\|
	*[http://labmanager.dtu.dk/d4Show.php?id=5862&mach=429 QC procedure for the E-beam ~~Evaporator (Temescal)]<br>~~		TiAu or CrAu is tested approximately once a month on both of Nanolab's e-beam evaporators.
	*[https://labmanager.~~dtu.dk/view_binary.php?type=data&mach=429 The newest QC data for the E-beam Evaporator (Temescal)]<br>~~

	*[http://labmanager.dtu.dk/d4Show.php?id=5862&mach=511 QC procedure for the ~~E-beam Evaporator (10-pockets)]<br>~~		'''You can find the QC procedures and data in LabManager here''' (requires login):
	*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=511 The newest QC data ~~for the E-beam Evaporator~~ (~~10-pockets~~)~~]<br>~~

	~~TiAu or CrAu is tested approximately once a month on both machines~~		*[http://labmanager.dtu.dk/d4Show.php?id=5862&mach=429 QC procedure, E-beam Evaporator (Temescal)]<br>
			*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=429 Newest QC data, E-beam Evaporator (Temescal)]<br>

	~~{\|{{table}}~~		*[http://labmanager.dtu.dk/d4Show.php?id=5862&mach=511 QC procedure, E-beam Evaporator (10-pockets)]<br>
	~~\| align~~=~~"left" \|~~		*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=511 Newest QC data, E-beam Evaporator (10-pockets)]<br>
	~~{\| border="2" cellspacing="1" cellpadding="2" align~~=~~"center" style~~=~~"width:440px"~~



			{\| {{table}}
			\| align="left" valign="top"\|
			{\| border="2" cellspacing="1" cellpadding="2" align="left" style="width:400px"
	! QC Recipe:		! QC Recipe:
	! Standard recipes/TiAu or Cr/Au		! Standard recipes/TiAu or Cr/Au
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	\|-		\|-
	\|}		\|}
			\|-
			\|}


	{\| {{table}}		{\| {{table}}
	\| align="left" \|		\| align="left" valign="top"\|
	{\| border="2" cellspacing="1" cellpadding="2" align="~~center~~" style="width:~~440px~~"		{\| border="2" cellspacing="1" cellpadding="2" align="left" style="width:400px"
	!QC limits		!QC limits
	!Both e-beam evaporators		!Both e-beam evaporators
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	\|-		\|-
	\|}		\|}

	Thickness is measured in 5 points with a stylus profiler. <br>		Thickness is measured in 5 points with a stylus profiler. <br>
	Additionally we examine the newly deposited films for particles using the particle scanner (if available, otherwise we use the Jenatech microscope in darkfield mode) and we monitor the sheet resistance of the Ti/Au or Cr/Au films.		Additionally we examine the newly deposited films for particles using the particle scanner (if available, otherwise we use the Jenatech microscope in darkfield mode) and we monitor the sheet resistance of the Ti/Au or Cr/Au films.
	\|}		\|}

Reet: /* Quality control of e-beam evaporated TiAu films */

2025-06-23T12:41:18Z

Quality control of e-beam evaporated TiAu films

← Older revision		Revision as of 14:41, 23 June 2025
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	*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=511 The newest QC data for the E-beam Evaporator (10-pockets)]<br>		*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=511 The newest QC data for the E-beam Evaporator (10-pockets)]<br>

	{\| {{table}}		TiAu or CrAu is tested approximately once a month on both machines

			{\|{{table}}
	\| align="left" \|		\| align="left" \|
	{\| border="2" cellspacing="1" cellpadding="2" align="center" style="width:440px"		{\| border="2" cellspacing="1" cellpadding="2" align="center" style="width:440px"

Reet: /* Quality control of e-beam evaporated TiAu films */

2025-06-23T12:39:47Z

Quality control of e-beam evaporated TiAu films

← Older revision		Revision as of 14:39, 23 June 2025
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	{\| {{table}}		{\| {{table}}
	\| align="~~center~~" \|		\| align="left" \|
	{\| border="1" cellspacing="1" cellpadding="2" align="center" style="width:~~400px~~"		{\| border="2" cellspacing="1" cellpadding="2" align="center" style="width:440px"

	! QC Recipe:		! QC Recipe:
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	\|-		\|-
	\|}		\|}
	\| align="~~center" valign="top~~"\|		{\| {{table}}
			\| align="left" \|
	{\| border="2" cellspacing="1" cellpadding="2" align="center" style="width:440px"		{\| border="2" cellspacing="1" cellpadding="2" align="center" style="width:440px"
	!QC limits		!QC limits

Reet at 08:18, 23 June 2025

2025-06-23T08:18:03Z

← Older revision		Revision as of 10:18, 23 June 2025
Line 2:		Line 2:

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold click here]'''

			'''All links to Labmanager Including APV and QC requires login.'''

	Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. We also describe the temperature rise on the wafer during gold deposition, the adhesion layers that can be used for gold deposition, the roughness of gold deposited in the Wordentec, and issues with particulates on the gold films in the Temescal and the Wordentec.		Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. We also describe the temperature rise on the wafer during gold deposition, the adhesion layers that can be used for gold deposition, the roughness of gold deposited in the Wordentec, and issues with particulates on the gold films in the Temescal and the Wordentec.