Specific Process Knowledge/Thin film deposition/Deposition of Copper - Revision history

Reet: /* Deposition of Cu */

2025-06-20T12:57:51Z

Deposition of Cu

← Older revision		Revision as of 14:57, 20 June 2025
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	= Deposition of Cu =		= Deposition of Cu =
	Copper can be deposited by e-beam evaporation or sputtering at Nanolab. In the chart below you can compare the different deposition equipment. Further down you will find some results of studies on Cu deposition processes.		Copper can be deposited by e-beam evaporation or sputtering at Nanolab. We have also recently developed a process with thermal evaporation (2024). In the chart below you can compare the different deposition equipment. Further down you will find some results of studies on Cu deposition processes.

	==Studies of Cu deposition==		==Studies of Cu deposition==

Eves: /* Deposition of Cu */

2024-02-09T14:07:59Z

Deposition of Cu

← Older revision		Revision as of 16:07, 9 February 2024
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	==Studies of Cu deposition==		==Studies of Cu deposition==

			[[/Deposition of Copper/Resistive thermal evaporation of Copper\|Resistive thermal evaporation of copper]]

	[[/Deposition of Copper\|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with the Alcatel e-beam evaporator'' - this particular machine has been decommissioned, but the results may still be of interest.		[[/Deposition of Copper\|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with the Alcatel e-beam evaporator'' - this particular machine has been decommissioned, but the results may still be of interest.

Reet at 13:58, 19 January 2024

2024-01-19T13:58:44Z

← Older revision		Revision as of 15:58, 19 January 2024
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	= Deposition of Cu =		= Deposition of Cu =
	Copper can be deposited by e-beam evaporation or sputtering at Nanolab. In the chart below you can compare the different deposition equipment. Further down you will find some results of studies on Cu deposition processes.		Copper can be deposited by e-beam evaporation or sputtering at Nanolab. In the chart below you can compare the different deposition equipment. Further down you will find some results of studies on Cu deposition processes.

			==Studies of Cu deposition==

			[[/Deposition of Copper\|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with the Alcatel e-beam evaporator'' - this particular machine has been decommissioned, but the results may still be of interest.

			[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cu:_Low_stress\|Stress in sputtered Cu]] - ''Low stress in Cu films sputtered with the Sputter-System (Lesker)''


			==Comparison of equipment for Cu deposition==
	{\| border="1" cellspacing="0" cellpadding="3"		{\| border="1" cellspacing="0" cellpadding="3"
	\|-style="background:silver; color:black"		\|-style="background:silver; color:black"
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	'''**''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)''		'''**''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)''

	~~==Studies of Cu deposition==~~

	~~[[/Deposition of Copper\|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with the Alcatel e-beam evaporator''~~

	[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cu:_Low_stress\|Stress in sputtered Cu]] - ''Low stress in Cu films sputtered with the Sputter-System (Lesker)''

Reet: /* Deposition of Cu */

2024-01-19T13:53:21Z

Deposition of Cu

← Older revision		Revision as of 15:53, 19 January 2024
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	*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=167 cross-contamination sheet]		*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=167 cross-contamination sheet]
	\|		\|
	*Almost that does not degas also if you plan to heat the substrate - see cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3] ~~\|-style="background:WhiteSmoke; color:black"~~		*Almost that does not degas also if you plan to heat the substrate - see cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]

	\|}		\|}

Reet: /* Deposition of Cu */

2024-01-19T13:52:59Z

Deposition of Cu

← Older revision		Revision as of 15:52, 19 January 2024
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	\|		\|
	*Almost that does not degas also if you plan to heat the substrate - see cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3] \|-style="background:WhiteSmoke; color:black"		*Almost that does not degas also if you plan to heat the substrate - see cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3] \|-style="background:WhiteSmoke; color:black"
	~~! Comment~~
	\|
	\|
	\|
	\|}		\|}

Reet: /* Deposition of Cu */

2024-01-19T13:52:43Z

Deposition of Cu

← Older revision		Revision as of 15:52, 19 January 2024
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	!		!

	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|Temescal]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator\|E-beam evaporator (10-pockets)]])
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
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	!Pre-clean		!Pre-clean
	\|Ar ion ~~bombardment~~		\|Ar ion etch (only in E-beam evaporator Temescal)
	\|RF Ar clean		\|RF Ar clean
	\|RF Ar clean		\|RF Ar clean
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	\|		\|
	*~~Silicon~~		* Almost any that does not degas - also if you plan to use heating.
	*Silicon oxide
	*Silicon (oxy)nitride
	*Photoresist
	*PMMA
	*Mylar
	*Metals
	*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]		*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]

	\|		\|
	* ~~Silicon~~		* Almost any that does not degas.
	* ~~Silicon oxide~~		*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=167 cross-contamination sheet]
	* Silicon (oxy)nitride
	* Photoresist
	* PMMA
	* Mylar
	* SU-8
	* Metals
	\|		\|
	*Almost ~~any as long as they do~~ not ~~outgas~~ if you ~~are planning~~ to heat the substrate~~. Check the~~ cross-contamination sheets ~~in Labmanager~~.		*Almost that does not degas also if you plan to heat the substrate - see cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3] \|-style="background:WhiteSmoke; color:black"
	\|-style="background:WhiteSmoke; color:black"
	! Comment		! Comment
	\|		\|

Eves at 16:00, 1 February 2023

2023-02-01T16:00:20Z

← Older revision		Revision as of 18:00, 1 February 2023
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	'''Feedback to this page''': '''[mailto:LabAdviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Copper click here]'''		'''Feedback to this page''': '''[mailto:LabAdviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Copper click here]'''

			<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>


	= Deposition of Cu =		= Deposition of Cu =

Reet: /* Deposition of Cu */

2022-09-09T14:59:54Z

Deposition of Cu

← Older revision		Revision as of 16:59, 9 September 2022
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Comment		! Comment
	\|~~As of March 2020, Cu has not yet been deposited in this machine.~~		\|
	~~Please contact the Thin Film group to develop a process.~~
	\|		\|
	\|		\|

Reet: /* Deposition of Cu */ cluster sputter name

2020-08-08T22:22:39Z

Deposition of Cu: cluster sputter name

← Older revision		Revision as of 00:22, 9 August 2020
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	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|Temescal]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|Temescal]])
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker]])
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-~~based_multi~~-~~chamber_high_vacuum_sputtering_deposition_system#Process_information~~\|~~Cluster~~-~~based sputter~~ system]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"

Reet: /* Deposition of Cu */ added info on deposition rate

2020-04-21T15:08:08Z

Deposition of Cu: added info on deposition rate

← Older revision		Revision as of 17:08, 21 April 2020
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	! Deposition rate		! Deposition rate
	\|~~1Å/s to 10Å~~/s		\|1-10 Å/s
	\| ~1Å/s		\|~ 1 Å/s
	\| ~~depends~~ on process parameters		\|Depends on process parameters, at least up to 8.7 Å/s, see conditions [[Specific_Process_Knowledge/Thin_film_deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Standard_recipe_performance\|here]]
	\|-		\|-