Specific Process Knowledge/Thin film deposition/Deposition of Chromium - Revision history

Reet: /* Studies of Cr deposition processes */

2025-06-23T09:46:17Z

Studies of Cr deposition processes

← Older revision		Revision as of 11:46, 23 June 2025
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	== Studies of Cr deposition processes ==		== Studies of Cr deposition processes ==

	[[/~~oughness~~ of Chromium\|Roughness of Chromium]] - ''Roughness and Uniformity of Cr layers deposited with different methods and settings''		[[/Roughness of Chromium\|Roughness of Chromium]] - ''Roughness and Uniformity of Cr layers deposited with different methods and settings''

	[[/Sputtering of Cr in Sputter System (Lesker)\|Sputtering of Cr in Sputter system (Lesker)]] - ''Settings and deposition rates''		[[/Sputtering of Cr in Sputter System (Lesker)\|Sputtering of Cr in Sputter system (Lesker)]] - ''Settings and deposition rates''
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	[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cr:_High_tensile_stress\|Stress in sputtered Cr films]] - ''Extremely high tensile stress in Cr films deposited at high temperature''		[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cr:_High_tensile_stress\|Stress in sputtered Cr films]] - ''Extremely high tensile stress in Cr films deposited at high temperature''


	== Chromium deposition ==		== Chromium deposition ==

Mmat at 14:32, 20 June 2025

2025-06-20T14:32:45Z

← Older revision		Revision as of 16:32, 20 June 2025
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	== Studies of Cr deposition processes ==		== Studies of Cr deposition processes ==

	[[/~~Deposition~~ of Chromium\|~~Uniformity~~ of ~~Cr layers~~]] - ''Uniformity of Cr layers deposited with different methods and settings''		[[/oughness of Chromium\|Roughness of Chromium]] - ''Roughness and Uniformity of Cr layers deposited with different methods and settings''

	[[/Sputtering of Cr in Sputter System (Lesker)\|Sputtering of Cr in Sputter system (Lesker)]] - ''Settings and deposition rates''		[[/Sputtering of Cr in Sputter System (Lesker)\|Sputtering of Cr in Sputter system (Lesker)]] - ''Settings and deposition rates''
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	[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cr:_High_tensile_stress\|Stress in sputtered Cr films]] - ''Extremely high tensile stress in Cr films deposited at high temperature''		[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cr:_High_tensile_stress\|Stress in sputtered Cr films]] - ''Extremely high tensile stress in Cr films deposited at high temperature''

	~~[[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Roughness of Chromium\|Roughness of Chromium]] - Settings and roughness measurements~~

	== Chromium deposition ==		== Chromium deposition ==

Mmat: /* Studies of Cr deposition processes */

2025-06-20T14:31:30Z

Studies of Cr deposition processes

← Older revision		Revision as of 16:31, 20 June 2025
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	[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cr:_High_tensile_stress\|Stress in sputtered Cr films]] - ''Extremely high tensile stress in Cr films deposited at high temperature''		[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cr:_High_tensile_stress\|Stress in sputtered Cr films]] - ''Extremely high tensile stress in Cr films deposited at high temperature''

			[[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Roughness of Chromium\|Roughness of Chromium]] - Settings and roughness measurements

	== Chromium deposition ==		== Chromium deposition ==

Reet: /* Chromium deposition */

2025-06-20T10:34:48Z

Chromium deposition

← Older revision		Revision as of 12:34, 20 June 2025
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	\|}		\|}
	'''*''' ''For thicknesses above 300 nm, please request permission from metal@nanolab.dtu.dk to ensure there is enough material.''		'''*''' ''For thicknesses above 300 nm, please request permission from metal@nanolab.dtu.dk to ensure there is enough material and to prioritize chamber cleaning as Cr tends to be a high-stress layer and thus causes flaking,''

Reet: /* Studies of Cr deposition processes */

2025-06-20T10:28:21Z

Studies of Cr deposition processes

← Older revision		Revision as of 12:28, 20 June 2025
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	[[/Deposition of Chromium\|Uniformity of Cr layers]] - ''Uniformity of Cr layers deposited with different methods and settings''		[[/Deposition of Chromium\|Uniformity of Cr layers]] - ''Uniformity of Cr layers deposited with different methods and settings''

	~~[[/Sputtering of Cr in Wordentec\|Sputtering of Cr in Wordentec]] - ''Settings and deposition rates''~~

	[[/Sputtering of Cr in Sputter System (Lesker)\|Sputtering of Cr in Sputter system (Lesker)]] - ''Settings and deposition rates''		[[/Sputtering of Cr in Sputter System (Lesker)\|Sputtering of Cr in Sputter system (Lesker)]] - ''Settings and deposition rates''
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	[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cr:_High_tensile_stress\|Stress in sputtered Cr films]] - ''Extremely high tensile stress in Cr films deposited at high temperature''		[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cr:_High_tensile_stress\|Stress in sputtered Cr films]] - ''Extremely high tensile stress in Cr films deposited at high temperature''


	== Chromium deposition ==		== Chromium deposition ==

Reet: /* Chromium deposition */

2025-06-20T10:25:07Z

Chromium deposition

← Older revision		Revision as of 12:25, 20 June 2025
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	\|		\|
	Up to *3x 4" wafers or		Up to 3x 4" wafers or
	*1x6" or 1x 8" wafer		*1x6" or 1x 8" wafer
	*Many smaller samples		*Many smaller samples

Reet: /* Chromium deposition */

2025-06-20T10:24:53Z

Chromium deposition

← Older revision		Revision as of 12:24, 20 June 2025
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	!		!
	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator\|E-beam evaporator (10-pockets)]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator\|E-beam evaporator (10-pockets)]])
	~~! E-beam evaporation and sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])~~
	! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator\|Thermal evaporator]])		! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator\|Thermal evaporator]])
	! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker sputterer]])		! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker\|Lesker sputterer]])
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	! General description		! General description
	\|E-beam deposition of Chromium		\|E-beam deposition of Chromium
	~~\|E-beam and sputter deposition of Chromium~~
	\|Thermal deposition of Chromium		\|Thermal deposition of Chromium
	\|Sputter deposition of Chromium		\|Sputter deposition of Chromium
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	! Pre-clean		! Pre-clean
	\|Ar ion gun (only in E-beam evaporator Temescal)		\|Ar ion gun (only in E-beam evaporator Temescal)
	~~\|RF Ar clean~~
	\|		\|
	\|~~RF Ar clean~~		\|
	\|RF Ar clean		\|RF Ar clean
	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	! Layer thickness		! Layer thickness
	\|10Å to ~~1µm~~*		\|10Å to 300 nm*
	\|10Å to 1µm*		\|100 nm
	~~\|80~~ nm
	\|at least up to 200 nm		\|at least up to 200 nm
	\|at least up to 200 nm		\|at least up to 200 nm
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	! Deposition rate		! Deposition rate
	\|1 Å/s to 10 Å/s		\|1 Å/s to 10 Å/s
	~~\|1 Å/s to 10 Å/s (e-beam)~~
	~~Sputtering: Depends on process parameters. See [[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Sputtering of Cr in Wordentec\|here]] and process log.~~
	\|1 Å/s		\|1 Å/s
	\|Depends on [[/Sputtering of Cr in Sputter System (Lesker)\|process parameters]]. At least up to 1.48 Å/s. See process log.		\|Depends on [[/Sputtering of Cr in Sputter System (Lesker)\|process parameters]]. At least up to 1.48 Å/s. See process log.
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	*3x8" wafers (ask for holder)		*3x8" wafers (ask for holder)
	*Many smaller pieces		*Many smaller pieces

	\|		\|
	*~~24x2~~" wafers or		Up to *3x 4" wafers or
	*~~6x4~~" ~~wafers~~ or		*1x6" or 1x 8" wafer
	*6x6" wafers		*Many smaller samples
	\|
	*4x 2" wafer or
	*1x ~~4" wafers or~~
	*1x6" wafer or
	*~~Several~~ smaller ~~pieces~~
	*In theory up to 8" wafer (or 2x4" wafer) but uniformity will be bad
	\|		\|
	*1x6" wafers		*1x6" wafers
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	\|		\|
	Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet].		Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet].

	\|
	~~Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=167 cross-contamination sheet].~~
	\|		\|
	Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet].		Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet].
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	! Comment		! Comment
	\| Takes approx. 20 min to pump down		\| Takes approx. 20 min to pump down
	~~\| Takes approx. 1 hour to pump down~~
	\| Takes approx. 20 min to pump down		\| Takes approx. 20 min to pump down
	\|		\|

Paphol: /* Chromium deposition */

2025-02-05T08:10:41Z

Chromium deposition

← Older revision		Revision as of 10:10, 5 February 2025
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	\|-style="background:silver; color:black"		\|-style="background:silver; color:black"
	!		!
	! ~~E-beam evaporation~~ E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator\|E-beam evaporator (10-pockets)]])		! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator\|E-beam evaporator (10-pockets)]])
	! E-beam evaporation and sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])		! E-beam evaporation and sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])
	! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator\|Thermal evaporator]])		! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator\|Thermal evaporator]])

Reet: /* Chromium deposition */

2024-01-19T13:26:53Z

Chromium deposition

← Older revision		Revision as of 15:26, 19 January 2024
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	== Chromium deposition ==		== Chromium deposition ==
	Chromium can be deposited by e-beam evaporation, thermal evaporation, and sputter deposition. It should be noted that in e-beam evaporation, chromium does not melt but evaporates directly from the solid phase. In the chart below you can compare the different deposition equipment. ~~Further down you will find the results of some studies on chromium deposition.~~		Chromium can be deposited by e-beam evaporation, thermal evaporation, and sputter deposition. It should be noted that in e-beam evaporation, chromium does not melt but evaporates directly from the solid phase. In the chart below you can compare the different deposition equipment.

	{\| border="1" cellspacing="0" cellpadding="4"		{\| border="1" cellspacing="0" cellpadding="4"

Reet: /* Chromium deposition */

2024-01-19T13:23:04Z

Chromium deposition

← Older revision		Revision as of 15:23, 19 January 2024
Line 27:		Line 27:
	\|-style="background:silver; color:black"		\|-style="background:silver; color:black"
	!		!
	! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|Temescal]])		! E-beam evaporation E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal\|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator\|E-beam evaporator (10-pockets)]])
	! E-beam evaporation and sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])		! E-beam evaporation and sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec\|Wordentec]])
	! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator\|Thermal evaporator]])		! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator\|Thermal evaporator]])
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	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	! Pre-clean		! Pre-clean
	\|Ar ion ~~bombardment~~		\|Ar ion gun (only in E-beam evaporator Temescal)
	\|RF Ar clean		\|RF Ar clean
	\|		\|
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	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	! Deposition rate		! Deposition rate
	\|~~0.5~~ Å/s to 10 Å/s		\|1 Å/s to 10 Å/s
	\|10 Å/s to 15 Å/s (e-beam)		\|1 Å/s to 10 Å/s (e-beam)
	Sputtering: Depends on process parameters. See [[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Sputtering of Cr in Wordentec\|here]] and process log.		Sputtering: Depends on process parameters. See [[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Sputtering of Cr in Wordentec\|here]] and process log.
	\|1 Å/s		\|1 Å/s
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	\|-		\|-
	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	! Allowed ~~substrates~~		! Allowed materials
	\|		\|
	* Silicon wafers		Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet].
	* Quartz wafers
	* Pyrex wafers		\|
			Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=167 cross-contamination sheet].
	\|		\|
	* Silicon wafers		Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet].
	* Quartz wafers
	* Pyrex wafers
	\|		\|
	* III-V materials
	* Silicon wafers		* Silicon wafers
	* ~~Quartz wafers~~		* and almost any
	* Pyrex wafers
	\|		\|
	* ~~Silicon wafers~~		*Almost that does not degas - see cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]
	* and ~~almost any other~~. ~~Special carrier for III-V materials~~.		* Special carrier for III-V materials.
	\|
	*Silicon wafers
	*~~And almost any that does not degas.~~ Special carrier for III-V materials.
	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	~~!Allowed materials~~

	\|
	* Silicon oxide
	*Silicon (oxy)nitride
	*Photoresist
	*PMMA
	*Mylar
	*Metals
	*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
	\|
	* Silicon
	* Silicon oxide
	* Silicon nitride
	* Silicon (oxy)nitride
	* Photoresist
	* PMMA
	* Mylar
	* SU-8
	\|
	* Silicon oxide
	* Silicon (oxy)nitride
	* Photoresist
	* PMMA
	* Mylar
	\|
	* almost any, see [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=244 cross-contamination sheet]
	\|
	*Almost any - see cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]
	\|-
	~~\|-style="background:LightGrey; color:black"~~
	! Comment		! Comment
	\| Takes approx. 20 min to pump down		\| Takes approx. 20 min to pump down
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	\|}		\|}
	'''*''' ''For thicknesses above ~~600~~ nm, request permission from metal@nanolab.dtu.dk to ensure there is enough material.''		'''*''' ''For thicknesses above 300 nm, please request permission from metal@nanolab.dtu.dk to ensure there is enough material.''