Specific Process Knowledge/Thin film deposition/Deposition of Aluminium - Revision history

Reet: /* Deposition of Aluminium */

2025-06-18T05:14:13Z

Deposition of Aluminium

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	== Deposition of Aluminium ==		== Deposition of Aluminium ==
	Aluminium can be deposited by e-beam evaporation, sputtering and thermal evaporation. In the chart ~~at the bottom of the page~~ we compare the different methods and available equipment.		Aluminium can be deposited by e-beam evaporation, sputtering and thermal evaporation. In the chart below we compare the different methods and available equipment.


	==Sputtering of Aluminium==		==Sputtering of Aluminium==

Reet: /* Aluminium deposition on AZ5214 for lift-off */

2025-06-18T05:13:40Z

Aluminium deposition on AZ5214 for lift-off

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	==Aluminium deposition on AZ5214 for lift-off==		==Aluminium deposition on AZ5214 for lift-off==
	Negative photolithography process is ~~recomended~~.		Negative photolithography process is recommended.

	Positive photolithography process from 1,5 µm is possible especially for thin layers of metal.		Positive photolithography process from 1.5 µm is possible especially for thin layers of metal.

	The more pattern the ~~easyer~~ lift.		The more pattern the easier the lift-off.

	It was tried (jan09) to lift 2.5 µm Al on 4.2µ negative resist on top of 11 µm ~~Apox~~ SiO2 in an acetone sonic-bath.		It was tried (jan09) to lift 2.5 µm Al on 4.2 µm negative resist on top of 11 µm APOX SiO2 in an acetone sonic-bath.
	The Al deposition ~~process~~ was done in steps evaporating 500 nm a time with 5 min pause and pressure down to at least 2E-6.		The Al deposition was done in steps evaporating 500 nm a time with 5 min pause and pressure down to at least 2 E-6 mbar before proceeding.

Reet at 05:06, 18 June 2025

2025-06-18T05:06:28Z

← Older revision		Revision as of 07:06, 18 June 2025
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	It was tried (jan09) to lift 2.5 µm Al on 4.2µ negative resist on top of 11 µm Apox SiO2 in an acetone sonic-bath.		It was tried (jan09) to lift 2.5 µm Al on 4.2µ negative resist on top of 11 µm Apox SiO2 in an acetone sonic-bath.
	The Al deposition process was done in steps evaporating 500 nm a time with 5 min pause and pressure down to at least 2E-6.		The Al deposition process was done in steps evaporating 500 nm a time with 5 min pause and pressure down to at least 2E-6.

	~~==Roughness of thermally evaporated aluminium==~~

	~~A study by AFM was performed to examine Al films deposited with thermal evaporation in the Wordentec. See details [[/Roughness of thermally evaporated aluminium\|here]].~~

Reet: /* Comparison of Al deposition options */

2025-06-18T04:58:11Z

Comparison of Al deposition options

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	==Comparison of Al deposition options==		==Comparison of Al deposition options==

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	Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet].		Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet].
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Reet: /* Comparison of Al deposition options */

2025-06-18T04:57:28Z

Comparison of Al deposition options

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Reet: /* Thermal deposition of Aluminium */

2025-06-18T04:46:43Z

Thermal deposition of Aluminium

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	==Thermal deposition of Aluminium==		==Thermal deposition of Aluminium==

	In the ~~Wordentec and the~~ Thermal evaporator aluminium can be deposited by thermal deposition. ~~The two instruments~~ are ~~compared~~ on the following page:		In the Lesker Thermal evaporator aluminium can be deposited by thermal deposition. Some properties of the evaporated films are described on the following page:

	*[[/Thermal deposition of Al\|Thermal deposition of Aluminium]]		*[[/Thermal deposition of Al\|Thermal deposition of Aluminium]]


	==Comparison of Al deposition options==		==Comparison of Al deposition options==

Reet: /* E-beam evaporation of Aluminium */

2025-06-18T04:45:51Z

E-beam evaporation of Aluminium

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	*[[/Notes on low oxygen content in e-beam prepared Al thin films\|Notes on low oxygen content in e-beam prepared Al thin films (Temescal)]]		*[[/Notes on low oxygen content in e-beam prepared Al thin films\|Notes on low oxygen content in e-beam prepared Al thin films (Temescal)]]


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Reet: /* E-beam evaporation of Aluminium */

2025-06-18T04:45:42Z

E-beam evaporation of Aluminium

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	==E-beam evaporation of Aluminium==		==E-beam evaporation of Aluminium==

	Aluminium can be deposited by e-beam assisted evaporation in ~~the Wordentec and~~ the two Temescal ~~tools~~.		Aluminium can be deposited by e-beam assisted evaporation in the two Temescal e-beam evaporators.

	*[[/Al Ebeam evaporation in Temescal \|E-beam evaporation of Al in Temescal]]		*[[/Al Ebeam evaporation in Temescal \|E-beam evaporation of Al in Temescal]]

Reet: /* Sputtering of Aluminium */

2025-06-18T04:44:48Z

Sputtering of Aluminium

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	*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al sputtering in Sputter System (Lesker)\|Al sputtering in Sputter System (Lesker)]]		*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al sputtering in Sputter System (Lesker)\|Al sputtering in Sputter System (Lesker)]]
	*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al Sputtering in Cluster Lesker PC3\|Al Sputtering in Sputter-System Metal-Nitride(PC3)]]		*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al Sputtering in Cluster Lesker PC3\|Al Sputtering in Sputter-System Metal-Nitride(PC3)]]
	~~We also used to have Al sputtering in a system called the Wordentec, so we also have some information on that:~~
	*[[/Sputter rates for Al\|Sputtering of Aluminium in the Wordentec]]

	==E-beam evaporation of Aluminium==		==E-beam evaporation of Aluminium==

Reet: /* Sputtering of Aluminium */

2025-06-18T04:43:20Z

Sputtering of Aluminium

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	Aluminium may be sputter deposited in either the single-chamber sputter-system ("Sputter System Lesker") or the cluster-based sputter system ("Sputter-System Metal-Oxide(PC1)" and "Sputter-System Metal-Nitride(PC3)"). See more in links here and the chart below.		Aluminium may be sputter deposited in either the single-chamber sputter-system ("Sputter System Lesker") or the cluster-based sputter system ("Sputter-System Metal-Oxide(PC1)" and "Sputter-System Metal-Nitride(PC3)"). See more in links here and the chart below.

	*[[~~index.php?title=~~Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al sputtering in Sputter System (Lesker)\|Al sputtering in Sputter System (Lesker)]]		*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al sputtering in Sputter System (Lesker)\|Al sputtering in Sputter System (Lesker)]]
	*[[~~index.php?title=~~Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al Sputtering in Cluster Lesker PC3\|Al Sputtering in Sputter-System Metal-Nitride(PC3)]]		*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al Sputtering in Cluster Lesker PC3\|Al Sputtering in Sputter-System Metal-Nitride(PC3)]]
	We also used to have Al sputtering in a system called the Wordentec, so we also have some information on that:		We also used to have Al sputtering in a system called the Wordentec, so we also have some information on that:
	*[[/Sputter rates for Al\|Sputtering of Aluminium in the Wordentec]]		*[[/Sputter rates for Al\|Sputtering of Aluminium in the Wordentec]]