Specific Process Knowledge/Thin film deposition - Revision history

Eves: /* Choose material to deposit */

2025-07-30T17:00:07Z

Choose material to deposit

← Older revision		Revision as of 19:00, 30 July 2025
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	[[/Deposition of Scandium Nitride\| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>		[[/Deposition of Scandium Nitride\| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>
	[[/Deposition of Tungsten Nitride\| Tungsten Nitride (W<sub>x</sub>N<sub>y</sub>)]]<br/>		[[/Deposition of Tungsten Nitride\| Tungsten Nitride (W<sub>x</sub>N<sub>y</sub>)]]<br/>
			[[/Deposition of Tantalum Nitride\| Tantalum Nitride (Ta<sub>x</sub>N<sub>y</sub>)]]<br/>

	\|style="background: #DCDCDC"\|		\|style="background: #DCDCDC"\|

Eves: /* Choose material to deposit */

2025-07-30T16:40:49Z

Choose material to deposit

← Older revision		Revision as of 18:40, 30 July 2025
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	[[/Deposition of Aluminium Nitride\| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>		[[/Deposition of Aluminium Nitride\| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
	[[/Deposition of Scandium Nitride\| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>		[[/Deposition of Scandium Nitride\| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>
			[[/Deposition of Tungsten Nitride\| Tungsten Nitride (W<sub>x</sub>N<sub>y</sub>)]]<br/>

Eves at 16:13, 30 July 2025

2025-07-30T16:13:55Z

← Older revision		Revision as of 18:13, 30 July 2025
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	[[/Sputter deposition of metals and alloys\|FeMn]]<br/>		[[/Sputter deposition of metals and alloys\|FeMn]]<br/>
	[[/Sputter deposition of metals and alloys\|MnIr]]<br/>		[[/Sputter deposition of metals and alloys\|MnIr]]<br/>
	[[/~~Depositionof~~ NbTi\|NbTi]] <br/>		[[/Deposition of NbTi\|NbTi]] <br/>
	[[/Deposition of NiFe\|NiFe]]<br/>		[[/Deposition of NiFe\|NiFe]]<br/>
	[[/Deposition of NiV\|NiV]] alloy <br/>		[[/Deposition of NiV\|NiV]] alloy <br/>

Eves: /* Choose material to deposit */

2025-07-30T15:57:07Z

Choose material to deposit

← Older revision		Revision as of 17:57, 30 July 2025
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	[[/Sputter deposition of metals and alloys\|FeMn]]<br/>		[[/Sputter deposition of metals and alloys\|FeMn]]<br/>
	[[/Sputter deposition of metals and alloys\|MnIr]]<br/>		[[/Sputter deposition of metals and alloys\|MnIr]]<br/>
	[[/~~Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information~~\|NbTi]] <br/>		[[/Depositionof NbTi\|NbTi]] <br/>
	[[/Deposition of NiFe\|NiFe]]<br/>		[[/Deposition of NiFe\|NiFe]]<br/>
	[[/Deposition of NiV\|NiV]] alloy <br/>		[[/Deposition of NiV\|NiV]] alloy <br/>

Eves: /* Choose material to deposit */

2025-07-25T17:10:15Z

Choose material to deposit

← Older revision		Revision as of 19:10, 25 July 2025
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	[[/Deposition of Titanium Nitride\|Titanium Nitride]] - ''conductive ceramics'' <br/>		[[/Deposition of Titanium Nitride\|Titanium Nitride]] - ''conductive ceramics'' <br/>
	[[/Deposition of Niobium Titanium Nitride\| Niobium Titanium Nitride]] - ''superconductors''<br/>		[[/Deposition of Niobium Titanium Nitride\| Niobium Titanium Nitride]] - ''superconductors''<br/>
			[[/Deposition of Niobium Nitride\| Niobium Nitride (NbN)]] - ''superconductors''<br/>
	[[/Deposition of Aluminium Nitride\| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>		[[/Deposition of Aluminium Nitride\| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
	[[/Deposition of Scandium Nitride\| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>		[[/Deposition of Scandium Nitride\| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>

Eves: /* Choose material to deposit */

2025-07-16T20:27:45Z

Choose material to deposit

← Older revision		Revision as of 22:27, 16 July 2025
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	[[/Deposition of NiV\|NiV]] alloy <br/>		[[/Deposition of NiV\|NiV]] alloy <br/>
	[[/Deposition of TiW\|TiW]] alloy (10%/90% by weight) <br/>		[[/Deposition of TiW\|TiW]] alloy (10%/90% by weight) <br/>
			[[/Deposition of MoSi\|MoSi]] alloy (50%/50% by At.%) <br/>

	And an electroceramic:		And an electroceramic:

Reet: /* Choose deposition equipment */

2025-04-11T11:41:30Z

Choose deposition equipment

← Older revision		Revision as of 13:41, 11 April 2025
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	*[[/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) ]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system''		*[[/Cluster-based multi-chamber high vacuum sputtering deposition system\|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) ]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system''
	*[[/Lesker\|Lesker]] - ''Sputter tool''		*[[/Lesker\|Lesker]] - ''Sputter tool''
	*[[/Wordentec\|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
	*[[/thermalevaporator\|Thermal evaporator]]		*[[/thermalevaporator\|Thermal evaporator]]
	*[[/Temescal\|E-Beam Evaporator (Temescal)]]		*[[/Temescal\|E-Beam Evaporator (Temescal)]]

Mmat at 13:48, 12 February 2025

2025-02-12T13:48:22Z

← Older revision		Revision as of 15:48, 12 February 2025
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			{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition click here]'''

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Reet: /* Choose deposition equipment */

2024-08-29T08:43:54Z

Choose deposition equipment

← Older revision		Revision as of 10:43, 29 August 2024
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	\|style="background: LightGray"\|		\|style="background: LightGray"\|
	*[[/PECVD\|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''		*[[/PECVD\|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
	*[[/DiamondCVD\|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''		<!--*[[/DiamondCVD\|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''-->
	\|style="background: #DCDCDC"\|		\|style="background: #DCDCDC"\|
	*[[/ALD Picosun R200\|ALD1]] - Atomic Layer Deposition (thermal)		*[[/ALD Picosun R200\|ALD1]] - Atomic Layer Deposition (thermal)

Reet: /* Choose material to deposit */

2024-08-29T08:41:35Z

Choose material to deposit

← Older revision		Revision as of 10:41, 29 August 2024
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	[[/Deposition of Silicon\|Silicon]] <br/>		[[/Deposition of Silicon\|Silicon]] <br/>
	[[/Deposition of Germanium\|Germanium]] <br/>		[[/Deposition of Germanium\|Germanium]] <br/>
	~~[[/DiamondCVD\|Diamond]] <br/>~~

	\|style="background: #DCDCDC"\|		\|style="background: #DCDCDC"\|

← Older revision		Revision as of 19:00, 30 July 2025
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	[[/Deposition of Scandium Nitride\| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>		[[/Deposition of Scandium Nitride\| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>
	[[/Deposition of Tungsten Nitride\| Tungsten Nitride (W<sub>x</sub>N<sub>y</sub>)]]<br/>		[[/Deposition of Tungsten Nitride\| Tungsten Nitride (W<sub>x</sub>N<sub>y</sub>)]]<br/>
			[[/Deposition of Tantalum Nitride\| Tantalum Nitride (Ta<sub>x</sub>N<sub>y</sub>)]]<br/>

	\|style="background: #DCDCDC"\|		\|style="background: #DCDCDC"\|

← Older revision		Revision as of 18:40, 30 July 2025
Line 43:		Line 43:
	[[/Deposition of Aluminium Nitride\| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>		[[/Deposition of Aluminium Nitride\| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
	[[/Deposition of Scandium Nitride\| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>		[[/Deposition of Scandium Nitride\| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>
			[[/Deposition of Tungsten Nitride\| Tungsten Nitride (W<sub>x</sub>N<sub>y</sub>)]]<br/>

← Older revision		Revision as of 18:13, 30 July 2025
Line 80:		Line 80:
	[[/Sputter deposition of metals and alloys\|FeMn]]<br/>		[[/Sputter deposition of metals and alloys\|FeMn]]<br/>
	[[/Sputter deposition of metals and alloys\|MnIr]]<br/>		[[/Sputter deposition of metals and alloys\|MnIr]]<br/>
	[[/~~Depositionof~~ NbTi\|NbTi]] <br/>		[[/Deposition of NbTi\|NbTi]] <br/>
	[[/Deposition of NiFe\|NiFe]]<br/>		[[/Deposition of NiFe\|NiFe]]<br/>
	[[/Deposition of NiV\|NiV]] alloy <br/>		[[/Deposition of NiV\|NiV]] alloy <br/>

← Older revision		Revision as of 17:57, 30 July 2025
Line 80:		Line 80:
	[[/Sputter deposition of metals and alloys\|FeMn]]<br/>		[[/Sputter deposition of metals and alloys\|FeMn]]<br/>
	[[/Sputter deposition of metals and alloys\|MnIr]]<br/>		[[/Sputter deposition of metals and alloys\|MnIr]]<br/>
	[[/~~Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information~~\|NbTi]] <br/>		[[/Depositionof NbTi\|NbTi]] <br/>
	[[/Deposition of NiFe\|NiFe]]<br/>		[[/Deposition of NiFe\|NiFe]]<br/>
	[[/Deposition of NiV\|NiV]] alloy <br/>		[[/Deposition of NiV\|NiV]] alloy <br/>

← Older revision		Revision as of 19:10, 25 July 2025
Line 40:		Line 40:
	[[/Deposition of Titanium Nitride\|Titanium Nitride]] - ''conductive ceramics'' <br/>		[[/Deposition of Titanium Nitride\|Titanium Nitride]] - ''conductive ceramics'' <br/>
	[[/Deposition of Niobium Titanium Nitride\| Niobium Titanium Nitride]] - ''superconductors''<br/>		[[/Deposition of Niobium Titanium Nitride\| Niobium Titanium Nitride]] - ''superconductors''<br/>
			[[/Deposition of Niobium Nitride\| Niobium Nitride (NbN)]] - ''superconductors''<br/>
	[[/Deposition of Aluminium Nitride\| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>		[[/Deposition of Aluminium Nitride\| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
	[[/Deposition of Scandium Nitride\| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>		[[/Deposition of Scandium Nitride\| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>