Specific Process Knowledge/Thermal Process/Resist Pyrolysis Furnace - Revision history

Pevo at 12:08, 6 February 2023

2023-02-06T12:08:42Z

← Older revision		Revision as of 14:08, 6 February 2023
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	'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Resist_Pyrolysis_Furnace click here]'''		'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Resist_Pyrolysis_Furnace click here]'''

			''This page is written by DTU Nanolab internal''

	===<span style="color:Red">EXPIRED!		===<span style="color:Red">EXPIRED!

Pevo: /* EXPIRED!!! The Resist Pyrolysis furnace has been removed from the cleanroom August 2019. Use the Multipurpose Anneal furnace instead. */

2021-10-05T08:16:06Z

EXPIRED!!! The Resist Pyrolysis furnace has been removed from the cleanroom August 2019. Use the Multipurpose Anneal furnace instead.

← Older revision		Revision as of 10:16, 5 October 2021
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	===<span style="color:Red">EXPIRED!!! The Resist Pyrolysis furnace has been removed from the cleanroom August 2019. Use the Multipurpose Anneal furnace instead.</span>===		===<span style="color:Red">EXPIRED!
			The Resist Pyrolysis furnace has been removed from the cleanroom August 2019. Use the Multipurpose Anneal furnace instead.</span>===


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	[[Category: Thermal process\|Resist Pyrolysis]]		[[Category: Thermal process\|Resist Pyrolysis]]
	[[Category: Furnaces\|Resist Pyrolysis]]		[[Category: Furnaces\|Resist Pyrolysis]]


	== Resist Pyrolysis Furnace ==		== Resist Pyrolysis Furnace ==

Pevo at 07:22, 8 August 2019

2019-08-08T07:22:53Z

← Older revision		Revision as of 09:22, 8 August 2019
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	'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Resist_Pyrolysis_Furnace click here]'''		'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Resist_Pyrolysis_Furnace click here]'''


			===<span style="color:Red">EXPIRED!!! The Resist Pyrolysis furnace has been removed from the cleanroom August 2019. Use the Multipurpose Anneal furnace instead.</span>===


	[[Category: Equipment \|Thermal Resist Pyrolysis]]		[[Category: Equipment \|Thermal Resist Pyrolysis]]
	[[Category: Thermal process\|Resist Pyrolysis]]		[[Category: Thermal process\|Resist Pyrolysis]]
	[[Category: Furnaces\|Resist Pyrolysis]]		[[Category: Furnaces\|Resist Pyrolysis]]


	== Resist Pyrolysis Furnace ==		== Resist Pyrolysis Furnace ==

Pevo: /* Equipment performance and process related parameters */

2017-06-26T10:57:53Z

Equipment performance and process related parameters

← Older revision		Revision as of 12:57, 26 June 2017
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	\|style="background:LightGrey; color:black"\|Temperature		\|style="background:LightGrey; color:black"\|Temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*0-1000 <sup>o</sup>C		*Max 1000 <sup>o</sup>C
	*Temperature ramp-up rate: Max 10 <sup>o</sup>C/min		*Temperature ramp-up rate: Max 10 <sup>o</sup>C/min
	*Temperature ramp-down rate: Relative slow (depending on the furnace temperature)		*Temperature ramp-down rate: Relative slow (depending on the furnace temperature)
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	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*N<sub>2</sub>		*N<sub>2</sub>
	*H<sub>2</sub>
	*O<sub>2</sub>
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Vacuum		\|style="background:LightGrey; color:black"\|Vacuum

Pevo: /* Equipment performance and process related parameters */

2017-06-26T10:56:51Z

Equipment performance and process related parameters

← Older revision		Revision as of 12:56, 26 June 2017
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	\|style="background:LightGrey; color:black"\|Vacuum		\|style="background:LightGrey; color:black"\|Vacuum
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~Yes, but using N<sub>2</sub> and O<sub>2</sub> process gasses~~		*No
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Nitrogen flows		\|style="background:LightGrey; color:black"\|Nitrogen flows

Pevo: /* Resist Pyrolysis Furnace */

2017-06-26T10:54:55Z

Resist Pyrolysis Furnace

← Older revision		Revision as of 12:54, 26 June 2017
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	If oxygen from the air or from outgassing of the resist is present in the furnace, the resist layer will be removed. Thus, for each process it is important to include a step with a high nitrogen flow at a lower temperature, before a high temperature for resist pyrolysis is obtained. Pyrolysis of a large amount of resist may also be a problem due to resist outgassing.		If oxygen from the air or from outgassing of the resist is present in the furnace, the resist layer will be removed. Thus, for each process it is important to include a step with a high nitrogen flow at a lower temperature, before a high temperature for resist pyrolysis is obtained. Pyrolysis of a large amount of resist may also be a problem due to resist outgassing.

	During processing the furnace is rapidly heated by use of six long heating lamps situated around the furnace tube, and ~~cooling~~ is done (rather slowly) by use of cooling fans. The furnace is purged with a controlable nitrogen flow. There is no vacuum on the furnace.		During processing the furnace is rapidly heated by use of six long heating lamps situated around the furnace tube. The furnace is not heated in the ends, and this affects the temperature uniformity in the furnace. Cooling is done (rather slowly) by use of cooling fans.

			The furnace is purged with a controlable nitrogen flow.

			There is no vacuum on the furnace.


	'''The user manual, user APV and contact information can be found in LabManager:'''		'''The user manual, user APV and contact information can be found in LabManager:'''

Pevo: /* Equipment performance and process related parameters */

2017-06-26T10:08:19Z

Equipment performance and process related parameters

← Older revision		Revision as of 12:08, 26 June 2017
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	\|style="background:LightGrey; color:black"\|Temperature		\|style="background:LightGrey; color:black"\|Temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*0-~~1100~~ <sup>o</sup>C		*0-1000 <sup>o</sup>C
	*Temperature ramp-up rate: Max 10 <sup>o</sup>C/min		*Temperature ramp-up rate: Max 10 <sup>o</sup>C/min
	*Temperature ramp-down rate: Relative slow (depending on the furnace temperature)		*Temperature ramp-down rate: Relative slow (depending on the furnace temperature)
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	\|style="background:LightGrey; color:black"\|Batch size		\|style="background:LightGrey; color:black"\|Batch size
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*1-25 50 mm wafers (placed on a Si ~~support~~ wafers)		*1-4 50 mm wafers (placed on Si carrier wafers)
	*1-25 100 mm wafers		*1-5 100 mm wafers (place on Si carrier wafers or in a horizontal wafer boat)
	*1-25 150 mm wafers
	*Several smaller samples if these are placed on a support wafer		*Several smaller samples if these are placed on a support wafer
	\|-		\|-
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	*AZ resist (prebaked)		*AZ resist (prebaked)
	*SU-8 (prebaked)		*SU-8 (prebaked)
			*Other resist - Permission required
	\|-		\|-
	\|}		\|}

Pevo: /* Equipment performance and process related parameters */

2017-06-26T10:04:58Z

Equipment performance and process related parameters

← Older revision		Revision as of 12:04, 26 June 2017
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	!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment		!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment
	\|style="background:WhiteSmoke; color:black"\|<b>~~ATV~~</b>		\|style="background:WhiteSmoke; color:black"\|<b>Reist Pyrolysis Furnace</b>
	\|-		\|-
	!style="background:silver; color:black;" align="center"\|Purpose		!style="background:silver; color:black;" align="center"\|Purpose
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	\|style="background:LightGrey; color:black"\|Process gasses		\|style="background:LightGrey; color:black"\|Process gasses
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*N2		*N<sub>2</sub>
	*H2		*H<sub>2</sub>
	*O2		*O<sub>2</sub>
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Vacuum		\|style="background:LightGrey; color:black"\|Vacuum
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Yes, but using N2 and O2 process gasses		*Yes, but using N<sub>2</sub> and O<sub>2</sub> process gasses
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Nitrogen flows		\|style="background:LightGrey; color:black"\|Nitrogen flows
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	\|style="background:LightGrey; color:black"\|Batch size		\|style="background:LightGrey; color:black"\|Batch size
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~One~~-25 50 mm wafers (placed on a Si support wafers)		*1-25 50 mm wafers (placed on a Si support wafers)
	*~~One~~-25 100 mm wafers		*1-25 100 mm wafers
	*~~On2~~-25 150 mm wafers		*1-25 150 mm wafers
	*Several smaller samples if these are placed on a support wafer		*Several smaller samples if these are placed on a support wafer
	\|-		\|-

Pevo: /* Equipment performance and process related parameters */

2015-05-11T11:19:26Z

Equipment performance and process related parameters

← Older revision		Revision as of 13:19, 11 May 2015
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	*Pyrolysis of different resist layers to form conductive structures		*Pyrolysis of different resist layers to form conductive structures
	\|-		\|-
	!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Process parameter range		!style="background:silver; color:black" align="center" valign="center" rowspan="4"\|Process parameter range
	\|style="background:LightGrey; color:black"\|Temperature		\|style="background:LightGrey; color:black"\|Temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
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	*Temperature ramp-up rate: Max 10 <sup>o</sup>C/min		*Temperature ramp-up rate: Max 10 <sup>o</sup>C/min
	*Temperature ramp-down rate: Relative slow (depending on the furnace temperature)		*Temperature ramp-down rate: Relative slow (depending on the furnace temperature)
			\|-
			\|style="background:LightGrey; color:black"\|Process gasses
			\|style="background:WhiteSmoke; color:black"\|
			*N2
			*H2
			*O2
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Vacuum		\|style="background:LightGrey; color:black"\|Vacuum

Pevo at 11:17, 11 May 2015

2015-05-11T11:17:10Z

← Older revision		Revision as of 13:17, 11 May 2015
Line 28:		Line 28:

	!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment		!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment
	\|style="background:WhiteSmoke; color:black"\|<b>~~Resist Pyrolysis Furnace~~</b>		\|style="background:WhiteSmoke; color:black"\|<b>ATV</b>
	\|-		\|-
	!style="background:silver; color:black;" align="center"\|Purpose		!style="background:silver; color:black;" align="center"\|Purpose
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	*Pyrolysis of different resist layers to form conductive structures		*Pyrolysis of different resist layers to form conductive structures
	\|-		\|-
	!style="background:silver; color:black" align="center" valign="center" rowspan="2"\|Process parameter range		!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Process parameter range
	\|style="background:LightGrey; color:black"\|Temperature		\|style="background:LightGrey; color:black"\|Temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*0-~~1000~~ <sup>o</sup>C		*0-1100 <sup>o</sup>C
	*Temperature ramp-up rate: Max 10 <sup>o</sup>C/min		*Temperature ramp-up rate: Max 10 <sup>o</sup>C/min
	*Temperature ramp-down rate: Relative slow (depending on the furnace temperature)		*Temperature ramp-down rate: Relative slow (depending on the furnace temperature)
			\|-
			\|style="background:LightGrey; color:black"\|Vacuum
			\|style="background:WhiteSmoke; color:black"\|
			*Yes, but using N2 and O2 process gasses
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Nitrogen flows		\|style="background:LightGrey; color:black"\|Nitrogen flows
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	\|style="background:LightGrey; color:black"\|Batch size		\|style="background:LightGrey; color:black"\|Batch size
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Several small samples (placed on a Si support wafers)		*One-25 50 mm wafers (placed on a Si support wafers)
	*One-~~six~~ 50 mm wafers (placed on a Si support wafers)		*One-25 100 mm wafers
	*One-~~six~~ 100 mm wafers		*On2-25 150 mm wafers
			*Several smaller samples if these are placed on a support wafer
	\|-		\|-
	\| style="background:LightGrey; color:black"\|Allowed materials		\| style="background:LightGrey; color:black"\|Allowed materials