Specific Process Knowledge/Thermal Process/Jipelec RTP - Revision history

Mmat at 12:40, 4 June 2025

2025-06-04T12:40:33Z

← Older revision		Revision as of 14:40, 4 June 2025
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			{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Jipelec_RTP click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Jipelec_RTP click here]'''

	~~''This page is written by DTU Nanolab internal''~~

	==<~~span~~ style="color:~~Red~~">~~EXPIRED.~~ The Jipelec RTP ~~has~~ has been ~~removed from the cleanroom~~ in March 2023. It has been replaced with the Jipelec RTP2 ~~that can be used instead~~.</span>==		'''<p style="color:red;"> The Jipelec RTP has been decomissioned in March 2023. It has been replaced with the Jipelec RTP2.</span>'''


	[[Category: Equipment \|Thermal Jipelec]]		[[Category: Equipment \|Thermal Jipelec]]

Pevo at 11:58, 17 April 2023

2023-04-17T11:58:21Z

← Older revision		Revision as of 13:58, 17 April 2023
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	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Jipelec_RTP click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Jipelec_RTP click here]'''

	''This page is written by DTU Nanolab internal''		''This page is written by DTU Nanolab internal''

			==<span style="color:Red">EXPIRED. The Jipelec RTP has has been removed from the cleanroom in March 2023. It has been replaced with the Jipelec RTP2 that can be used instead.</span>==

	[[Category: Equipment \|Thermal Jipelec]]		[[Category: Equipment \|Thermal Jipelec]]

Paphol at 10:30, 2 February 2023

2023-02-02T10:30:07Z

← Older revision		Revision as of 12:30, 2 February 2023
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	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Jipelec_RTP click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Jipelec_RTP click here]'''

			''This page is written by DTU Nanolab internal''

	[[Category: Equipment \|Thermal Jipelec]]		[[Category: Equipment \|Thermal Jipelec]]
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	==Jipelec - Rapid Thermal Processing==		==Jipelec - Rapid Thermal Processing==

	[[Image:RTP_oven.jpg\|300x300px\|thumb\|Jipelec RTP: Positioned in cleanroom A-4]]		[[Image:RTP_oven.jpg\|300x300px\|thumb\|Jipelec RTP: Positioned in cleanroom A-4/ Photo: DTU Nanolab internal]]

	The Jipelec is a rapid thermal processing (RTP) oven. It is be used for fast and well-controlled annealing or alloying of samples. It is possible to use either a thermocouple or a pyrometer to control the temperature (of the sample carrier).		The Jipelec is a rapid thermal processing (RTP) oven. It is be used for fast and well-controlled annealing or alloying of samples. It is possible to use either a thermocouple or a pyrometer to control the temperature (of the sample carrier).

Pevo: /* Overview of the performance of the Jipelec RTP and some process related parameters */

2021-10-05T08:12:49Z

Overview of the performance of the Jipelec RTP and some process related parameters

← Older revision		Revision as of 10:12, 5 October 2021
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	\|style="background:LightGrey; color:black"\|Process Temperature		\|style="background:LightGrey; color:black"\|Process Temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*0-1100 <sup>o</sup>C		*0-1100 <sup>o</sup>C (only short time a the high temperatures - see the user manual)
	*III-V materials only to 450 <sup>o</sup>C		*III-V materials only to 450 <sup>o</sup>C
	*Temperature ramp up to ~~300~~ <sup>o</sup>C/min		*Temperature ramp up to 50 <sup>o</sup>C/min

	\|-		\|-
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	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*One 50 mm or 100 mm wafer		*One 50 mm or 100 mm wafer
	*Small samples (placed on a carbide carrier or a Si carrier wafer with 1 µm oxide)		*Small samples (placed on a carbide carrier or a Si carrier wafer with 1 µm oxide on the back)
	\|-		\|-
	\| style="background:LightGrey; color:black"\|Substrate materials allowed		\| style="background:LightGrey; color:black"\|Substrate materials allowed
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|

	A carrier is always needed: For III-V materials a carbide carrier is used, and for other samples a silicon carrier wafer with 1 µm oxide is used		A carrier is always needed: For III-V materials and metals a carbide carrier is used, and for other samples a silicon carrier wafer with 1 µm oxide is used
	*Silicon		*Silicon
	*Silicon oxide		*Silicon oxide
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	*Polysilicon		*Polysilicon
	*III-V materials (on graphite carrier, max 450 <sup>o</sup>C)		*III-V materials (on graphite carrier, max 450 <sup>o</sup>C)
	*Some metals - Ask the Thin Film group for permission		*Some metals - (on graphite carrier). Ask the Thin Film group for permission
	\|-		\|-
	\|}		\|}

Pevo: /* Overview of the performance of the Jipelec RTP and some process related parameters */

2019-04-01T08:19:50Z

Overview of the performance of the Jipelec RTP and some process related parameters

← Older revision		Revision as of 10:19, 1 April 2019
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	\|style="background:LightGrey; color:black"\|Process Temperature		\|style="background:LightGrey; color:black"\|Process Temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*0-~~1000~~ <sup>o</sup>C		*0-1100 <sup>o</sup>C
	*III-V materials only to 450 <sup>o</sup>C		*III-V materials only to 450 <sup>o</sup>C
	*Temperature ramp up to 300 <sup>o</sup>C/min		*Temperature ramp up to 300 <sup>o</sup>C/min
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	*Vacuum		*Vacuum
	\|-		\|-
	\|style="background:LightGrey; color:black"\|~~Gasses~~ on the system		\|style="background:LightGrey; color:black"\|Gases on the system
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|

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	\|style="background:LightGrey; color:black"\|Batch size		\|style="background:LightGrey; color:black"\|Batch size
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*One 100 mm wafer ~~(or 50 wafer) per run~~		*One 50 mm or 100 mm wafer
	*Small samples (placed on a carbide carrier or a Si carrier wafer with 1 µm oxide)		*Small samples (placed on a carbide carrier or a Si carrier wafer with 1 µm oxide)
	\|-		\|-
	\| style="background:LightGrey; color:black"\|Substrate ~~material~~ allowed		\| style="background:LightGrey; color:black"\|Substrate materials allowed
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|

	A silicon carrier wafer with 1 µm oxide is ~~always need (except for III-V materials)~~		A carrier is always needed: For III-V materials a carbide carrier is used, and for other samples a silicon carrier wafer with 1 µm oxide is used
	*Silicon		*Silicon
	*Silicon ~~oxides~~		*Silicon oxide
	*Silicon ~~nitrides~~		*Silicon nitride
	*~~Quartz~~		*Fused silica/quartz
	*Polysilicon		*Polysilicon
	*Titan		*III-V materials (on graphite carrier, max 450 <sup>o</sup>C)
	*III-V materials (on graphite carrier)		*Some metals - Ask the Thin Film group for permission
	*~~Silicon wafers (new from the box or RCA cleaned)~~
	*In doubt: look at [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=164 the cross contamination chart] or send a mail to [mailto:furnace@danchip.dtu.dk the ~~Furnace~~ group].
	\|-		\|-
	\|}		\|}

Mdyma: /* Overview of the performance of the Jipelec RTP and some process related parameters */

2016-11-14T10:31:38Z

Overview of the performance of the Jipelec RTP and some process related parameters

← Older revision		Revision as of 12:31, 14 November 2016
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	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*0-1000 <sup>o</sup>C		*0-1000 <sup>o</sup>C
			*III-V materials only to 450 <sup>o</sup>C
	*Temperature ramp up to 300 <sup>o</sup>C/min		*Temperature ramp up to 300 <sup>o</sup>C/min

	\|-		\|-
	\|style="background:LightGrey; color:black"\|Process pressure		\|style="background:LightGrey; color:black"\|Process pressure

Mdyma: /* Overview of the performance of the Jipelec RTP and some process related parameters */

2016-11-14T10:21:24Z

Overview of the performance of the Jipelec RTP and some process related parameters

← Older revision		Revision as of 12:21, 14 November 2016
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	*III-V materials (on graphite carrier)		*III-V materials (on graphite carrier)
	*Silicon wafers (new from the box or RCA cleaned)		*Silicon wafers (new from the box or RCA cleaned)
	*In doubt: look at [http://~~www.~~labmanager~~.danchip~~.dtu.dk/~~view_binary~~.php?~~fileId~~=~~1250~~ the cross contamination chart] or send a mail to [mailto:furnace@danchip.dtu.dk the Furnace group].		*In doubt: look at [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=164 the cross contamination chart] or send a mail to [mailto:furnace@danchip.dtu.dk the Furnace group].
	\|-		\|-
	\|}		\|}

Bghe at 13:39, 25 August 2014

2014-08-25T13:39:24Z

← Older revision		Revision as of 15:39, 25 August 2014
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	'''Feedback to this page''': '''[mailto:~~thinfilm~~@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Jipelec_RTP click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Jipelec_RTP click here]'''

	[[Category: Equipment \|~~Furnace~~]]		[[Category: Equipment \|Thermal Jipelec]]
	[[Category: Thermal process\|~~Furnace~~]]		[[Category: Thermal process\|Jipelec]]

	==Jipelec - Rapid Thermal Processing==		==Jipelec - Rapid Thermal Processing==

Bghe at 12:43, 25 August 2014

2014-08-25T12:43:45Z

← Older revision		Revision as of 14:43, 25 August 2014
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	[[Category: Equipment \|Furnace]]		[[Category: Equipment \|Furnace]]
	[[Category: Thermal process\|Furnace]]		[[Category: Thermal process\|Furnace]]
	~~[[Category: Furnaces\|Jipelec]]~~

	==Jipelec - Rapid Thermal Processing==		==Jipelec - Rapid Thermal Processing==

Bghe at 12:35, 25 August 2014

2014-08-25T12:35:21Z

← Older revision		Revision as of 14:35, 25 August 2014
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	'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Jipelec_RTP click here]'''		'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Jipelec_RTP click here]'''

			[[Category: Equipment \|Furnace]]
			[[Category: Thermal process\|Furnace]]
			[[Category: Furnaces\|Jipelec]]

	==Jipelec - Rapid Thermal Processing==		==Jipelec - Rapid Thermal Processing==