Specific Process Knowledge/Polymer Processing/Polymer Processing/Coating/Parylene Coater - Revision history

Meenadh: /* Graph: Thickness vs Parylene C weight(grams) + 250uL Silane A 174 */

2026-08-11T09:32:00Z

Graph: Thickness vs Parylene C weight(grams) + 250uL Silane A 174

← Older revision		Revision as of 11:32, 11 August 2026
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	* Parylene F: Fluorinated backbone, excellent UV and thermal stability, low coefficient of friction		* Parylene F: Fluorinated backbone, excellent UV and thermal stability, low coefficient of friction

	=== Graph: Thickness vs Parylene C weight(grams) + 250uL Silane A 174 ===		=== Graph: Thickness vs Parylene C weight(grams) + 250uL Silane A 174(adhesion promotor) ===


	[[File:Top holder position.jpg\|400px\|left]]		[[File:Top holder position.jpg\|400px\|left]]

	[[File:Middle holder position.jpg\|400px\|center]]		[[File:Middle holder position.jpg\|400px\|center]]
	[[File:Bottom holder position.jpg\|400px\|~~right~~]]
			[[File:Bottom holder position.jpg\|400px\|left]]

Meenadh at 09:30, 11 August 2026

2026-08-11T09:30:57Z

← Older revision		Revision as of 11:30, 11 August 2026
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	* Parylene F: Fluorinated backbone, excellent UV and thermal stability, low coefficient of friction		* Parylene F: Fluorinated backbone, excellent UV and thermal stability, low coefficient of friction

	=== Graph: Thickness vs Parylene C weight ===		=== Graph: Thickness vs Parylene C weight(grams) + 250uL Silane A 174 ===


			[[File:Top holder position.jpg\|400px\|left]]
			[[File:Middle holder position.jpg\|400px\|center]]
			[[File:Bottom holder position.jpg\|400px\|right]]

Meenadh at 08:12, 29 July 2026

2026-07-29T08:12:13Z

← Older revision		Revision as of 10:12, 29 July 2026
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	A parylene coater is the integrated CVD system — vaporiser, pyrolysis furnace, deposition chamber, cold trap, and vacuum system — used to run this process.		A parylene coater is the integrated CVD system — vaporiser, pyrolysis furnace, deposition chamber, cold trap, and vacuum system — used to run this process.

	~~In PolyFabLab, we have the~~ Diener Parylene P6 system and ~~currently allowed~~ dimer is Parylene C.		The '''Diener Parylene P6''' system in PolyFabLab is configured to process multiple parylene types, including '''Parylene C, N, D, and F'''. However, '''Parylene C''' is the only dimer provided as a standard material by DTU Nanolab. The P6 system is compatible with Parylene N, C, D, and F-type dimers.

			Users wishing to deposit '''Parylene N, D, or F''' must first obtain '''chemistry/process approval''' from the '''Safety Coordinator (Majken Becker)'''. Following this approval, the proposed process must be discussed with the '''lab/equipment responsible person (Meena Dhankhar)''' before use.

			Please note that '''Parylene N, D, and F dimers are not stocked by DTU Nanolab'''. Users are responsible for purchasing and supplying these materials themselves.

	===Chemistry in Brief===		===Chemistry in Brief===

Meenadh: /* Workinh Principle */

2026-07-10T12:22:32Z

Workinh Principle

← Older revision		Revision as of 14:22, 10 July 2026
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	===Chemistry in Brief===		===Chemistry in Brief===
	The precursor for each parylene type is a cyclic dimer of the corresponding p-xylylene unit (di-para-xylylene, “DPX,” for Parylene N; the chlorinated dimer for Parylene C; and so on). Heating this solid dimer under vacuum sublimes it directly to a vapour without melting. Pyrolysis at high temperature homolytically cleaves the dimer's two methylene–methylene bonds, producing a pair of reactive p-xylylene monomers (diradicals). These monomers do not react with each other in the gas phase because the chamber is kept at low or room temperature and dilute; instead, they diffuse to any surface at or near room temperature, adsorb, and rapidly propagate into a linear, high-molecular-weight polymer directly on that surface. There is no solvent, no initiator, and no exotherm large enough to damage typical substrates — polymerisation is driven by the radical reactivity of the monomer itself, not by added chemistry. Because polymerisation happens directly on the substrate surface rather than in solution, the resulting film has very high molecular weight, high crystallinity (grade-dependent), and essentially no seams, pinholes, or coating-induced stress from solvent evaporation or shrinkage, which is the root reason parylene outperforms liquid coatings as a barrier film.		The precursor for each parylene type is a cyclic dimer of the corresponding p-xylylene unit (di-para-xylylene, “DPX,” for Parylene N; the chlorinated dimer for Parylene C; and so on). Heating this solid dimer under vacuum sublimes it directly to a vapour without melting. Pyrolysis at high temperature homolytically cleaves the dimer's two methylene–methylene bonds, producing a pair of reactive p-xylylene monomers (diradicals). These monomers do not react with each other in the gas phase because the chamber is kept at low or room temperature and dilute; instead, they diffuse to any surface at or near room temperature, adsorb, and rapidly propagate into a linear, high-molecular-weight polymer directly on that surface. There is no solvent, no initiator, and no exotherm large enough to damage typical substrates — polymerisation is driven by the radical reactivity of the monomer itself, not by added chemistry. Because polymerisation happens directly on the substrate surface rather than in solution, the resulting film has very high molecular weight, high crystallinity (grade-dependent), and essentially no seams, pinholes, or coating-induced stress from solvent evaporation or shrinkage, which is the root reason parylene outperforms liquid coatings as a barrier film.
	=== ~~Workinh~~ Principle ===		=== Working Principle ===
	The Parylene deposition process consists of four main stages:		The Parylene deposition process consists of four main stages:

Meenadh at 12:22, 10 July 2026

2026-07-10T12:22:01Z

@@ Line 15: / Line 15: @@
 ===Chemistry in Brief===
 The precursor for each parylene type is a cyclic dimer of the corresponding p-xylylene unit (di-para-xylylene, “DPX,” for Parylene N; the chlorinated dimer for Parylene C; and so on). Heating this solid dimer under vacuum sublimes it directly to a vapour without melting. Pyrolysis at high temperature homolytically cleaves the dimer's two methylene–methylene bonds, producing a pair of reactive p-xylylene monomers (diradicals). These monomers do not react with each other in the gas phase because the chamber is kept at low or room temperature and dilute; instead, they diffuse to any surface at or near room temperature, adsorb, and rapidly propagate into a linear, high-molecular-weight polymer directly on that surface. There is no solvent, no initiator, and no exotherm large enough to damage typical substrates — polymerisation is driven by the radical reactivity of the monomer itself, not by added chemistry. Because polymerisation happens directly on the substrate surface rather than in solution, the resulting film has very high molecular weight, high crystallinity (grade-dependent), and essentially no seams, pinholes, or coating-induced stress from solvent evaporation or shrinkage, which is the root reason parylene outperforms liquid coatings as a barrier film.
-=== Deposition Process ===
+=== Workinh Principle ===
 The Parylene deposition process consists of four main stages:
@@ Line 23: / Line 23: @@
 # '''Cold Trap(≈−90°C):''' Residual monomer and by-products are captured in a cryo-cooled cold trap before reaching the vacuum pump.
 Because deposition occurs at room temperature and is driven by surface adsorption rather than line-of-sight, film thickness builds uniformly on all surfaces — top, bottom, sidewalls, and internal cavities — with minimal masking needed beyond areas that must remain coating-free.
 === Types of Parylene ===
@@ Line 31: / Line 47: @@
 * Parylene D: Higher thermal stability than C, slightly less conformal, Used for applications needing high-temp survival
 * Parylene F: Fluorinated backbone, excellent UV and thermal stability, low coefficient of friction

Meenadh at 12:03, 10 July 2026

2026-07-10T12:03:36Z

← Older revision		Revision as of 14:03, 10 July 2026
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	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Polymer_Processing/Polymer_Processing_Coating_Parylene_Coater click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Polymer_Processing/Polymer_Processing_Coating_Parylene_Coater click here]'''

			[[File:parylene C.jpeg\|400px\|right]]

	__TOC__		__TOC__

Meenadh at 12:02, 10 July 2026

2026-07-10T12:02:05Z

@@ Line 27: / Line 27: @@
 Several parylene variants are available, differing in precursor chemistry and resulting film properties:
-* Parylene C : Most widely used, Low per
+* Parylene C: Most widely used, Low permeability to moisture/gases, good barrier properties
+* Parylene N: Highest dielectric strength, no chlorine, better step coverage into fine gaps
-{| class="wikitable"
+* Parylene D: Higher thermal stability than C, slightly less conformal, Used for applications needing high-temp survival
-|'''Type'''
+* Parylene F: Fluorinated backbone, excellent UV and thermal stability, low coefficient of friction

Meenadh at 10:06, 10 July 2026

2026-07-10T10:06:34Z

← Older revision		Revision as of 12:06, 10 July 2026
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	=== Types of Parylene ===		=== Types of Parylene ===
	Several parylene variants are available, differing in precursor chemistry and resulting film properties:		Several parylene variants are available, differing in precursor chemistry and resulting film properties:

			* Parylene C : Most widely used, Low per

	{\| class="wikitable"		{\| class="wikitable"
	\|'''Type'''		\|'''Type'''

Meenadh at 12:56, 9 July 2026

2026-07-09T12:56:09Z

← Older revision		Revision as of 14:56, 9 July 2026
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	__TOC__		__TOC__

	Parylene is the common name for a family of poly(p-xylylene) polymers deposited as thin, conformal films by chemical vapour deposition (CVD). Unlike liquid coatings (spray, dip, spin), parylene is deposited from the vapour phase with no solvent, catalyst, or curing step. This gives pinhole-free, uniform-thickness films on virtually any geometry, including sharp edges, crevices, and fine features that liquid coatings cannot reach evenly.		'''Parylene''' is the common name for a family of poly(p-xylylene) polymers deposited as thin, conformal films by chemical vapour deposition (CVD). Unlike liquid coatings (spray, dip, spin), parylene is deposited from the vapour phase with no solvent, catalyst, or curing step. This gives pinhole-free, uniform-thickness films on virtually any geometry, including sharp edges, crevices, and fine features that liquid coatings cannot reach evenly.

	A parylene coater is the integrated CVD system — vaporiser, pyrolysis furnace, deposition chamber, cold trap, and vacuum system — used to run this process.		A parylene coater is the integrated CVD system — vaporiser, pyrolysis furnace, deposition chamber, cold trap, and vacuum system — used to run this process.

Meenadh at 12:54, 9 July 2026

2026-07-09T12:54:30Z

@@ Line 10: / Line 10: @@
 A parylene coater is the integrated CVD system — vaporiser, pyrolysis furnace, deposition chamber, cold trap, and vacuum system — used to run this process.
 ===Chemistry in Brief===
-The precursor for each parylene type is a cyclic dimer of the corresponding p-xylylene unit (di-para-xylylene, “DPX,” for Parylene N; the chlorinated dimer for Parylene C; and so on). Heating this solid dimer under vacuum sublimes it directly to a vapour without melting. Pyrolysis at high temperature homolytically cleaves the dimer's two methylene–methylene bonds, producing a pair of reactive p-xylylene monomers (diradicals). These monomers do not react with each other in the gas phase because the chamber is kept cold and dilute; instead, they diffuse to any surface at or near room temperature, adsorb, and rapidly propagate into a linear, high-molecular-weight polymer directly on that surface. There is no solvent, no initiator, and no exotherm large enough to damage typical substrates — polymerisation is driven by the radical reactivity of the monomer itself, not by added chemistry.
+The precursor for each parylene type is a cyclic dimer of the corresponding p-xylylene unit (di-para-xylylene, “DPX,” for Parylene N; the chlorinated dimer for Parylene C; and so on). Heating this solid dimer under vacuum sublimes it directly to a vapour without melting. Pyrolysis at high temperature homolytically cleaves the dimer's two methylene–methylene bonds, producing a pair of reactive p-xylylene monomers (diradicals). These monomers do not react with each other in the gas phase because the chamber is kept at low or room temperature and dilute; instead, they diffuse to any surface at or near room temperature, adsorb, and rapidly propagate into a linear, high-molecular-weight polymer directly on that surface. There is no solvent, no initiator, and no exotherm large enough to damage typical substrates — polymerisation is driven by the radical reactivity of the monomer itself, not by added chemistry. Because polymerisation happens directly on the substrate surface rather than in solution, the resulting film has very high molecular weight, high crystallinity (grade-dependent), and essentially no seams, pinholes, or coating-induced stress from solvent evaporation or shrinkage, which is the root reason parylene outperforms liquid coatings as a barrier film.
-Because polymerisation happens directly on the substrate surface rather than in solution, the resulting film has very high molecular weight, high crystallinity (grade-dependent), and essentially no seams, pinholes, or coating-induced stress from solvent evaporation or shrinkage, which is the root reason parylene outperforms liquid coatings as a barrier film.
+=== Deposition Process ===
 The Parylene deposition process consists of four main stages:
 # '''Sublimation:''' Solid Parylene dimer is heated (approximately '''120–180°C''') under vacuum to produce a vapour.
 # '''Pyrolysis:''' The vapour passes through a high-temperature furnace ('''650–750°C'''), where the dimer molecules split into reactive monomers.
-# '''Deposition and Polymerisation:''' The monomer enters a slightly heated vacuum chamber containing the substrate. The monomer condenses and polymerises directly on all exposed surfaces, forming a thin, conformal polymer coating.
+# '''Deposition and Polymerisation:''' The monomer enters a slightly heated or room temperature vacuum chamber containing the substrate. The monomer condenses and polymerises directly on all exposed surfaces, forming a thin, conformal polymer coating.
-# '''Cold Trap:''' Residual monomer and by-products are captured in a cryo-cooled cold trap before reaching the vacuum pump.
+# '''Cold Trap(≈−90°C):''' Residual monomer and by-products are captured in a cryo-cooled cold trap before reaching the vacuum pump.