Specific Process Knowledge/Lithography/UVLithography - Revision history

Jehem: /* Process information from our suppliers */

2026-02-18T13:51:37Z

Process information from our suppliers

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	MicroChemicals GmbH has a [https://www.microchemicals.com/downloads/application_notes.html very large online library] of information about UV lithography.		MicroChemicals GmbH has a [https://www.microchemicals.com/downloads/application_notes.html very large online library] of information about UV lithography.

	Of particular ~~intrerest~~ is the [https://www.microchemicals.com/~~technical_information~~/lithography_trouble_shooting.pdf lithography trouble-shooter]		Of particular interest is the [https://www.microchemicals.com/dokumente/application_notes/lithography_trouble_shooting.pdf lithography trouble-shooter]

Jehem: /* Information from our suppliers */

2026-02-18T13:50:59Z

Information from our suppliers

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	--->		--->

	=~~Information~~ from our suppliers=		=Process information from our suppliers=
	MicroChemicals GmbH has a [https://www.microchemicals.com/downloads/application_notes.html very large online library] of information about UV lithography.		MicroChemicals GmbH has a [https://www.microchemicals.com/downloads/application_notes.html very large online library] of information about UV lithography.

	Of particular intrerest is the [https://www.microchemicals.com/technical_information/lithography_trouble_shooting.pdf lithography trouble-shooter]		Of particular intrerest is the [https://www.microchemicals.com/technical_information/lithography_trouble_shooting.pdf lithography trouble-shooter]

Jehem: /* Getting started */

2026-02-18T13:50:42Z

Getting started

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	DTU Nanolab offers a number of automatic and manual coaters, mask or maskless exposure tools, as well as automatic or semi-automatic developers.<br clear=all />		DTU Nanolab offers a number of automatic and manual coaters, mask or maskless exposure tools, as well as automatic or semi-automatic developers.<br clear=all />

	=Getting started=		=Getting started with UV lithography=

	[[File:UVLPic1.png\|450px\|right]]		[[File:UVLPic1.png\|450px\|right]]

Jehem at 13:50, 18 February 2026

2026-02-18T13:50:10Z

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			=UV lithography=
	UV Lithography uses ultraviolet light to transfer a pattern from a photo-mask, or a digital design file, to a substrate coated with photoresist.		UV Lithography uses ultraviolet light to transfer a pattern from a photo-mask, or a digital design file, to a substrate coated with photoresist.

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	DTU Nanolab offers a number of automatic and manual coaters, mask or maskless exposure tools, as well as automatic or semi-automatic developers.<br clear=all />		DTU Nanolab offers a number of automatic and manual coaters, mask or maskless exposure tools, as well as automatic or semi-automatic developers.<br clear=all />

	= Getting started =		=Getting started=

	[[File:UVLPic1.png\|450px\|right]]		[[File:UVLPic1.png\|450px\|right]]

Jehem at 13:49, 18 February 2026

2026-02-18T13:49:24Z

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	<br clear=all />		<br clear=all />

			<!---
	=Equipment and Process Pages=		=Equipment and Process Pages=
	{{:Specific Process Knowledge/Lithography/UVlithographyProcessPages}}		{{:Specific Process Knowledge/Lithography/UVlithographyProcessPages}}
	~~<!---~~
	===[[Specific Process Knowledge/Lithography/Resist#UV_Resist\|UV Resist]]===		===[[Specific Process Knowledge/Lithography/Resist#UV_Resist\|UV Resist]]===
	===[[Specific Process Knowledge/Lithography/Pretreatment\|Pretreatment]]===		===[[Specific Process Knowledge/Lithography/Pretreatment\|Pretreatment]]===

Jehem: /* Information from our suppliers */

2025-04-02T15:52:03Z

Information from our suppliers

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	=Information from our suppliers=		=Information from our suppliers=
	[https://www.microchemicals.com/downloads/application_notes.html ~~Application notes~~] ~~from MicroChemicals GmbH, e.g~~. [https://www.microchemicals.com/technical_information/lithography_trouble_shooting.pdf ~~Lithography Trouble~~-~~Shooter~~]		MicroChemicals GmbH has a [https://www.microchemicals.com/downloads/application_notes.html very large online library] of information about UV lithography.

			Of particular intrerest is the [https://www.microchemicals.com/technical_information/lithography_trouble_shooting.pdf lithography trouble-shooter]

Jehem: /* Getting started */

2025-04-02T15:49:08Z

Getting started

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	[[File:UVLPic2.png\|160px\|right]]		[[File:UVLPic2.png\|160px\|right]]

	~~'''Before~~ you ~~plan~~ your UV ~~processing~~ and request ~~for~~ training on ~~any equipment in~~ UV lithography, please go through the following steps~~.''' Include~~ the information in ~~the training~~ request.		<span style="color:red">New users are always recommended to have their process evaluated by the fabrication support group - before you start planning your UV process, and request training on UV lithography equipment, please go through the following pre-cleanroom and cleanroom steps and include all the information in your request.</span>

	~~Also, please~~ remember that the [https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography#Lithography_Tool_Package_Training Lithography TPT] is mandatory before training in any lithography equipment.		Please remember that the [https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography#Lithography_Tool_Package_Training Lithography TPT] is <i>mandatory</i> before you can receive training on any lithography equipment.<br>
			If you are completely new to photolithography, you can visit <u>[https://en.wikipedia.org/wiki/Photolithography this]</u> wikipedia webpage about photolithography before you start.

	~~If you are new to photolithography, you can visit <u>[https://en.wikipedia.org/wiki/Photolithography this]</u> wikipedia webpage about photolithography before you start.~~
	~~<br> <br>~~

	'''Pre-cleanroom work:'''		'''Pre-cleanroom work:'''
	#~~'''~~Complete the [https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography#Lithography_Tool_Package_Training Lithography TPT].		# Complete the [https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography#Lithography_Tool_Package_Training Lithography TPT]
	#~~'''~~Prepare a process flow:~~'''~~ The process flow describes all steps in your UV lithography process. You can find docx-templates <u>[[Specific_Process_Knowledge/Lithography/Resist/UVresist#UV_resist_comparison_table\|in this table]]</u>.		# Prepare a process flow: The process flow describes all steps in your UV lithography process. You can find docx-templates <u>[[Specific_Process_Knowledge/Lithography/Resist/UVresist#UV_resist_comparison_table\|in this table]]</u>
	#~~'''~~Design device~~'''~~: Design your device and layout. A detailed instruction on how to design a layout (or mask) can be found <u>[[Specific_Process_Knowledge/Pattern_Design\|here]]</u>.		# Evaluate your process in cooperation with the fabrication support group
	#~~'''~~Mask~~'''~~: If you wish to use a mask aligner, order a photomask for your UV process. Instructions on how to order a photomask can be found <u>[[Specific_Process_Knowledge/Pattern_Design#Mask_Ordering_and_Fabrication\|here]]</u>.		# Design device: Design your device and layout. A detailed instruction on how to design a layout (or mask) can be found <u>[[Specific_Process_Knowledge/Pattern_Design\|here]]</u>
			# Mask: If you wish to use a mask aligner, order a photomask for your UV process. Instructions on how to order a photomask can be found <u>[[Specific_Process_Knowledge/Pattern_Design#Mask_Ordering_and_Fabrication\|here]]</u>


	'''Cleanroom work:'''		'''Cleanroom work:'''
	#~~'''~~Substrate pretreatment~~'''~~: In many processes it is recommended to <u>[[Specific_Process_Knowledge/Lithography/Pretreatment\|~~pretreat~~ or prime]]</u> your wafer before ~~spin-~~coating. In some <u>[[Specific_Process_Knowledge/Lithography/Coaters\|spin-coaters]]</u>, these ~~pretreatment~~ processes are included in the spin coating of resist.		# Substrate pretreatment: In many processes it is recommended to <u>[[Specific_Process_Knowledge/Lithography/Pretreatment\|pre-treat or prime]]</u> your wafer before coating. In some <u>[[Specific_Process_Knowledge/Lithography/Coaters\|spin coaters]]</u>, these pre-treatment processes are included in the spin coating of resist
	#~~'''~~Resist Type~~'''~~: Choose the type of resist you wish to use: a list of UV lithography resist types available at DTU Nanolab can be found <u>[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist\|on this page]]</u>.		# Resist Type: Choose the type of resist you wish to use: a list of UV lithography resist types available at DTU Nanolab can be found <u>[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist\|on this page]]</u>
	#*Positive tone resist: Resist exposed to UV light will be dissolved in the developer. For mask aligners, the mask openings are an exact copy of the resist pattern which is to remain on the wafer.		#*Positive tone resist: Resist exposed to UV light will be dissolved in the developer. For mask aligners, the mask openings are an exact copy of the resist pattern which is to remain on the wafer
	#*Negative tone resist: Resist exposed to UV light will become polymerized and difficult to dissolve. For mask aligners, the mask openings are an ''inverse'' copy of the resist pattern which is to remain on the wafer.		#*Negative tone resist: Resist exposed to UV light will become polymerized and difficult to dissolve. For mask aligners, the mask openings are an ''inverse'' copy of the resist pattern which is to remain on the wafer
	#~~'''~~Thickness of resist~~'''~~: In general, it is recommended to work at, or below, an aspect ratio of ~1, i.e. where the feature sizes of the pattern, is larger than the thickness of the resist. Furthermore, when you decide on the resist thickness, consider which transfer you need:		# Thickness of resist: In general, it is recommended to work at, or below, an aspect ratio of ~1, i.e. where the feature sizes of the pattern, is larger than the thickness of the resist. Furthermore, when you decide on the resist thickness, consider which transfer method you need:
	#*For <u>[[Specific_Process_Knowledge/Lithography/LiftOff\|lift-off]]</u> processes, we recommend resist thickness at least 5 times larger than the thickness of the metal to be lifted.		#*For <u>[[Specific_Process_Knowledge/Lithography/LiftOff\|lift-off]]</u> processes, we recommend resist thickness at least 5 times larger than the thickness of the metal to be lifted
	#*For dry etch or wet etch processes, investigate the resist etch rate of your process, as this might limit the ''minimum'' thickness of your resist.		#*For dry etch or wet etch processes, investigate the resist etch rate of your process, as this might limit the ''minimum'' thickness of your resist
	#~~'''~~Spin Coater~~'''~~: Do you ~~wish~~ to use a manual spin coater or an automatic spin coater? See a list of spin coaters <u>[[Specific_Process_Knowledge/Lithography/Coaters\|here]]</u>.		# Spin Coater: Do you need to use a manual spin coater or an automatic spin coater? See a list of spin coaters <u>[[Specific_Process_Knowledge/Lithography/Coaters\|here]]</u>
	#~~'''~~Exposure~~'''~~: Choose which aligner you wish to use, and consider the exposure dose.		# Exposure: Choose which aligner you wish to use, and consider the exposure dose
	#*You can find a list of mask aligners and maskless aligners <u>[[Specific_Process_Knowledge/Lithography/UVExposure\|here]]</u>.		#*You can find a list of mask aligners and maskless aligners <u>[[Specific_Process_Knowledge/Lithography/UVExposure\|here]]</u>
	#*You can find information on dose <u>[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist\|here]]</u>.		#*You can find information on dose <u>[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist\|here]]</u>
	#~~'''~~Development~~'''~~: Choose which equipment you wish to use to develop your photoresist from <u>[[Specific_Process_Knowledge/Lithography/Development\|this list]]</u>. Remember the development process influences the <u>[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist\|exposure dose]]</u>.		# Development: Choose which equipment you wish to use to develop your photoresist from <u>[[Specific_Process_Knowledge/Lithography/Development\|this list]]</u>. Remember the development process influences the <u>[[Specific_Process_Knowledge/Lithography/Resist#UV_Resist\|exposure dose]]</u>
	#~~'''~~Specify whether you wish to strip or lift-off your resist~~'''~~: <u>[[Specific_Process_Knowledge/Lithography/Strip\|strip]]</u> and <u>[[Specific_Process_Knowledge/Lithography/LiftOff\|lift-off]]</u>.		# Specify whether you wish to strip or lift-off your resist: <u>[[Specific_Process_Knowledge/Lithography/Strip\|strip]]</u> and <u>[[Specific_Process_Knowledge/Lithography/LiftOff\|lift-off]]</u>

	<br clear=all />		<br clear=all />

Jehem at 15:34, 2 April 2025

2025-04-02T15:34:28Z

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	[[Category: Lithography]]		[[Category: Lithography]]

	[[Image:UVLithography.jpg\|~~320x320px~~\|right\|]]		[[Image:UVLithography.jpg\|400px\|right\|]]

	__TOC__		__TOC__

Jehem at 15:34, 2 April 2025

2025-04-02T15:34:17Z

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	# Developing the exposed resist to reveal the transferred pattern		# Developing the exposed resist to reveal the transferred pattern

	DTU Nanolab offers a number of automatic and manual coaters, mask or maskless exposure tools, as well as automatic or semi-automatic developers.		DTU Nanolab offers a number of automatic and manual coaters, mask or maskless exposure tools, as well as automatic or semi-automatic developers.<br clear=all />

	= Getting started =		= Getting started =

Jehem at 15:32, 2 April 2025

2025-04-02T15:32:21Z

← Older revision		Revision as of 17:32, 2 April 2025
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	__TOC__		__TOC__

	UV Lithography uses ultraviolet light to transfer a pattern from a photo-mask or a design file to a ~~wafer~~ coated with photoresist. The ~~photoresist~~ film ~~is spin coated onto the wafers, the design is transferred to~~ the resist by ~~using an aligner, and subsequently~~ the resist pattern ~~is developed.~~ DTU Nanolab ~~houses~~ a number of automatic or manual coaters, mask or maskless ~~aligners~~, as well as automatic or semi-automatic developers.		UV Lithography uses ultraviolet light to transfer a pattern from a photo-mask, or a digital design file, to a substrate coated with photoresist.

			The process has 3 main steps:
			# Coating the substrate with a photosensitive film
			# Transferring a pattern into the resist by exposing it with UV light through either a physical shadow mask or a digital version of a shadow mask
			# Developing the exposed resist to reveal the transferred pattern

			DTU Nanolab offers a number of automatic and manual coaters, mask or maskless exposure tools, as well as automatic or semi-automatic developers.

	= Getting started =		= Getting started =