Jehem: /* Aligner: Maskless 04 */

2026-01-13T11:54:56Z

Aligner: Maskless 04

← Older revision		Revision as of 13:54, 13 January 2026
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	== Aligner: Maskless 04 ==		=Aligner: Maskless 04=
	[[Image:Heidelberg_uMLA.JPG\|400px\|thumb\|Aligner: Maskless 04 is located in PolyFabLab in building 347.]]		[[Image:Heidelberg_uMLA.JPG\|400px\|thumb\|Aligner: Maskless 04 is located in PolyFabLab in building 347.]]

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	Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=544 LabManager] - '''requires login'''		Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=544 LabManager] - '''requires login'''
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	===Exposure dose and defocus===		==Exposure dose and defocus==
	[[Specific Process Knowledge/Lithography/Resist#Aligner:_Maskless_04\|Information on UV exposure dose]]		[[Specific Process Knowledge/Lithography/Resist#Aligner:_Maskless_04\|Information on UV exposure dose]]
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	*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_04_processing#Alignment\|Alignment]]		*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_04_processing#Alignment\|Alignment]]

	=== Equipment performance and process related parameters ===		==Equipment performance and process related parameters==

	{\|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"		{\|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"

Jehem: Created page with "== Aligner: Maskless 04 == Aligner: Maskless 04 is located in PolyFabLab in building 347. The logon password for the PC is "mla" (without quotation marks). The µMLA Tabletop Maskless Aligner from Heidelberg, located in PolyFabLab in building 347, is a direct exposure lithography tool installed in 2024. It is a UV exposure system, that exposes the patterns directly on photosensitive resists on chips, 2, 4, and 6 inch substrate..."

2026-01-12T09:16:47Z

Created page with "== Aligner: Maskless 04 == 400px|thumb|Aligner: Maskless 04 is located in PolyFabLab in building 347. The logon password for the PC is "mla" (without quotation marks). The µMLA Tabletop Maskless Aligner from Heidelberg, located in PolyFabLab in building 347, is a direct exposure lithography tool installed in 2024. It is a UV exposure system, that exposes the patterns directly on photosensitive resists on chips, 2, 4, and 6 inch substrate..."

New page

== Aligner: Maskless 04 ==
[[Image:Heidelberg_uMLA.JPG|400px|thumb|Aligner: Maskless 04 is located in PolyFabLab in building 347.]]

The logon password for the PC is "mla" (without quotation marks).

The µMLA Tabletop Maskless Aligner from Heidelberg, located in PolyFabLab in building 347, is a direct exposure lithography tool installed in 2024.
It is a UV exposure system, that exposes the patterns directly on photosensitive resists on chips, 2, 4, and 6 inch substrates, without prior fabrication of a mask.
The system offers top side alignment with good accuracy.

Link to information about [[Specific_Process_Knowledge/Pattern_Design#Alignment_marks|alignment mark design]].

The user manual and contact information can be found in LabManager:

Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=544 LabManager] - '''requires login'''


===[[Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 04 processing|Process information]]===
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_04_processing#Exposure_technology|Exposure technology]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_04_processing#Process_Parameters|Process parameters]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_04_processing#Substrate_positioning|Substrate positioning]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_04_processing#Alignment|Alignment]]

=== Equipment performance and process related parameters ===

{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"

!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" colspan="2"|
Alignment and UV exposure
|-

!style="background:silver; color:black" align="left" valign="center" rowspan="6"|Performance

|style="background:LightGrey; color:black"|Exposure mode
|style="background:WhiteSmoke; color:black" colspan="2"|
*Projection (Raster mode)
*Direct laser writing (Vector mode)
|-
| style="background:LightGrey; color:black"|Exposure light
|style="background:WhiteSmoke; color:black" colspan="2"|
*365nm (LED) for projection
*405nm (diode laser) for direct laser writing
|-
|style="background:LightGrey; color:black"|Focusing method
|style="background:WhiteSmoke; color:black" colspan="2"|
Pneumatic or Optical
|-
|style="background:LightGrey; color:black"|Minimum structure size
|style="background:WhiteSmoke; color:black" colspan="2"|
Down to 1µm
|-
|style="background:LightGrey; color:black"|Design formats
|style="background:WhiteSmoke; color:black" colspan="2"|
*GDS-II
*CIF
*DXF
*Gerber
*HIMT format
|-
|style="background:LightGrey; color:black"|Alignment modes
|style="background:WhiteSmoke; color:black" colspan="2"|
Top side only, ±1µm

|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" colspan="2"|
* maximum writing area: 150x150 mm2
* 150 mm wafer
* 100 mm wafer
* 50 mm wafer
* pieces down to 3x3 mm2 with optical autofocus
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" colspan="2"|
All PolyFabLab materials with sufficient stiffness and flatness.
 Total height variation across the substrate must be less than ±80 µm - including wafer bow
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" colspan="2"|
1
|-
|}

Specific Process Knowledge/Lithography/UVExposure/aligner MLA4 - Revision history

Jehem: /* Aligner: Maskless 04 */