Jehem: Created page with "=Overview of wet bench 06 and 07= {| class="wikitable" |- ! !! Resist Strip !! Lift-off |- ! scope=row style="text-align: left;" | Process | Wet resist strip || Metal lift-off process |- ! scope=row style="text-align: left;" | Chemical | Remover 1165 (NMP) || Remover 1165 (NMP) |- ! scope=row style="text-align: left;" | Process tempera..."

2026-01-12T10:20:44Z

Created page with "=Overview of wet bench 06 and 07= {| class="wikitable" |- ! !! Resist Strip !! Lift-off |- ! scope=row style="text-align: left;" | Process | Wet resist strip || Metal lift-off process |- ! scope=row style="text-align: left;" | Chemical | Remover 1165 (NMP) || Remover 1165 (NMP) |- ! scope=row style="text-align: left;" | Process tempera..."

New page

=Overview of wet bench 06 and 07=
{| class="wikitable"
|-
! !! [[Specific Process Knowledge/Lithography/Strip#Resist_Strip|Resist Strip]] !! [[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]
|-
! scope=row style="text-align: left;" | Process
| Wet resist strip || Metal lift-off process
|-
! scope=row style="text-align: left;" | Chemical
| Remover 1165 (NMP) || Remover 1165 (NMP)
|-
! scope=row style="text-align: left;" | Process temperature
| Up to 65°C || Up to 65°C
|-
! scope=row style="text-align: left;" | Substrate batch
| 1-25 wafers || 1-25 wafers
|-
! scope=row style="text-align: left;" | Substrate size
|
*100 mm wafers
*150 mm wafers
|
*100 mm wafers
*150 mm wafers
|-
! scope=row style="text-align: left;" | Materials allowed
|
*Silicon
*Silicon oxide
*Silicon nitride
*Silicon oxynitride
| All metals except Type IV (Pb, Te)
|}
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Specific Process Knowledge/Lithography/Strip/wetBench06and07 - Revision history