Specific Process Knowledge/Lithography/Strip - Revision history

Jehem: /* Plasma Ashing process parameters */

2026-02-18T13:57:57Z

Plasma Ashing process parameters

← Older revision		Revision as of 15:57, 18 February 2026
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	{\| class="wikitable"		{\| class="wikitable"
	\|-		\|-
	! !! [[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4\|Resist stripping ~~(PA4 & PA5)~~]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum\|Descum ~~(PA3)~~]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_4\|Descum ~~(PA4 & PA5)~~]] !! Surface treatment ~~(PA4 & PA5)~~ !! Other ashing of organic material ~~(PA4~~ & ~~PA5)~~		! !! [[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4\|Resist stripping]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum\|Descum]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_4\|Descum]] !! Surface treatment !! Other ashing of organic material
			\|-
			! scope=row style="text-align: left;" \| Tool
			\| Plasma asher 4 & 5 \|\| Plasma asher 3: Descum \|\| Plasma asher 4 & 5 \|\| Plasma asher 4 & 5 \|\| Plasma asher 4 & 5
	\|-		\|-
	! scope=row style="text-align: left;" \| Process pressure		! scope=row style="text-align: left;" \| Process pressure

2026-02-18T13:54:12Z

Plasma Ashing process parameters

← Older revision		Revision as of 15:54, 18 February 2026
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	{\| class="wikitable"		{\| class="wikitable"
	\|-		\|-
	! !! [[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4\|Resist stripping (PA4 & PA5)]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum\|Descum (PA3)]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_4\|Descum (PA4 & PA5)]] !! Surface treatment !! Other ashing of organic material		! !! [[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4\|Resist stripping (PA4 & PA5)]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum\|Descum (PA3)]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_4\|Descum (PA4 & PA5)]] !! Surface treatment (PA4 & PA5) !! Other ashing of organic material (PA4 & PA5)
	\|-		\|-
	! scope=row style="text-align: left;" \| Process pressure		! scope=row style="text-align: left;" \| Process pressure
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	\|-		\|-
	! scope=row style="text-align: left;" \| Substrate batch		! scope=row style="text-align: left;" \| Substrate batch
	\| 1-25 \|\| 1-2 \|\| 1-25 \|\| 1 \|\| 1		\| 1-25 \|\| 1-2 \|\| 1-25 \|\| 1-25 \|\| 1-25
	\|}		\|}

2026-01-13T11:31:50Z

Decommisioned tools

← Older revision		Revision as of 13:31, 13 January 2026
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	=Decommisioned tools=		=Decommisioned tools=
	<span style="color:red">Plasma asher 1 was decommissioned 2024-12-02.</span>		<span style="color:red">Plasma asher 1 was decommissioned 2024-12-02.</span>

	[[Specific Process Knowledge/Lithography/Strip/PlasmaAsher1\|Information about decommissioned tool can be found here.]]		[[Specific Process Knowledge/Lithography/Strip/PlasmaAsher1\|Information about decommissioned tool can be found here.]]


	<span style="color:red">Plasma asher 2 was decommissioned 2024-12-02.</span>		<span style="color:red">Plasma asher 2 was decommissioned 2024-12-02.</span>

	[[Specific Process Knowledge/Lithography/Strip/PlasmaAsher2\|Information about decommissioned tool can be found here.]]		[[Specific Process Knowledge/Lithography/Strip/PlasmaAsher2\|Information about decommissioned tool can be found here.]]
	<br clear="all" />		<br clear="all" />

2026-01-12T10:25:16Z

Strip Comparison Table

2026-01-12T10:22:29Z

Strip Comparison Table

← Older revision		Revision as of 12:22, 12 January 2026
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	*Films, or patterned films, of any material except type IV (Pb, Te)		*Films, or patterned films, of any material except type IV (Pb, Te)
	\|}		\|}

	<br clear="all" />		<br clear="all" />

2026-01-12T10:21:45Z

2025-09-29T10:34:00Z

Process power for plasma asher 4 & 5

← Older revision		Revision as of 12:34, 29 September 2025
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	\|-		\|-
	! scope=row style="text-align: left;" \| Test results		! scope=row style="text-align: left;" \| Test results
	\| Ashing rate follows ~~temperature~~		\| Ashing rate follows Power
	\|-		\|-
	! scope=row style="text-align: left;" \| Wafers		! scope=row style="text-align: left;" \| Wafers
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	\|-		\|-
	! scope=row style="text-align: left;" \| Power		! scope=row style="text-align: left;" \| Power
	\| ~~1000 W~~		\| Tested parameter
	\|-		\|-
	! scope=row style="text-align: left;" \| Test processing time		! scope=row style="text-align: left;" \| Test processing time
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	\|-		\|-
	! scope=row style="text-align: left;" \| Test average temperature		! scope=row style="text-align: left;" \| Test average temperature
	\| ~~Tested parameter~~		\| 40°C
	\|}		\|}

2025-09-29T10:33:14Z

Process temperature for plasma asher 4 & 5

← Older revision		Revision as of 12:33, 29 September 2025
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	\|-		\|-
	! scope=row style="text-align: left;" \| Power		! scope=row style="text-align: left;" \| Power
	\| ~~Tested parameter~~		\| 1000 W
	\|-		\|-
	! scope=row style="text-align: left;" \| Test processing time		! scope=row style="text-align: left;" \| Test processing time
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	\|-		\|-
	! scope=row style="text-align: left;" \| Test average temperature		! scope=row style="text-align: left;" \| Test average temperature
	\| ~~40°C~~		\| Tested parameter
	\|}		\|}

2025-09-29T10:32:20Z

Process temperature for plasma asher 4 & 5

← Older revision		Revision as of 12:32, 29 September 2025
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	\|-		\|-
	! scope=row style="text-align: left;" \| Test results		! scope=row style="text-align: left;" \| Test results
	\| Ashing rate follows ~~power~~		\| Ashing rate follows temperature
	\|-		\|-
	! scope=row style="text-align: left;" \| Wafers		! scope=row style="text-align: left;" \| Wafers

2025-03-04T11:02:45Z

Plasma Ashing process parameters

← Older revision		Revision as of 13:02, 4 March 2025
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	{\| class="wikitable"		{\| class="wikitable"
	\|-		\|-
	! !! [[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4\|Resist stripping]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum\|Descum (PA3)]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_4\|Descum (PA4 & PA5)]] !! Surface treatment !! Other ashing of organic material		! !! [[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4\|Resist stripping (PA4 & PA5)]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum\|Descum (PA3)]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_4\|Descum (PA4 & PA5)]] !! Surface treatment !! Other ashing of organic material
	\|-		\|-
	! scope=row style="text-align: left;" \| Process pressure		! scope=row style="text-align: left;" \| Process pressure