Specific Process Knowledge/Lithography/NanoImprintLithography - Revision history

Taran at 13:31, 25 August 2025

2025-08-25T13:31:23Z

← Older revision		Revision as of 15:31, 25 August 2025
Line 5:		Line 5:
	==Imprinter 01==		==Imprinter 01==

	[[Image:imprinterfig1.jpg\|300x300px\|thumb\|Imprinter 01: Positioned in cleanroom A-5]]		[[Image:imprinterfig1.jpg\|300x300px\|thumb\|Imprinter 01: Positioned in cleanroom F-2]]

	The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).		The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).
Line 21:		Line 21:
	<br clear="all" />		<br clear="all" />

	====Imprint resist information and flows====		====Imprint resist information and process flows====
	*[[Specific Process Knowledge/Imprinting\|Imprinting]]		*[[Specific Process Knowledge/Imprinting\|Imprinting]]

Jehem at 12:53, 10 May 2023

2023-05-10T12:53:06Z

← Older revision		Revision as of 14:53, 10 May 2023
Line 1:		Line 1:
	~~==Imprinter 01==~~		{{cc-nanolab}}

			'''Feedback to this section''': '''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''

	~~'''Feedback to this section''':~~		==Imprinter 01==
	~~'''[mailto:labadviser.danchip.dtu.dk/index.php?title~~=~~Specific_Process_Knowledge/Lithography/NanoImprintLithography#~~ Imprinter 01 ~~click here]'''~~

	[[Image:imprinterfig1.jpg\|300x300px\|thumb\|Imprinter 01: Positioned in cleanroom A-5]]		[[Image:imprinterfig1.jpg\|300x300px\|thumb\|Imprinter 01: Positioned in cleanroom A-5]]

Elkh: /* Imprinter 01 */

2020-01-21T10:16:01Z

Imprinter 01

← Older revision		Revision as of 12:16, 21 January 2020
Line 15:		Line 15:

	====Imprint information====		====Imprint information====
			*[[Specific Process Knowledge/Imprinting\|Imprinting]]

			<br clear="all" />

			<br clear="all" />

			====Imprint resist information and flows====
	*[[Specific Process Knowledge/Imprinting\|Imprinting]]		*[[Specific Process Knowledge/Imprinting\|Imprinting]]

Rkch: /* Imprinter 01 */

2017-05-19T09:28:35Z

Imprinter 01

← Older revision		Revision as of 11:28, 19 May 2017
Line 5:		Line 5:
	'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''		'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''

	[[Image:imprinterfig1.jpg\|300x300px\|thumb\|~~Wet Poly Etch~~: Positioned in cleanroom D-~~3 to the left in the bench~~]]		[[Image:imprinterfig1.jpg\|300x300px\|thumb\|Imprinter 01: Positioned in cleanroom A-5]]

	The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).		The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).

Rkch: /* Imprinter 01 */

2017-05-19T09:27:50Z

Imprinter 01

← Older revision		Revision as of 11:27, 19 May 2017
Line 5:		Line 5:
	'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''		'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''

			[[Image:imprinterfig1.jpg\|300x300px\|thumb\|Wet Poly Etch: Positioned in cleanroom D-3 to the left in the bench]]

	The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).		The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).

Rkch: /* Imprinter 01 */

2017-05-19T09:25:21Z

Imprinter 01

← Older revision		Revision as of 11:25, 19 May 2017
Line 5:		Line 5:
	'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''		'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''

	~~[[Image:polyetch1.jpg\|300x300px\|thumb\|Wet Poly Etch: Positioned in cleanroom D-3 to the left in the bench]]~~

	The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).		The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).

Rkch: /* Imprinter 01 */

2017-05-19T09:23:47Z

Imprinter 01

← Older revision		Revision as of 11:23, 19 May 2017
Line 5:		Line 5:
	'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''		'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''

	[[~~File~~:polyetch1.jpg\|~~400px~~]]		[[Image:polyetch1.jpg\|300x300px\|thumb\|Wet Poly Etch: Positioned in cleanroom D-3 to the left in the bench]]

	The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).		The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).

Rkch: /* Imprinter 01 */

2017-05-19T09:21:57Z

Imprinter 01

← Older revision		Revision as of 11:21, 19 May 2017
Line 4:		Line 4:
	'''Feedback to this section''':		'''Feedback to this section''':
	'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''		'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''

			[[File:polyetch1.jpg\|400px]]

	The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).		The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).
Line 16:		Line 18:

	<br clear="all" />		<br clear="all" />

	==Overview of the performance of the Imprinter 01 and some process related parameters==		==Overview of the performance of the Imprinter 01 and some process related parameters==

Rkch at 13:46, 18 May 2017

2017-05-18T13:46:48Z

← Older revision		Revision as of 15:46, 18 May 2017
Line 12:		Line 12:
	<br clear="all" />		<br clear="all" />

			====Imprint information====
			*[[Specific Process Knowledge/Imprinting\|Imprinting]]

	<br clear="all" />		<br clear="all" />

Rkch at 13:14, 18 May 2017

2017-05-18T13:14:17Z

← Older revision		Revision as of 15:14, 18 May 2017
Line 1:		Line 1:
	==~~EVG NIL~~==		==Imprinter 01==
	~~[[Image:EVG NIL.jpg\|300 × 300px\|thumb\|right\|The EVG NIL is positioned in C-4]]~~

	'''Feedback to this section''':		'''Feedback to this section''':
	'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# ~~EVG NIL~~ click here]'''		'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''

	The ~~EVG NIL~~ is a system for imprinting in polymers ~~(Hot Embossing), and for bonding on wafer scale~~. 3 different types of ~~bonding~~ can be done: ~~Anodic, Eutectic~~ and ~~Fusion~~. ~~Furthermore it~~ is possible to align the wafers one wishes to ~~bond. In principle it is also possible to align the substrate and stamp before~~ imprint~~, but it is much more difficult~~.		The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).

	~~It is possible to fill bonded cavities with a desired gas. At the moment we have SF6 on the system, but if you would like another one, please contact Rune Christiansen.~~		'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=391 LabManager]'''


	'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=~~153~~ LabManager]'''


	<br clear="all" />		<br clear="all" />

	~~==Process information==~~
	~~====Types of Bonding====~~
	*[[Specific Process Knowledge/Bonding/Eutectic bonding\|Eutectic bonding]]
	*[[Specific Process Knowledge/Bonding/Fusion bonding\|Fusion bonding]]
	*[[Specific Process Knowledge/Bonding/Anodic bonding\|Anodic bonding]]

	~~====Imprint information====~~
	*[[Specific Process Knowledge/Imprinting\|Imprinting]]

	<br clear="all" />		<br clear="all" />
	==Overview of the performance of the ~~EVG NIL~~ and some process related parameters==		==Overview of the performance of the Imprinter 01 and some process related parameters==

	{\| border="2" cellspacing="0" cellpadding="10"		{\| border="2" cellspacing="0" cellpadding="10"
	\|-		\|-
	!style="background:silver; color:black;" align="left"\|Purpose		!style="background:silver; color:black;" align="left"\|Purpose
	\|style="background:LightGrey; color:black"\|~~Imprint and bonding~~		\|style="background:LightGrey; color:black"\|
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Eutectic bonding
	*Fusion bonding
	*Anodic bonding
	*Imprinting		*Imprinting
	\|-		\|-
Line 40:		Line 26:
	\|style="background:LightGrey; color:black"\|Alignment accuracy		\|style="background:LightGrey; color:black"\|Alignment accuracy
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~± 5 microns for IR alignment~~		*Only by eye
	*± 10 microns for backside alignment
	\|-		\|-
	\|-		\|-
Line 47:		Line 33:
	\|style="background:LightGrey; color:black"\|Process Temperature		\|style="background:LightGrey; color:black"\|Process Temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Room temperature to ~~500°C~~		*Room temperature to 200°C
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Process pressure		\|style="background:LightGrey; color:black"\|Process pressure
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~5<math>\cdot</math>~~10<sup>~~-~~4</sup>mbar - 2000mbar~~		*~5<math>\cdot</math>1mbar - atm
	\|-		\|-
	\|style="background:LightGrey; color:black"\|~~Piston Force~~		\|style="background:LightGrey; color:black"\|Imprint Pressure
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~Depending on the area, for 4" wafers 200~~-~~20000N.~~		*0-6 bar
	\|-		\|-
	!style="background:silver; color:black" align="left" valign="top" rowspan="3"\|Substrates		!style="background:silver; color:black" align="left" valign="top" rowspan="3"\|Substrates
	\|style="background:LightGrey; color:black"\|Batch size		\|style="background:LightGrey; color:black"\|Batch size
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~One~~ 4" ~~or 6" wafer per run~~		*Pieces to 4" wafers
	*Pieces are only allowed with speciel permission
	\|-		\|-
	\| style="background:LightGrey; color:black"\|Substrate material allowed		\| style="background:LightGrey; color:black"\|Substrate material allowed
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Silicon ~~wafers~~		*Silicon
	*Quartz ~~wafers~~		*Quartz
	*Pyrex ~~wafers~~		*Pyrex
	\|-		\|-
	\| style="background:LightGrey; color:black"\|Material allowed on the substrate		\| style="background:LightGrey; color:black"\|Material allowed on the substrate