Specific Process Knowledge/Lithography/EBeamLithographyManual - Revision history

Jmli: /* Purpose, location and technical specifications */

2019-11-26T07:59:06Z

Purpose, location and technical specifications

← Older revision		Revision as of 09:59, 26 November 2019
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	To use the e-beam writer, book the machine via LabManager, and ask help from DTU ~~Danchip~~ staff to load your cassette into the robot loader (autoloader).		To use the e-beam writer, book the machine via LabManager, and ask help from DTU Nanolab staff to load your cassette into the robot loader (autoloader).


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	After your exposure, fully trained users can unload their cassettes from the autoloader, unmount their substrates and leave the cassette on the designated table.		After your exposure, fully trained users can unload their cassettes from the autoloader, unmount their substrates and leave the cassette on the designated table.

	If you are prohibited to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU ~~Danchip~~ personel unmount your substrates.		If you are prohibited to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Nanolab personel unmount your substrates.
	When un-mounting someone's sample, please place them in a single carrier box, with your initials in parentheses, and write - out of E-beam - date - cassette and slot.		When un-mounting someone's sample, please place them in a single carrier box, with your initials in parentheses, and write - out of E-beam - date - cassette and slot.

Jmli: /* Purpose, location and technical specifications */

2019-11-25T20:27:07Z

Purpose, location and technical specifications

← Older revision		Revision as of 22:27, 25 November 2019
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	To request for an e-beam training session, contact e-beam@~~danchip~~.dtu.dk; a DTU ~~Danchip~~ personnel will hereafter provide a time slot. For safety reasons, even fully trained users are only authorized to mount substrates into the e-beam cassettes but not authorized to load the cassettes into the autoloader.		To request for an e-beam training session, contact e-beam@nanolab.dtu.dk; a DTU Nanolab personnel will hereafter provide a time slot. For safety reasons, even fully trained users are only authorized to mount substrates into the e-beam cassettes but not authorized to load the cassettes into the autoloader.

Lgpe: /* Rough estimation of exposure time */

2018-01-31T12:37:23Z

Rough estimation of exposure time

← Older revision		Revision as of 14:37, 31 January 2018
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	== Rough estimation of exposure time ==		== Rough estimation of exposure time ==

	[[~~File~~:~~currentbeamsize~~.jpg\|400px\|right]]		[[Image:old_and_new_column_beam_size_in_one_page_March172019.jpg\|400px\|right\|]]

	Based on the equations above, a rough estimate of the exposure time is easily calcualted. In the second sheet of the e-beam logbook, a simple program for calculating the scan speed frequency and an estimation of the exposure time can be found. Note, that the actual writing time will exceed the exposure-time, as the exposure-time calculation doesn’t include pre-calibrations and stage movement during exposure.		Based on the equations above, a rough estimate of the exposure time is easily calcualted. In the second sheet of the e-beam logbook, a simple program for calculating the scan speed frequency and an estimation of the exposure time can be found. Note, that the actual writing time will exceed the exposure-time, as the exposure-time calculation doesn’t include pre-calibrations and stage movement during exposure.

Lgpe: /* Technical Specification */

2018-01-31T09:32:47Z

Technical Specification

← Older revision		Revision as of 11:32, 31 January 2018
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	*The acceleration voltage is 100 kV.		*The acceleration voltage is 100 kV.
	*The e-beam writer can pattern structures with a minimum reproducible resolution of 7 nm, depending on the resist type.		*The e-beam writer can pattern structures with a minimum reproducible resolution of 7 nm, depending on the resist type.
	*The maximum field-size without stitching is 1000µm x 1000µm.		*The maximum field-size without stitching is 1000µm x 1000µm, but can be smaller if needed.
	*The machine has cassettes that can contain either 6 wafers of 2” in size, 2 or 3 wafers of 4” in size, 1 wafer of 6” in size, 1 wafer of 8” in size, 4 chips of different sizes(slot sizes 4 mm, 8 mm, 12 mm, and 20 mm)		*The machine has cassettes that can contain either 6 wafers of 2” in size, 2 or 3 wafers of 4” in size, 1 wafer of 6” in size, 1 wafer of 8” in size, 4 chips of different sizes(slot sizes 4 mm, 8 mm, 12 mm, and 20 mm)

Lgpe: /* Technical Specification */

2018-01-31T09:17:32Z

Technical Specification

← Older revision		Revision as of 11:17, 31 January 2018
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	*Electron-beam scanning speeds, f, up to 100 MHz are available (which is maximum scan speed).		*Electron-beam scanning speeds, f, up to 100 MHz are available (which is maximum scan speed).
	*The acceleration voltage is 100 kV.		*The acceleration voltage is 100 kV.
	*The e-beam writer can pattern structures with a minimum resolution of 12 nm.		*The e-beam writer can pattern structures with a minimum reproducible resolution of 7 nm, depending on the resist type.
	*The maximum field-size without stitching is 1000µm x 1000µm.		*The maximum field-size without stitching is 1000µm x 1000µm.
	*The machine has cassettes that can contain either 6 wafers of 2” in size, 2 or 3 wafers of 4” in size, 1 wafer of 6” in size, 1 wafer of 8” in size, 4 chips of different sizes(slot sizes 4 mm, 8 mm, 12 mm, and 20 mm)		*The machine has cassettes that can contain either 6 wafers of 2” in size, 2 or 3 wafers of 4” in size, 1 wafer of 6” in size, 1 wafer of 8” in size, 4 chips of different sizes(slot sizes 4 mm, 8 mm, 12 mm, and 20 mm)

Lgpe: /* Manuals */

2018-01-30T13:48:26Z

Manuals

← Older revision		Revision as of 15:48, 30 January 2018
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	The original JEOL manual for the e-beam writer FS9500 is located on the O-drive: O:\CleanroomDrive\_Equipment\E-beam		The original JEOL manual for the e-beam writer FS9500 is located on the O-drive: O:\CleanroomDrive\_Equipment\E-beam
	Technical Specification
			==Technical Specification==
	The system can be characterized as follows:		The system can be characterized as follows:

Lgpe: /* Manuals */

2018-01-30T13:47:04Z

Manuals

← Older revision		Revision as of 15:47, 30 January 2018
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	==Manuals==		==Manuals==

	There are 3 manuals for the e-beam writer; apart from the main manual (this manual) there is a sdf and jdf-file manual, and a ~~BEAMER~~ manual. They can ~~both~~ be accessed from LabManager under Technical documents.		There are 4 manuals for the e-beam writer; apart from the main manual (this manual) there is a sdf and jdf-file manual, a BEAMER manual and a 2D mark detection manual. They can all be accessed from LabManager under Technical documents.

Lgpe: /* Location */

2018-01-30T13:45:59Z

Location

← Older revision		Revision as of 15:45, 30 January 2018
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	The computer controlling the e-beam (EWS/9500 New) is located in the controller room which is a class 100 cleanroom area. The computers supporting the conversion of the e-beam files are also located in the controller room.		The computer controlling the e-beam (EWS/9500 New) is located in the controller room which is a class 100 cleanroom area. The computers supporting the conversion of the e-beam files are also located in the controller room.
	Manuals
			==Manuals==

	There are 3 manuals for the e-beam writer; apart from the main manual (this manual) there is a sdf and jdf-file manual, and a BEAMER manual. They can both be accessed from LabManager under Technical documents.		There are 3 manuals for the e-beam writer; apart from the main manual (this manual) there is a sdf and jdf-file manual, and a BEAMER manual. They can both be accessed from LabManager under Technical documents.

Lgpe: /* Location */

2018-01-30T13:45:22Z

Location

← Older revision		Revision as of 15:45, 30 January 2018
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	The e-beam writer is located in a class 10 (ISO 4) cleanroom with tight temperature and moisture control. The room must only be entered when the machines or equipment inside the room is intended to be used. Always wear face-mask and an extra pair of gloves when handling cassettes.		The e-beam writer is located in a class 10 (ISO 4) cleanroom with tight temperature and moisture control. The room must only be entered when the machines or equipment inside the room is intended to be used. Always wear face-mask and an extra pair of gloves when handling cassettes.

	The computer controlling the e-beam (EWS/9500) is located in the controller room which is a class 100 cleanroom area. The computers supporting the conversion of the e-beam files are also located in the controller room.		The computer controlling the e-beam (EWS/9500 New) is located in the controller room which is a class 100 cleanroom area. The computers supporting the conversion of the e-beam files are also located in the controller room.
	Manuals		Manuals

Lgpe: /* Purpose, location and technical specifications */

2018-01-30T13:44:43Z

Purpose, location and technical specifications

← Older revision		Revision as of 15:44, 30 January 2018
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	If you are prohibited to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Danchip personel unmount your substrates.		If you are prohibited to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Danchip personel unmount your substrates.
	When un-mounting someone's sample, please place them in a single carrier box, with your initials in parentheses, and write - out of E-beam - date - cassette and slot.		When un-mounting someone's sample, please place them in a single carrier box, with your initials in parentheses, and write - out of E-beam - date - cassette and slot.

	If your exposure extends into the next users booking, you accept that the next user can stop your exposure without warning - however fair information should be given.		If your exposure extends into the next users booking, you accept that the next user can stop your exposure without warning - however fair information should be given.