Specific Process Knowledge/Lithography/EBeamLithography/JEOL 9500 User Guide - Revision history

Thope: /* Techical Specification */

2024-04-22T09:41:02Z

Techical Specification

← Older revision		Revision as of 11:41, 22 April 2024
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	*The spot beam for electron beam writing is generated by a ZrO/W emitter and a four-stage electron beam focusing lens system.		*The spot beam for electron beam writing is generated by a ZrO/W emitter and a four-stage electron beam focusing lens system.
	*The maximum frequency of the deflector scanner is ~~100~~ MHz, i.e. the minimum beam dwell time is 10 ns.		*The maximum frequency of the deflector scanner is 200 MHz, i.e. the minimum beam dwell time is 5 ns.
	*The acceleration voltage is locked at 100 kV.		*The acceleration voltage is locked at 100 kV.
	*The e-beam writer can pattern structures with a minimum resolution of 10 nm.		*The e-beam writer can pattern structures with a minimum resolution of 10 nm.

Thope: /* Original JEOL Manual */

2024-03-05T13:18:58Z

Original JEOL Manual

← Older revision		Revision as of 15:18, 5 March 2024
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	*Training can be requested by sending a mail with relevant process flow to training@nanolab.dtu.dk		*Training can be requested by sending a mail with relevant process flow to training@nanolab.dtu.dk

	~~<br>~~

	~~==Original JEOL Manual==~~

	~~The original JEOL manual for the e-beam writer JEOL JBX-9500FS is located on the O-drive: O:\CleanroomDrive\_Equipment\E-beam~~

	<br>		<br>

Thope at 06:55, 14 November 2023

2023-11-14T06:55:47Z

Thope at 10:38, 6 November 2023

2023-11-06T10:38:20Z

← Older revision		Revision as of 12:38, 6 November 2023
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			=Job execution with alignment=
			Execution of jobs that require alignment requires a few additional steps compared to the process described above. The additional steps are:
			*Optical prealignment of the mounted substrate to determine PQ mark offsets and substrate rotation
			*Gain correction to ensure the backscatter detector provides sufficient signal for mark detection using '''AGCRG'''
			*Verification of PQ mark detection using '''SETWFR'''
			*Verification of chip mark detection using '''CHIPAL''' if chip marks are used

Thope: /* Training and authorization */

2023-11-06T10:08:01Z

Training and authorization

← Older revision		Revision as of 12:08, 6 November 2023
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	*Only authorized users are allowed to use this machine.		*Only authorized users are allowed to use this machine.
	*In E-2, all users must keep within the area between the front side of the machine and the table with the pre-aligner setup. Only JEOL staff or DTU Nanolab staff may access the backside of the machine.		*In E-2, all users must keep within the area between the front side of the machine and the table with the pre-aligner setup. Only JEOL staff or DTU Nanolab staff may access the backside of the machine.
	*No users, not even authorised users, are allowed to load a ~~substrate~~ into the automatic cassette transfer system.		*No users, not even authorised users, are allowed to load a cassette into the automatic cassette transfer system.
	*After your exposure, fully trained users can unload their cassettes from the automatic cassette transfer system and unmount their substrates.		*After your exposure, fully trained users can unload their cassettes from the automatic cassette transfer system and unmount their substrates.
	*If you are unable to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Nanolab personel unmount your substrates.		*If you are unable to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Nanolab personel unmount your substrates.

Thope: /* System calibration */

2023-08-15T12:00:06Z

System calibration

← Older revision		Revision as of 14:00, 15 August 2023
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	<br>		<br>

	=System calibration=		==System calibration==
	After cassette transfer the system has to be calibrated with the chosen beam current condition profile. This is done in a mostly automated sequence with only minute input from the user. The sequence is explained in detail in the following but in overview it is		After cassette transfer the system has to be calibrated with the chosen beam current condition profile. This is done in a mostly automated sequence with only minute input from the user. The sequence is explained in detail in the following but in overview it is

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	*Execute pattern writing		*Execute pattern writing

	==Select and restore the system to the chosen beam current profile==		===Select and restore the system to the chosen beam current profile===
	The SDF specifies which system condition file to use for the exposure, this determines the beam current. Condition files are named according to beam current and beam aperture, for instance '''6nA_ap5''' which will expose at 6 nA using aperture 5. Restoring a condition file for use is done from the '''Calibration''' window, if it is not open it can be opened from the '''EBX Menu'''.		The SDF specifies which system condition file to use for the exposure, this determines the beam current. Condition files are named according to beam current and beam aperture, for instance '''6nA_ap5''' which will expose at 6 nA using aperture 5. Restoring a condition file for use is done from the '''Calibration''' window, if it is not open it can be opened from the '''EBX Menu'''.

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	==System self calibration==		===System self calibration===
	With the correct condition file restored the next step is to measure beam current and verify that it is close to the expected value.		With the correct condition file restored the next step is to measure beam current and verify that it is close to the expected value.

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	Correct execution will look like above. '''INITAE''' uses the beam to scan a PN-junction which the system uses to determine beam position and shape. '''INITBE''' uses the beam to scan a gold marker on the stage which the system uses for position and distortion correction of the beam placement within the writing field. The top row shows the signal, the following rows shows the 1st and 2nd derivative, respectively.		Correct execution will look like above. '''INITAE''' uses the beam to scan a PN-junction which the system uses to determine beam position and shape. '''INITBE''' uses the beam to scan a gold marker on the stage which the system uses for position and distortion correction of the beam placement within the writing field. The top row shows the signal, the following rows shows the 1st and 2nd derivative, respectively.

	== Auto calibration ==		=== Auto calibration ===
	The system can auto calibrate itself using the AE and BE stage marks. The system will automatically measure beam position at various locations of the writing field to determine position errors. A correction matrix will be applied and the beam position will be remeasured to validate the result. The sequence takes about 8 minutes to execute. This should be done every time beam current is changed, i.e. a new condition file is restored. The procedure is		The system can auto calibrate itself using the AE and BE stage marks. The system will automatically measure beam position at various locations of the writing field to determine position errors. A correction matrix will be applied and the beam position will be remeasured to validate the result. The sequence takes about 8 minutes to execute. This should be done every time beam current is changed, i.e. a new condition file is restored. The procedure is

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	==Measure stage drift==		===Measure stage drift===
	The next step is to measure stage drift. This is done from the '''Calibration''' window.		The next step is to measure stage drift. This is done from the '''Calibration''' window.

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	In this example the two drift measurements are made a bit more than 1 minute apart (look at timestamps). The x-axis drift has changed from 65.4 nm to 64.2 nm, i.e. a change of 1.2 nm in about 1 minute. The y-axis drift has changed from 85.3 nm to 86.8 nm, a shift of 1.5 nm in about 1 minute. Thus the drift is about 1-1.5 nm/min in this particular example. This is a typical value. If you experience drift of 5-10 nm/min, give the system 10 min to thermally equilibrate and try again. If drift is above 10 nm/min please call the e-beam personnel for assistance.		In this example the two drift measurements are made a bit more than 1 minute apart (look at timestamps). The x-axis drift has changed from 65.4 nm to 64.2 nm, i.e. a change of 1.2 nm in about 1 minute. The y-axis drift has changed from 85.3 nm to 86.8 nm, a shift of 1.5 nm in about 1 minute. Thus the drift is about 1-1.5 nm/min in this particular example. This is a typical value. If you experience drift of 5-10 nm/min, give the system 10 min to thermally equilibrate and try again. If drift is above 10 nm/min please call the e-beam personnel for assistance.

	==Measure height profile of sample==		===Measure height profile of sample===
	The height of the sample surface must be known to focus the electron beam properly at the surface. This can be done using the '''HEIMAP''' subprogram.		The height of the sample surface must be known to focus the electron beam properly at the surface. This can be done using the '''HEIMAP''' subprogram.

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	The example above will create a 3x3 matrix of height data with a pitch of 1 mm in x and y. After execution the system will display a matrix with height measurement data in µm. Verify that there are no outliers and that variation is less than 100 µm from top to bottom.		The example above will create a 3x3 matrix of height data with a pitch of 1 mm in x and y. After execution the system will display a matrix with height measurement data in µm. Verify that there are no outliers and that variation is less than 100 µm from top to bottom.

	==Save condition file==		===Save condition file===
	For the calibration data to have effect during exposure the data must be saved into the calibration profile. This is done via the '''SAVE''' subprogram from the '''Calibration''' window.		For the calibration data to have effect during exposure the data must be saved into the calibration profile. This is done via the '''SAVE''' subprogram from the '''Calibration''' window.

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	All of the calibration data is now saved and the system is ready for exposure.		All of the calibration data is now saved and the system is ready for exposure.

	==Job execution==		===Job execution===
	The job and the system is now ready to execute the exposure.		The job and the system is now ready to execute the exposure.

Thope: /* Cassette transfer */

2023-08-15T11:59:09Z

Cassette transfer

← Older revision		Revision as of 13:59, 15 August 2023
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	<br>		<br>

	=Cassette transfer=		==Cassette transfer==
	Cassette transfer is controlled from the '''Loader''' program. If it is not open it can be opened from the '''EBX Menu''' by clicking '''Ldr.'''		Cassette transfer is controlled from the '''Loader''' program. If it is not open it can be opened from the '''EBX Menu''' by clicking '''Ldr.'''

Thope: /* Sample mounting */

2023-08-15T11:58:49Z

Sample mounting

← Older revision		Revision as of 13:58, 15 August 2023
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	<br>		<br>

	=Sample mounting=		=Job execution=
			The following sections describe how a substrate is mounted, transfered to the system and exposed.


			==Sample mounting==
	The JEOL 9500 system uses a proprietary sample cassette format and thus each sample must be mounted in an appropriate cassette. Cassettes are available for wafer sizes from 2” to 8”. Smaller chips must be mounted in dedicated chip cassettes with slots of four different sizes available. For more information on available cassettes and their specifications please refer to the [[Specific Process Knowledge/Lithography/EBeamLithography/Cassettes\|JEOL 9500 cassette specifications page.]] As an example the 4" titanium cassette is shown below.		The JEOL 9500 system uses a proprietary sample cassette format and thus each sample must be mounted in an appropriate cassette. Cassettes are available for wafer sizes from 2” to 8”. Smaller chips must be mounted in dedicated chip cassettes with slots of four different sizes available. For more information on available cassettes and their specifications please refer to the [[Specific Process Knowledge/Lithography/EBeamLithography/Cassettes\|JEOL 9500 cassette specifications page.]] As an example the 4" titanium cassette is shown below.

Thope: /* Techical Specification */

2023-03-25T17:48:21Z

Techical Specification

← Older revision		Revision as of 19:48, 25 March 2023
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	*The maximum writing field size is 1000 µm x 1000 µm.		*The maximum writing field size is 1000 µm x 1000 µm.
	*The machine has cassettes for 2", 4", 6" and 8" wafers and also dedicated cassettes for chips with slot dimensions of 4 mm, 8 mm, 12 mm, and 20 mm. See the [[Specific Process Knowledge/Lithography/EBeamLithography/Cassettes\|Cassette specification page for more information.]]		*The machine has cassettes for 2", 4", 6" and 8" wafers and also dedicated cassettes for chips with slot dimensions of 4 mm, 8 mm, 12 mm, and 20 mm. See the [[Specific Process Knowledge/Lithography/EBeamLithography/Cassettes\|Cassette specification page for more information.]]

			The electromagnetic lens system is illustrated below.

Thope: /* Techical Specification */

2023-03-25T17:44:04Z

Techical Specification

← Older revision		Revision as of 19:44, 25 March 2023
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	{\| style="border: none; border-spacing: 0; margin: 1em auto; text-align: center;"		{\| style="border: none; border-spacing: 0; margin: 1em auto; text-align: center;"
	\|-		\|-
	\| [[image:9500Column.png\|~~400px~~]]		\| [[image:9500Column.png\|600px]]
	\|-		\|-
	\| colspan="1" style="text-align:center;\|		\| colspan="1" style="text-align:center;\|

← Older revision		Revision as of 08:55, 14 November 2023
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			'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL 9500 User Guide click here]'''

			Content and illustration by Thomas Pedersen, DTU Nanolab unless otherwise noted.

	[[File:TPE02803.jpg\|right\|400px]]		[[File:TPE02803.jpg\|right\|400px]]

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	\| colspan="2" style="text-align: center;\|		\| colspan="2" style="text-align: center;\|
	Operation screen of the automatic cassette transfer system / auto stocker~~. Photo: Thomas Pedersen~~.		Operation screen of the automatic cassette transfer system / auto stocker.
	\|}		\|}

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	\| colspan="2" style="text-align: center;\|		\| colspan="2" style="text-align: center;\|
	Samples can be loaded into appropriate cassettes on the cassette preparation table~~. Photo: Thomas Pedersen~~.		Samples can be loaded into appropriate cassettes on the cassette preparation table.
	\|}		\|}

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	\| colspan="1" style="text-align:center;\|		\| colspan="1" style="text-align:center;\|
	Nanolab staff member loading the 4" wafer cassette to the automatic cassette transfer system~~. Photo: Thomas Pedersen~~.		Nanolab staff member loading the 4" wafer cassette to the automatic cassette transfer system.
	\|}		\|}

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	\| colspan="2" style="text-align:center;\|		\| colspan="2" style="text-align:center;\|
	'''Calibration''' and '''RESTOR''' windows~~. Image: Thomas Pedersen~~.		'''Calibration''' and '''RESTOR''' windows.
	\|}		\|}

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	\| colspan="1" style="text-align:center;\|		\| colspan="1" style="text-align:center;\|
	Result display of current measurement~~. Image: Thomas Pedersen~~.		Result display of current measurement.
	\|}		\|}

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	\| colspan="2" style="text-align:center;\|		\| colspan="2" style="text-align:center;\|
	Correct result of '''INITAE''' (left) and '''INITBE''' (right)~~. Image: Thomas Pedersen~~.		Correct result of '''INITAE''' (left) and '''INITBE''' (right).
	\|}		\|}

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	\| colspan="1" style="text-align:center;\|		\| colspan="1" style="text-align:center;\|
	Load the '''daily''' batch command and execute it~~. Image: Thomas Pedersen~~.		Load the '''daily''' batch command and execute it.
	\|}		\|}

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	\| colspan="1" style="text-align:center;\|		\| colspan="1" style="text-align:center;\|
	Comparison of two drift measurements~~. Image: Thomas Pedersen~~.		Comparison of two drift measurements.
	\|}		\|}

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	\| colspan="1" style="text-align:center;\|		\| colspan="1" style="text-align:center;\|
	Parameter window of the '''HEIMAP''' subprogram~~. Image: Thomas Pedersen~~.		Parameter window of the '''HEIMAP''' subprogram.
	\|}		\|}

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	\|-		\|-
	\| colspan="1" style="text-align:center;\|		\| colspan="1" style="text-align:center;\|
	Acquire the calibration data and then apply the data to save~~. Image: Thomas Pedersen~~.		Acquire the calibration data and then apply the data to save.
	\|}		\|}

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	\| colspan="1" style="text-align:center;\|		\| colspan="1" style="text-align:center;\|
	'''Expose''' window with .mgn file loaded for exposure. Notice that the '''Progress''' part of the window still shows the previous exposure information. This field will not update until exposure is started~~. Image: Thomas Pedersen~~.		'''Expose''' window with .mgn file loaded for exposure. Notice that the '''Progress''' part of the window still shows the previous exposure information. This field will not update until exposure is started.
	\|}		\|}