Specific Process Knowledge/Lithography/Descum - Revision history

Jehem: /* Decommisioned tools */

2026-01-13T11:31:17Z

Decommisioned tools

← Older revision		Revision as of 13:31, 13 January 2026
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	=Decommisioned tools=		=Decommisioned tools=
	<span style="color:red">Plasma asher 1 was decommissioned 2024-12-02.</span>		<span style="color:red">Plasma asher 1 was decommissioned 2024-12-02.</span>

	[[Specific Process Knowledge/Lithography/Descum/PlasmaAsher1\|Information about decommissioned tool can be found here.]]		[[Specific Process Knowledge/Lithography/Descum/PlasmaAsher1\|Information about decommissioned tool can be found here.]]


	<span style="color:red">Plasma asher 2 was decommissioned 2024-12-02.</span>		<span style="color:red">Plasma asher 2 was decommissioned 2024-12-02.</span>

	[[Specific Process Knowledge/Lithography/Descum/PlasmaAsher2\|Information about decommissioned tool can be found here.]]		[[Specific Process Knowledge/Lithography/Descum/PlasmaAsher2\|Information about decommissioned tool can be found here.]]
	<br clear="all" />		<br clear="all" />

Jehem at 10:29, 12 January 2026

2026-01-12T10:29:14Z

← Older revision		Revision as of 12:29, 12 January 2026
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	__TOC__		__TOC__

			= Descum Comparison Table =
			{\| class="wikitable"
			\|-
			!
			! [[Specific_Process_Knowledge/Lithography/Descum#Plasma Asher 3: Descum\|Plasma Asher 3: Descum]]
			! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher 4\|Plasma Asher 4 (Clean)]]
			! [[Specific_Process_Knowledge/Lithography/Descum#Plasma Asher 5\|Plasma Asher 5 (Dirty)]]
			\|-
			! scope=row style="text-align: left;" \| Purpose
			\| Resist descum
			\|
			*Resist stripping
			*Resist descum
			\|
			*Resist stripping
			*Resist descum
			\|-
			! scope=row style="text-align: left;" \| Method
			\| Plasma ashing
			\| Plasma ashing
			\| Plasma ashing
			\|-
			! scope=row style="text-align: left;" \| Process gasses
			\| O<sub>2</sub> (50 sccm)
			\|
			*O<sub>2</sub> (0-500 sccm)
			*N<sub>2</sub> (0-500 sccm)
			\|
			*O<sub>2</sub> (0-500 sccm)
			*N<sub>2</sub> (0-500 sccm)
			*CF<sub>4</sub> (0-200 sccm)
			\|-
			! scope=row style="text-align: left;" \| Process power
			\| 10-100 W (10-100%)
			\| 150-1000 W
			\| 150-1000 W
			\|-
			! scope=row style="text-align: left;" \| Substrate batch
			\|
			*Chips: several
			*50 mm wafer: several
			*100 mm wafer: 1
			\|
			*Chips: several
			*50 mm wafer: several
			*100 mm wafer: 1-25
			*150 mm wafer: 1-25
			*200 mm wafer: 1-25
			\|
			*Chips: several
			*50 mm wafer: several
			*100 mm wafer: 1-25
			*150 mm wafer: 1-25
			*200 mm wafer: 1-25
			\|-
			! scope=row style="text-align: left;" \| Substrate materials
			\|
			*<span style="color:red">'''No polymer substrates'''</span><br>
			*Silicon substrates
			*III-V substrates
			*Glass substrates
			*Films, or patterned films, of any material except type IV (Pb, Te)
			\|
			*<span style="color:red">'''No metals'''</span><br>
			*<span style="color:red">'''No metal oxides'''</span><br>
			*<span style="color:red">'''No III-V materials'''</span><br>
			*Silicon substrates
			*Glass substrates
			*Polymer substrates
			*Films, or patterned films, of resists/polymers
			\|
			*Silicon substrates
			*III-V substrates
			*Glass substrates
			*Polymer substrates
			*Films, or patterned films, of any material except type IV (Pb, Te)
			\|}
			<br clear="all" />

	{{:Specific Process Knowledge/Lithography/Descum/plasmaAsher03}}		{{:Specific Process Knowledge/Lithography/Descum/plasmaAsher03}}

Jehem at 10:14, 12 January 2026

2026-01-12T10:14:45Z

Show changes

Jehem at 10:11, 12 January 2026

2026-01-12T10:11:33Z

@@ Line 7: / Line 7: @@
 __TOC__
 =Plasma Asher 3: Descum=
@@ Line 240: / Line 228: @@
 Plasma asher 5 is identical to plasma asher 4, see descum processing for plasma asher 4 [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_4|here]].

Jehem: /* Comparison of ashing rate between substrate sizes */

2025-03-06T14:39:38Z

Comparison of ashing rate between substrate sizes

← Older revision		Revision as of 16:39, 6 March 2025
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	==Comparison of ashing rate between substrate sizes==		==Comparison of ashing rate between substrate sizes==
	It is assumed that the low power descum rates, for different substrate sizes, follows the same pattern as the high power ashing rates, which ~~cab~~ be seen [[Specific_Process_Knowledge/Lithography/Strip#Comparison_of_ashing_rate_between_substrate_sizes_for_plasma_asher_4_&_5\|here]].		It is assumed that the low power descum rates, for different substrate sizes, follows the same pattern as the high power ashing rates, which can be seen [[Specific_Process_Knowledge/Lithography/Strip#Comparison_of_ashing_rate_between_substrate_sizes_for_plasma_asher_4_&_5\|here]].

	=Plasma Asher 5=		=Plasma Asher 5=

Jehem: /* Comparison of ashing rate between substrate sizes */

2025-03-06T14:39:27Z

Comparison of ashing rate between substrate sizes

← Older revision		Revision as of 16:39, 6 March 2025
Line 233:		Line 233:

	==Comparison of ashing rate between substrate sizes==		==Comparison of ashing rate between substrate sizes==
	It is assumed that the low power descum rates for different substrate sizes follows the same pattern, as the high power ashing rates, which cab be seen [[Specific_Process_Knowledge/Lithography/Strip#Comparison_of_ashing_rate_between_substrate_sizes_for_plasma_asher_4_&_5\|here]].		It is assumed that the low power descum rates, for different substrate sizes, follows the same pattern as the high power ashing rates, which cab be seen [[Specific_Process_Knowledge/Lithography/Strip#Comparison_of_ashing_rate_between_substrate_sizes_for_plasma_asher_4_&_5\|here]].

	=Plasma Asher 5=		=Plasma Asher 5=

Jehem: /* Comparison of ashing rate between substrate sizes */

2025-03-06T14:39:01Z

Comparison of ashing rate between substrate sizes

← Older revision		Revision as of 16:39, 6 March 2025
Line 233:		Line 233:

	==Comparison of ashing rate between substrate sizes==		==Comparison of ashing rate between substrate sizes==
	[[Specific_Process_Knowledge/Lithography/Strip#Comparison_of_ashing_rate_between_substrate_sizes_for_plasma_asher_4_&_5\|~~Comparison~~]]		It is assumed that the low power descum rates for different substrate sizes follows the same pattern, as the high power ashing rates, which cab be seen [[Specific_Process_Knowledge/Lithography/Strip#Comparison_of_ashing_rate_between_substrate_sizes_for_plasma_asher_4_&_5\|here]].

	=Plasma Asher 5=		=Plasma Asher 5=

Jehem: /* Comparison of ashing rate between substrate sizes */

2025-03-06T14:29:16Z

Comparison of ashing rate between substrate sizes

← Older revision		Revision as of 16:29, 6 March 2025
Line 233:		Line 233:

	==Comparison of ashing rate between substrate sizes==		==Comparison of ashing rate between substrate sizes==
	[[Specific_Process_Knowledge/Lithography/Strip#~~Process_temperature_for_plasma_asher_4_~~&_5\|Comparison]]		[[Specific_Process_Knowledge/Lithography/Strip#Comparison_of_ashing_rate_between_substrate_sizes_for_plasma_asher_4_&_5\|Comparison]]

	=Plasma Asher 5=		=Plasma Asher 5=

Jehem: /* Plasma Asher 4 */

2025-03-06T14:28:34Z

Plasma Asher 4

← Older revision		Revision as of 16:28, 6 March 2025
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	<br clear="all" />		<br clear="all" />

			==Comparison of ashing rate between substrate sizes==
			[[Specific_Process_Knowledge/Lithography/Strip#Process_temperature_for_plasma_asher_4_&_5\|Comparison]]

	=Plasma Asher 5=		=Plasma Asher 5=

Jehem: /* Plasma Asher 5 */

2025-03-04T09:55:23Z

Plasma Asher 5

← Older revision		Revision as of 11:55, 4 March 2025
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	=Plasma Asher 5=		=Plasma Asher 5=
			Product name: PVA Tepla Gigabatch 380M<br>
			Year of purchase: 2024

	Plasma asher 5 is identical to plasma asher 4, see descum processing for plasma asher 4 [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_4\|here]].		Plasma asher 5 is identical to plasma asher 4, see descum processing for plasma asher 4 [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_4\|here]].