Specific Process Knowledge/Lithography/DUVStepperLithography/Reticle Design - Revision history

Jehem: /* Reticle Design */

2023-02-03T12:40:56Z

Reticle Design

← Older revision		Revision as of 14:40, 3 February 2023
Line 16:		Line 16:
	If the pattern of the reticle must be aligned to another one - that is already located on the wafer - the wafer will need to be equipped with several alignment marks(one TVPA mark and two AGA marks in x and y direction), preferable for every chip. The stepper can only recognize the approved alignment marks Therefore use only these marks as TVPA [[Media:TVPA_Small_Line_Mag5_P.pdf‎]] and AGA [[Media:20P4_F_Mag5_P.pdf]] .		If the pattern of the reticle must be aligned to another one - that is already located on the wafer - the wafer will need to be equipped with several alignment marks(one TVPA mark and two AGA marks in x and y direction), preferable for every chip. The stepper can only recognize the approved alignment marks Therefore use only these marks as TVPA [[Media:TVPA_Small_Line_Mag5_P.pdf‎]] and AGA [[Media:20P4_F_Mag5_P.pdf]] .

	A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found [https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Canon_Stepper_Reticle_Guide_v0_03.pdf here].		A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found [https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Canon_Stepper_Reticle_Guide_v0_03.pdf here] - '''requires login'''

	Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Nanolab, so that they can verify the mask design and order the mask.		Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Nanolab, so that they can verify the mask design and order the mask.

Jehem: /* Reticle Design */

2023-02-03T12:40:42Z

Reticle Design

← Older revision		Revision as of 14:40, 3 February 2023
Line 16:		Line 16:
	If the pattern of the reticle must be aligned to another one - that is already located on the wafer - the wafer will need to be equipped with several alignment marks(one TVPA mark and two AGA marks in x and y direction), preferable for every chip. The stepper can only recognize the approved alignment marks Therefore use only these marks as TVPA [[Media:TVPA_Small_Line_Mag5_P.pdf‎]] and AGA [[Media:20P4_F_Mag5_P.pdf]] .		If the pattern of the reticle must be aligned to another one - that is already located on the wafer - the wafer will need to be equipped with several alignment marks(one TVPA mark and two AGA marks in x and y direction), preferable for every chip. The stepper can only recognize the approved alignment marks Therefore use only these marks as TVPA [[Media:TVPA_Small_Line_Mag5_P.pdf‎]] and AGA [[Media:20P4_F_Mag5_P.pdf]] .

	A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found ~~here: [~~[~~Media~~:Canon_Stepper_Reticle_Guide_v0_03.pdf]].		A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found [https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Canon_Stepper_Reticle_Guide_v0_03.pdf here].

	Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Nanolab, so that they can verify the mask design and order the mask.		Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Nanolab, so that they can verify the mask design and order the mask.

Jehem at 11:37, 3 February 2023

2023-02-03T11:37:09Z

← Older revision		Revision as of 13:37, 3 February 2023
Line 1:		Line 1:
	~~Feedback to this page~~:~~'''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge~~/Lithography/~~DUVStepperLithography/Reticle_Design click here]'''~~		{{:Specific Process Knowledge/Lithography/authors_generic}}

			'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/DUVStepperLithography/Reticle_Design click here]'''

			[[Category: Equipment\|Lithography]]
			[[Category: Lithography]]

			__TOC__

	== Reticle Design ==		== Reticle Design ==

Jmli at 18:32, 25 November 2019

2019-11-25T18:32:12Z

← Older revision		Revision as of 20:32, 25 November 2019
Line 1:		Line 1:
	Feedback to this page:'''[mailto:labadviser@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.~~danchip~~.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography/Reticle_Design click here]'''		Feedback to this page:'''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography/Reticle_Design click here]'''


Line 12:		Line 12:
	A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found here: [[Media:Canon_Stepper_Reticle_Guide_v0_03.pdf]].		A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found here: [[Media:Canon_Stepper_Reticle_Guide_v0_03.pdf]].

	Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of ~~Danchip~~, so that they can verify the mask design and order the mask.		Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Nanolab, so that they can verify the mask design and order the mask.

Elkh: /* Reticle Design */

2018-08-16T09:30:24Z

Reticle Design

← Older revision		Revision as of 11:30, 16 August 2018
Line 8:		Line 8:
	The whole reticle can be regarded as one chip that might be printed one time onto the wafer or repeatedly - step-by-step - in a two dimensional array. Alternatively, different chips can be placed onto the reticle, separated by frames. These chips can be printed individually onto the wafer either as one chip or as an array. Then the individual chips of the design have to be surrounded by frames. Additionally, the pattern of two or more different reticles can be combined on one wafer.		The whole reticle can be regarded as one chip that might be printed one time onto the wafer or repeatedly - step-by-step - in a two dimensional array. Alternatively, different chips can be placed onto the reticle, separated by frames. These chips can be printed individually onto the wafer either as one chip or as an array. Then the individual chips of the design have to be surrounded by frames. Additionally, the pattern of two or more different reticles can be combined on one wafer.

	If the pattern of the reticle must be aligned to another one - that is already located on the wafer - the wafer will need to be equipped with several alignment marks(one TVPA mark and two AGA marks in x and y direction), preferable for every chip. The stepper can only recognize the approved alignment marks Therefore use only these marks as TVPA [[Media:TVPA_Small_Line_Mag5_P.pdf‎]] and AGA [[Media:~~TVPA_Small_Line_Mag5_P~~.~~pdf‎~~]] .		If the pattern of the reticle must be aligned to another one - that is already located on the wafer - the wafer will need to be equipped with several alignment marks(one TVPA mark and two AGA marks in x and y direction), preferable for every chip. The stepper can only recognize the approved alignment marks Therefore use only these marks as TVPA [[Media:TVPA_Small_Line_Mag5_P.pdf‎]] and AGA [[Media:20P4_F_Mag5_P.pdf]] .

	A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found here: [[Media:Canon_Stepper_Reticle_Guide_v0_03.pdf]].		A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found here: [[Media:Canon_Stepper_Reticle_Guide_v0_03.pdf]].

	Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Danchip, so that they can verify the mask design and order the mask.		Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Danchip, so that they can verify the mask design and order the mask.

Elkh: /* Reticle Design */

2018-08-16T09:22:08Z

Reticle Design

← Older revision		Revision as of 11:22, 16 August 2018
Line 8:		Line 8:
	The whole reticle can be regarded as one chip that might be printed one time onto the wafer or repeatedly - step-by-step - in a two dimensional array. Alternatively, different chips can be placed onto the reticle, separated by frames. These chips can be printed individually onto the wafer either as one chip or as an array. Then the individual chips of the design have to be surrounded by frames. Additionally, the pattern of two or more different reticles can be combined on one wafer.		The whole reticle can be regarded as one chip that might be printed one time onto the wafer or repeatedly - step-by-step - in a two dimensional array. Alternatively, different chips can be placed onto the reticle, separated by frames. These chips can be printed individually onto the wafer either as one chip or as an array. Then the individual chips of the design have to be surrounded by frames. Additionally, the pattern of two or more different reticles can be combined on one wafer.

	If the pattern of the reticle must be aligned to another one - that is already located on the wafer - the wafer will need to be equipped with several alignment marks(one TVPA mark and two AGA marks in x and y direction), preferable for every chip. The stepper can only recognize the approved alignment marks Therefore use only these marks as TVPA [[Media:TVPA_Small_Line_Mag5_P.pdf‎]].		If the pattern of the reticle must be aligned to another one - that is already located on the wafer - the wafer will need to be equipped with several alignment marks(one TVPA mark and two AGA marks in x and y direction), preferable for every chip. The stepper can only recognize the approved alignment marks Therefore use only these marks as TVPA [[Media:TVPA_Small_Line_Mag5_P.pdf‎]] and AGA [[Media:TVPA_Small_Line_Mag5_P.pdf‎]] .

	A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found here: [[Media:Canon_Stepper_Reticle_Guide_v0_03.pdf]].		A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found here: [[Media:Canon_Stepper_Reticle_Guide_v0_03.pdf]].

	Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Danchip, so that they can verify the mask design and order the mask.		Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Danchip, so that they can verify the mask design and order the mask.

Elkh: /* Reticle Design */

2018-08-16T09:21:05Z

Reticle Design

← Older revision		Revision as of 11:21, 16 August 2018
Line 8:		Line 8:
	The whole reticle can be regarded as one chip that might be printed one time onto the wafer or repeatedly - step-by-step - in a two dimensional array. Alternatively, different chips can be placed onto the reticle, separated by frames. These chips can be printed individually onto the wafer either as one chip or as an array. Then the individual chips of the design have to be surrounded by frames. Additionally, the pattern of two or more different reticles can be combined on one wafer.		The whole reticle can be regarded as one chip that might be printed one time onto the wafer or repeatedly - step-by-step - in a two dimensional array. Alternatively, different chips can be placed onto the reticle, separated by frames. These chips can be printed individually onto the wafer either as one chip or as an array. Then the individual chips of the design have to be surrounded by frames. Additionally, the pattern of two or more different reticles can be combined on one wafer.

	If the pattern of the reticle must be aligned to another one - that is already located on the wafer - the wafer will need to be equipped with several alignment marks. A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found here: [[Media:Canon_Stepper_Reticle_Guide_v0_03.pdf]].		If the pattern of the reticle must be aligned to another one - that is already located on the wafer - the wafer will need to be equipped with several alignment marks(one TVPA mark and two AGA marks in x and y direction), preferable for every chip. The stepper can only recognize the approved alignment marks Therefore use only these marks as TVPA [[Media:TVPA_Small_Line_Mag5_P.pdf‎]].

			A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found here: [[Media:Canon_Stepper_Reticle_Guide_v0_03.pdf]].

	Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Danchip, so that they can verify the mask design and order the mask.		Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Danchip, so that they can verify the mask design and order the mask.

Makei at 10:46, 27 May 2016

2016-05-27T10:46:57Z

← Older revision		Revision as of 12:46, 27 May 2016
Line 1:		Line 1:
	Feedback to this page:'''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography/Reticle_Design click here]'''		Feedback to this page:'''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography/Reticle_Design click here]'''




	~~=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png\|200px]]=~~

	== Reticle Design ==		== Reticle Design ==

Makei: /* Reticle Design */

2016-05-27T10:42:34Z

Reticle Design

← Older revision		Revision as of 12:42, 27 May 2016
Line 12:		Line 12:
	The whole reticle can be regarded as one chip that might be printed one time onto the wafer or repeatedly - step-by-step - in a two dimensional array. Alternatively, different chips can be placed onto the reticle, separated by frames. These chips can be printed individually onto the wafer either as one chip or as an array. Then the individual chips of the design have to be surrounded by frames. Additionally, the pattern of two or more different reticles can be combined on one wafer.		The whole reticle can be regarded as one chip that might be printed one time onto the wafer or repeatedly - step-by-step - in a two dimensional array. Alternatively, different chips can be placed onto the reticle, separated by frames. These chips can be printed individually onto the wafer either as one chip or as an array. Then the individual chips of the design have to be surrounded by frames. Additionally, the pattern of two or more different reticles can be combined on one wafer.

	If the pattern of the reticle must be aligned to another one - that is already located on the wafer - the wafer will need to be equipped with several alignment marks. A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found here: [[~~File~~:Canon_Stepper_Reticle_Guide_v0_03.pdf]].		If the pattern of the reticle must be aligned to another one - that is already located on the wafer - the wafer will need to be equipped with several alignment marks. A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found here: [[Media:Canon_Stepper_Reticle_Guide_v0_03.pdf]].

	Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Danchip, so that they can verify the mask design and order the mask.		Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Danchip, so that they can verify the mask design and order the mask.

Makei at 12:07, 9 May 2016

2016-05-09T12:07:03Z

← Older revision		Revision as of 14:07, 9 May 2016
Line 5:		Line 5:

	=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png\|200px]]=		=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png\|200px]]=

			== Reticle Design ==

			A DUV reticle is needed that should be designed by the customer. Please note that the projection magnification of the stepper is 1:5, so that the dimensions of the pattern on the reticle are expanded by a factor 5 with respect to those printed on the wafer.

			The whole reticle can be regarded as one chip that might be printed one time onto the wafer or repeatedly - step-by-step - in a two dimensional array. Alternatively, different chips can be placed onto the reticle, separated by frames. These chips can be printed individually onto the wafer either as one chip or as an array. Then the individual chips of the design have to be surrounded by frames. Additionally, the pattern of two or more different reticles can be combined on one wafer.

			If the pattern of the reticle must be aligned to another one - that is already located on the wafer - the wafer will need to be equipped with several alignment marks. A guide for preparing reticle files for the Canon FPA-3000EX4 stepper, having the correct dimensions and positions of the individual patterns, frames and alignment marks can be found here: [[File:Canon_Stepper_Reticle_Guide_v0_03.pdf]].

			Usually the reticle is fabricated by an external company. It is recommended to send the mask design in GDS format to the Photolith group of Danchip, so that they can verify the mask design and order the mask.