Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma DUV processing - Revision history

Taran: /* Spin coating */

2025-08-25T13:01:45Z

Spin coating

← Older revision		Revision as of 15:01, 25 August 2025
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	*Spin-off		*Spin-off

	The wafer is first centered on the spindle chuck and held in place by vacuum. If static dispense is specified in the process, the spindle remains static during the ensuing resist dispense. In the case of dynamic dispense, the spindle is accelerated to a low spin speed before the resist is dispensed. Using too high spin speed during dispense can cause surface wetting issues, while a too low spin speed causes the resist to flow onto the backside of the wafer. The resist is dispensed through the dispense arm, positioned over the center of the wafer. The resist ~~pump administers~~ a volume of resist which depends on the substrate size.		The wafer is first centered on the spindle chuck and held in place by vacuum. If static dispense is specified in the process, the spindle remains static during the ensuing resist dispense. In the case of dynamic dispense, the spindle is accelerated to a low spin speed before the resist is dispensed. Using too high spin speed during dispense can cause surface wetting issues, while a too low spin speed causes the resist to flow onto the backside of the wafer. The resist is dispensed through the dispense arm, positioned over the center of the wafer. The resist line dispenses a volume of resist which depends on the substrate size.

	The spin-off cycle determines the thickness of the resist coating. The thickness is primarily a function of the spin-off speed and the spin-off time, both following an inverse power-law. The acceleration to the spin-off speed also influences the thickness, but the effect is dependent on previous steps. The spin-off is usually a simple spin at one speed, but it may be comprised of several steps at different spin speeds. After spin-off, the wafer is decelerated.		The spin-off cycle determines the thickness of the resist coating. The thickness is primarily a function of the spin-off speed and the spin-off time, both following an inverse power-law. The acceleration to the spin-off speed also influences the thickness, but the effect is dependent on previous steps. The spin-off is usually a simple spin at one speed, but it may be comprised of several steps at different spin speeds. After spin-off, the wafer is decelerated.

	Dependent on the spin speeds used in the various steps of the spin coating, resist may creep over the edge of the wafer and onto the backside. Also, some resists tend to leave fine strings of resist protruding from the edge of the wafer, or folded onto the backside, an effect sometimes referred to as "cotton candy". This resist will contaminate the soft bake hotplate, and thus subsequent wafers with resist.		Dependent on the spin speeds used in the various steps of the spin coating, resist may creep over the edge of the wafer and onto the backside. Also, some resists tend to leave fine strings of resist protruding from the edge of the wafer, or folded onto the backside, an effect sometimes referred to as "cotton candy". This resist will contaminate the soft bake hotplate, and thus subsequent wafers, with resist. In such cases, backside rinse should be included in the recipe and/or proximity bake should be used.

	==Soft baking==		==Soft baking==

Jehem at 11:35, 3 February 2023

2023-02-03T11:35:24Z

← Older revision		Revision as of 13:35, 3 February 2023
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	{{:Specific Process Knowledge/Lithography/authors_generic}}		{{:Specific Process Knowledge/Lithography/authors_generic}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Coaters/~~Spin Coater~~: ~~Gamma DUV processing~~ click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing click here]'''

	[[Category: Equipment\|Lithography]]		[[Category: Equipment\|Lithography]]

Jehem at 11:34, 3 February 2023

2023-02-03T11:34:47Z

← Older revision		Revision as of 13:34, 3 February 2023
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			{{:Specific Process Knowledge/Lithography/authors_generic}}

			'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Coaters/Spin Coater: Gamma DUV processing click here]'''

			[[Category: Equipment\|Lithography]]
			[[Category: Lithography]]

			__TOC__

	=General Process Information=		=General Process Information=
	Processing using Spin Coater: Süss stepper is divided into two parts:		Processing using Spin Coater: Süss stepper is divided into two parts:

Jehem: /* Spin coating */

2023-02-02T14:42:18Z

Spin coating

← Older revision		Revision as of 16:42, 2 February 2023
Line 12:		Line 12:
	The wafer is first centered on the spindle chuck and held in place by vacuum. If static dispense is specified in the process, the spindle remains static during the ensuing resist dispense. In the case of dynamic dispense, the spindle is accelerated to a low spin speed before the resist is dispensed. Using too high spin speed during dispense can cause surface wetting issues, while a too low spin speed causes the resist to flow onto the backside of the wafer. The resist is dispensed through the dispense arm, positioned over the center of the wafer. The resist pump administers a volume of resist which depends on the substrate size.		The wafer is first centered on the spindle chuck and held in place by vacuum. If static dispense is specified in the process, the spindle remains static during the ensuing resist dispense. In the case of dynamic dispense, the spindle is accelerated to a low spin speed before the resist is dispensed. Using too high spin speed during dispense can cause surface wetting issues, while a too low spin speed causes the resist to flow onto the backside of the wafer. The resist is dispensed through the dispense arm, positioned over the center of the wafer. The resist pump administers a volume of resist which depends on the substrate size.

	The spin-off cycle determines the thickness of the resist coating. The thickness is primarily a function of the spin-off speed and the spin-off time, both following an inverse power-law ~~(y=k*x^-a)~~. The acceleration to the spin-off speed also influences the thickness, but the effect is dependent on previous steps. The spin-off is usually a simple spin at one speed, but it may be comprised of several steps at different spin speeds. After spin-off, the wafer is decelerated.		The spin-off cycle determines the thickness of the resist coating. The thickness is primarily a function of the spin-off speed and the spin-off time, both following an inverse power-law. The acceleration to the spin-off speed also influences the thickness, but the effect is dependent on previous steps. The spin-off is usually a simple spin at one speed, but it may be comprised of several steps at different spin speeds. After spin-off, the wafer is decelerated.

	Dependent on the spin speeds used in the various steps of the spin coating, resist may creep over the edge of the wafer and onto the backside. Also, some resists tend to leave fine strings of resist protruding from the edge of the wafer, or folded onto the backside, an effect sometimes referred to as "cotton candy". This resist will contaminate the soft bake hotplate, and thus subsequent wafers with resist.		Dependent on the spin speeds used in the various steps of the spin coating, resist may creep over the edge of the wafer and onto the backside. Also, some resists tend to leave fine strings of resist protruding from the edge of the wafer, or folded onto the backside, an effect sometimes referred to as "cotton candy". This resist will contaminate the soft bake hotplate, and thus subsequent wafers with resist.

	==Soft baking==		==Soft baking==

Jehem: /* Quality Control (QC) */

2023-02-02T14:05:26Z

Quality Control (QC)

← Older revision		Revision as of 16:05, 2 February 2023
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	\|-		\|-
	\|		\|
	*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>		*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper] - '''requires login'''<br>
	*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]		*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper] - '''requires login'''
	{\| {{table}}		{\| {{table}}
	\| align="center" \|		\| align="center" \|
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	\|-		\|-
	\|		\|
	*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>		*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper] - '''requires login'''<br>
	*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]		*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper] - '''requires login'''
	{\| {{table}}		{\| {{table}}
	\| align="center" \|		\| align="center" \|

Jehem: /* Standard Processes */

2023-01-30T09:29:04Z

Standard Processes

← Older revision		Revision as of 11:29, 30 January 2023
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	=Standard Processes=		=Standard Processes=
			BARC DUV42S-6 coating sequences:
			*'''(1201) DCH 150mm BARC 65nm''' Dispense 3ml@1000rpm; spin-off 30s@4700rpm; softbake 60s@175°C
			*'''(1202) DCH 100mm BARC 65nm''' Dispense 1.6ml@1000rpm; spin-off 30s@3000rpm; softbake 60s@175°C
			KRF M230Y coating sequences:
			*'''(1301) DCH 150mm M230Y 360nm''' Dispense 3ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C
			*'''(1302) DCH 100mm M230Y 360nm''' Dispense 1ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C
			KRF M35G coating sequences:
			*'''(1401) DCH 150mm M35G 750nm''' Dispense 3ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
			*'''(1402) DCH 100mm M35G 750nm''' Dispense 1ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
			*'''(1403) DCH 150mm M35G 1000nm''' Dispense 3ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
			*'''(1404) DCH 100mm M35G 1000nm''' Dispense 1ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
			*'''(1405) DCH 150mm M35G 1400nm''' Dispense 3ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C
			*'''(1406) DCH 100mm M35G 1400nm''' Dispense 1ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C

Jehem: /* Quality Control (QC) */

2023-01-30T09:28:37Z

Quality Control (QC)

← Older revision		Revision as of 11:28, 30 January 2023
Line 20:		Line 20:

	=Quality Control (QC)=		=Quality Control (QC)=
			{\| border="1" cellspacing="2" cellpadding="2" colspan="3"
			\|bgcolor="#98FB98" \|'''Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6'''
			\|-
			\|
			*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>
			*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]
			{\| {{table}}
			\| align="center" \|
			{\| border="1" cellspacing="1" cellpadding="2" align="center" style="width:400px"

			! QC Recipe:
			! (1201) DCH 150mm BARC 65nm
			\|-
			\|Substrate size
			\|6"
			\|-
			\|Resist volume
			\|3 ml
			\|-
			\|Spin-off speed
			\|4700 rpm
			\|-
			\|Spin-off time
			\|30 s
			\|-
			\|Soft bake temperature
			\|175°C, contact
			\|-
			\|Soft bake time
			\|60 s
			\|-
			\|}
			\| align="center" valign="top"\|
			{\| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
			!QC limits
			!Spin coater: Süss Stepper - BARC DUV42S-6
			\|-
			\|Nominal film thickness
			\|65 nm
			\|-
			\|Film thickness deviation from nominal
			\|<15%
			\|-
			\|Film thickness non-uniformity
			\|<5%
			\|-
			\|}
			\|-
			\|}
			Spin-off speed will be adjusted if film thickness is outside the limit.
			\|}



			{\| border="1" cellspacing="2" cellpadding="2" colspan="3"
			\|bgcolor="#98FB98" \|'''Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6'''
			\|-
			\|
			*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>
			*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]
			{\| {{table}}
			\| align="center" \|
			{\| border="1" cellspacing="1" cellpadding="2" align="center" style="width:400px"

			! QC Recipe:
			! (1202) DCH 100mm BARC 65nm
			\|-
			\|Substrate size
			\|4"
			\|-
			\|Resist volume
			\|1.6 ml
			\|-
			\|Spin-off speed
			\|3000 rpm
			\|-
			\|Spin-off time
			\|30 s
			\|-
			\|Soft bake temperature
			\|175°C, contact
			\|-
			\|Soft bake time
			\|60 s
			\|-
			\|}
			\| align="center" valign="top"\|
			{\| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
			!QC limits
			!Spin coater: Süss Stepper - BARC DUV42S-6
			\|-
			\|Nominal film thickness
			\|65 nm
			\|-
			\|Film thickness deviation from nominal
			\|<15%
			\|-
			\|Film thickness non-uniformity
			\|<5%
			\|-
			\|}
			\|-
			\|}
			Spin-off speed will be adjusted if film thickness is outside the limit.
			\|}

	=Standard Processes=		=Standard Processes=

Jehem: Created page with "=General Process Information= Processing using Spin Coater: Süss stepper is divided into two parts: Spin coating Soft baking ==Spin coating== The process of spin coating on Spin Coater: GSüss stepper consists of a selection of the following steps: Acceleration to a low spin speed if dynamic dispense is used Resist dispense *Spin-off The wafer is first centered on the spindle chuck and held in place by vacuum. If static dispense is specified in the process, the sp..."

2023-01-30T09:28:04Z

Created page with "=General Process Information= Processing using Spin Coater: Süss stepper is divided into two parts: *Spin coating *Soft baking ==Spin coating== The process of spin coating on Spin Coater: GSüss stepper consists of a selection of the following steps: *Acceleration to a low spin speed if dynamic dispense is used *Resist dispense *Spin-off The wafer is first centered on the spindle chuck and held in place by vacuum. If static dispense is specified in the process, the sp..."

New page

=General Process Information=
Processing using Spin Coater: Süss stepper is divided into two parts:
*Spin coating
*Soft baking

==Spin coating==
The process of spin coating on Spin Coater: GSüss stepper consists of a selection of the following steps:
*Acceleration to a low spin speed if dynamic dispense is used
*Resist dispense
*Spin-off

The wafer is first centered on the spindle chuck and held in place by vacuum. If static dispense is specified in the process, the spindle remains static during the ensuing resist dispense. In the case of dynamic dispense, the spindle is accelerated to a low spin speed before the resist is dispensed. Using too high spin speed during dispense can cause surface wetting issues, while a too low spin speed causes the resist to flow onto the backside of the wafer. The resist is dispensed through the dispense arm, positioned over the center of the wafer. The resist pump administers a volume of resist which depends on the substrate size.

The spin-off cycle determines the thickness of the resist coating. The thickness is primarily a function of the spin-off speed and the spin-off time, both following an inverse power-law (y=k*x^-a). The acceleration to the spin-off speed also influences the thickness, but the effect is dependent on previous steps. The spin-off is usually a simple spin at one speed, but it may be comprised of several steps at different spin speeds. After spin-off, the wafer is decelerated.

Dependent on the spin speeds used in the various steps of the spin coating, resist may creep over the edge of the wafer and onto the backside. Also, some resists tend to leave fine strings of resist protruding from the edge of the wafer, or folded onto the backside, an effect sometimes referred to as "cotton candy". This resist will contaminate the soft bake hotplate, and thus subsequent wafers with resist.

==Soft baking==
After spin coating, the solvent in the resist formulation must be evaporated in a baking step in order to solidify the resist. This soft bake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface while resting on shallow bumps only 150µm above the hotplate. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake. The hotplate temperatures of the baking modules of Spin Coater: Süss stepper are set at temperatures relevant to the resist used, typically 130-175°C. After baking, the wafer is cooled on the cool plate.

=Quality Control (QC)=

=Standard Processes=