Specific Process Knowledge/Lithography/Coaters/RCD8 - Revision history

Taran: /* Equipment performance and process related parameters */

2025-11-03T08:23:43Z

Equipment performance and process related parameters

← Older revision		Revision as of 10:23, 3 November 2025
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	\|style="background:LightGrey; color:black"\|Coating thickness		\|style="background:LightGrey; color:black"\|Coating thickness
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	* SU-8 ~~resits~~: 0.1-200+ µm		* SU-8 resists: 0.1-200+ µm
	* AZ 5214E: 1.5-3 µm		* AZ 5214E: 1.5-3 µm
	* AZ 4562: 8-15 µm		* AZ 4562: 8-15 µm

Taran: /* Process information */

2025-08-27T09:57:34Z

Process information

← Older revision		Revision as of 11:57, 27 August 2025
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	===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing\|Process information]]===		===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing\|Process information]]===
	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating\|Spin coating]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating\|Spin coating]]
	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#~~Automatic dispense~~\|~~Automatic dispense~~]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Dispense\|Dispense]]
	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes\|Recipes and templates]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes\|Recipes and templates]]
	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results\|Processing results]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results\|Processing results]]

Taran: /* Spin Coater: RCD8 */

2025-08-25T14:23:41Z

Spin Coater: RCD8

← Older revision		Revision as of 16:23, 25 August 2025
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	*Spin coating of PGMEA based AZ resists		*Spin coating of PGMEA based AZ resists
	*Spin coating of wafers with structured backside		*Spin coating of wafers with structured backside
	*Edge bead removal		*(Edge bead removal)
	\|-		\|-
	!style="background:silver; color:black;" align="center" width="60"\|Resist		!style="background:silver; color:black;" align="center" width="60"\|Resist
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	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	* manual dispense		* manual dispense
	* automatic dispense from syringe		* <strike>automatic dispense from syringe</strike>
	\|-		\|-
	!style="background:silver; color:black" align="center" valign="center" rowspan="1"\|Performance		!style="background:silver; color:black" align="center" valign="center" rowspan="1"\|Performance

Taran: /* Spin Coater: RCD8 */

2025-08-25T14:19:33Z

Spin Coater: RCD8

← Older revision		Revision as of 16:19, 25 August 2025
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	==Spin Coater: RCD8==		==Spin Coater: RCD8==
	[[Image:Spinner_RCD8_C-1.jpg\|400px\|thumb\|Spin coater: RCD8 is located in C-1]]		[[Image:Spinner_RCD8_C-1.jpg\|400px\|thumb\|Spin coater: RCD8 is located in E-4]]

	Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. The media arm was disabled in 2024.		Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. The media arm was disabled in 2024.

Taran: /* Spin Coater: RCD8 */

2025-08-25T14:19:13Z

Spin Coater: RCD8

← Older revision		Revision as of 16:19, 25 August 2025
Line 2:		Line 2:
	[[Image:Spinner_RCD8_C-1.jpg\|400px\|thumb\|Spin coater: RCD8 is located in C-1]]		[[Image:Spinner_RCD8_C-1.jpg\|400px\|thumb\|Spin coater: RCD8 is located in C-1]]

	Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist.		Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. The media arm was disabled in 2024.

	However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.		However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.

Jehem: /* Equipment performance and process related parameters */

2023-02-03T10:17:23Z

Equipment performance and process related parameters

← Older revision		Revision as of 12:17, 3 February 2023
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	=== Equipment performance and process related parameters ===		=== Equipment performance and process related parameters ===

	{\| border="2" cellspacing="0" cellpadding="2"		{\|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"

	!style="background:silver; color:black;" align="center" width="60"\|Purpose		!style="background:silver; color:black;" align="center" width="60"\|Purpose

Jehem: /* Spin Coater: RCD8 */

2023-02-02T14:06:24Z

Spin Coater: RCD8

← Older revision		Revision as of 16:06, 2 February 2023
Line 6:		Line 6:
	However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.		However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.

	~~'''~~The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager]'''		The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager] - '''requires login'''

	===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing\|Process information]]===		===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing\|Process information]]===

Jehem: /* Equipment performance and process related parameters */

2023-01-27T14:06:37Z

Equipment performance and process related parameters

Jehem: /* Spin Coater: RCD8 */

2023-01-27T14:05:39Z

Spin Coater: RCD8

← Older revision		Revision as of 16:05, 27 January 2023
Line 2:		Line 2:
	[[Image:Spinner_RCD8_C-1.jpg\|400px\|thumb\|Spin coater: RCD8 is located in C-1]]		[[Image:Spinner_RCD8_C-1.jpg\|400px\|thumb\|Spin coater: RCD8 is located in C-1]]

	Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.		Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist.

			However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.

	'''The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager]'''		'''The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager]'''

	===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing\|Process information]]===		===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing\|Process information]]===
			*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating\|Spin coating]]
	[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating\|Spin coating]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Automatic dispense\|Automatic dispense]]
			*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes\|Recipes and templates]]
	[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Automatic dispense\|Automatic dispense]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results\|Processing results]]

	[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes\|Recipes and templates]]

	[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results\|Processing results]]

	=== Equipment performance and process related parameters ===		=== Equipment performance and process related parameters ===

Jehem: Created page with "==Spin Coater: RCD8== Spin coater: RCD8 is located in C-1 Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes. '''The user manual, user APV, and c..."

2023-01-27T14:04:49Z

Created page with "==Spin Coater: RCD8== 400px|thumb|Spin coater: RCD8 is located in C-1 Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes. '''The user manual, user APV, and c..."

New page

==Spin Coater: RCD8==
[[Image:Spinner_RCD8_C-1.jpg|400px|thumb|Spin coater: RCD8 is located in C-1]]

Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.

'''The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager]'''

===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]===

[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating|Spin coating]]

[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Automatic dispense|Automatic dispense]]

[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes|Recipes and templates]]

[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results|Processing results]]

=== Equipment performance and process related parameters ===

{| border="2" cellspacing="0" cellpadding="2"

!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
*Spin coating of SU-8 resists
*Spin coating of PGMEA based AZ resists
*Spin coating of wafers with structured backside
*Edge bead removal
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
* manual dispense
* automatic dispense from syringe
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center"|
* SU-8 resits: 0.1-200+ µm
* AZ 5214E: 1.5-3 µm
* AZ 4562: 8-15 µm
* AZ MiR 701: 1.5-3 µm
* AZ nLOF 2020: 2-3.5 µm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center"|
Vacuum chuck: 10 - 5000 rpm <br>
Non-vacuum chuck: Max. 3000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center"|
10 - 3000 rpm/s <br>
Max. 1500 rpm/s with Gyrset
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
* 100 mm wafers
* 150 mm wafers (vacuum chuck only)
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
All cleanroom materials ?
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
1
|-
|}

<br clear="all" />

← Older revision		Revision as of 11:57, 27 August 2025
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	===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing\|Process information]]===		===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing\|Process information]]===
	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating\|Spin coating]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating\|Spin coating]]
	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#~~Automatic dispense~~\|~~Automatic dispense~~]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Dispense\|Dispense]]
	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes\|Recipes and templates]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes\|Recipes and templates]]
	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results\|Processing results]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results\|Processing results]]

← Older revision		Revision as of 16:06, 27 January 2023
Line 20:		Line 20:
	!style="background:silver; color:black;" align="center" width="60"\|Purpose		!style="background:silver; color:black;" align="center" width="60"\|Purpose
	\|style="background:LightGrey; color:black"\|		\|style="background:LightGrey; color:black"\|
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	*Spin coating of SU-8 resists		*Spin coating of SU-8 resists
	*Spin coating of PGMEA based AZ resists		*Spin coating of PGMEA based AZ resists
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	!style="background:silver; color:black;" align="center" width="60"\|Resist		!style="background:silver; color:black;" align="center" width="60"\|Resist
	\|style="background:LightGrey; color:black"\|		\|style="background:LightGrey; color:black"\|
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	* manual dispense		* manual dispense
	* automatic dispense from syringe		* automatic dispense from syringe
Line 34:		Line 34:
	!style="background:silver; color:black" align="center" valign="center" rowspan="1"\|Performance		!style="background:silver; color:black" align="center" valign="center" rowspan="1"\|Performance
	\|style="background:LightGrey; color:black"\|Coating thickness		\|style="background:LightGrey; color:black"\|Coating thickness
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	* SU-8 resits: 0.1-200+ µm		* SU-8 resits: 0.1-200+ µm
	* AZ 5214E: 1.5-3 µm		* AZ 5214E: 1.5-3 µm
Line 43:		Line 43:
	!style="background:silver; color:black" align="center" valign="center" rowspan="2"\|Process parameters		!style="background:silver; color:black" align="center" valign="center" rowspan="2"\|Process parameters
	\|style="background:LightGrey; color:black"\|Spin speed		\|style="background:LightGrey; color:black"\|Spin speed
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	Vacuum chuck: 10 - 5000 rpm <br>		Vacuum chuck: 10 - 5000 rpm <br>
	Non-vacuum chuck: Max. 3000 rpm		Non-vacuum chuck: Max. 3000 rpm
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Spin acceleration		\|style="background:LightGrey; color:black"\|Spin acceleration
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	10 - 3000 rpm/s <br>		10 - 3000 rpm/s <br>
	Max. 1500 rpm/s with Gyrset		Max. 1500 rpm/s with Gyrset
Line 54:		Line 54:
	!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates		!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates
	\|style="background:LightGrey; color:black"\|Substrate size		\|style="background:LightGrey; color:black"\|Substrate size
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	* 100 mm wafers		* 100 mm wafers
	* 150 mm wafers (vacuum chuck only)		* 150 mm wafers (vacuum chuck only)
	\|-		\|-
	\| style="background:LightGrey; color:black"\|Allowed materials		\| style="background:LightGrey; color:black"\|Allowed materials
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	All cleanroom materials ?		All cleanroom materials ?
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Batch		\|style="background:LightGrey; color:black"\|Batch
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	1		1
	\|-		\|-