Specific Process Knowledge/Lithography/Coaters/GammaUV - Revision history

Taran: /* Spin Coater: Gamma UV */

2025-01-13T15:34:14Z

Spin Coater: Gamma UV

← Older revision		Revision as of 17:34, 13 January 2025
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	*Syringe, which can be used for various resists		*Syringe, which can be used for various resists

	The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and would as a starting point require batches in excess of 20 wafers.		The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and would as a starting point require batches in excess of 20 wafers.

			Link to information about [[Specific_Process_Knowledge/Pattern_Design#Helpful_information_for_chip_layout\|coater chuck size and hotplate pin positions]].

	'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''		'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''

Jehem: /* Equipment performance and process related parameters */

2023-02-03T10:15:25Z

Equipment performance and process related parameters

← Older revision		Revision as of 12:15, 3 February 2023
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	=== Equipment performance and process related parameters ===		=== Equipment performance and process related parameters ===

	{\| border="2" cellspacing="0" cellpadding="2"		{\|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
	!style="background:silver; color:black;" align="center" width="60"\|Purpose		!style="background:silver; color:black;" align="center" width="60"\|Purpose
	\|style="background:LightGrey; color:black"\|		\|style="background:LightGrey; color:black"\|

Jehem: /* Spin Coater: Gamma UV */

2023-02-02T14:04:47Z

Spin Coater: Gamma UV

← Older revision		Revision as of 16:04, 2 February 2023
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	'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''		'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''

	~~'''~~The user manual, quality control procedures and results, user APVs, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager]'''		The user manual, quality control procedures and results, user APVs, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager] - '''requires login'''

	===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing\|Process information]]===		===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing\|Process information]]===

Jehem: /* Equipment performance and process related parameters */

2023-01-30T15:40:54Z

Equipment performance and process related parameters

← Older revision		Revision as of 17:40, 30 January 2023
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	\|style="background:LightGrey; color:black"\|HMDS contact angle		\|style="background:LightGrey; color:black"\|HMDS contact angle
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	60 - 80°		60 - 80°
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Coating thickness		\|style="background:LightGrey; color:black"\|Coating thickness
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	\|style="background:LightGrey; color:black"\|Priming temperature		\|style="background:LightGrey; color:black"\|Priming temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	120 °C		120 °C
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Spin speed		\|style="background:LightGrey; color:black"\|Spin speed
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	10 - 6000 rpm		10 - 6000 rpm
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Spin acceleration		\|style="background:LightGrey; color:black"\|Spin acceleration
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	10 - 10000 rpm/s		10 - 10000 rpm/s
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Hotplate temperature		\|style="background:LightGrey; color:black"\|Hotplate temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	25 - 200 °C		25 - 200 °C
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Cool plate temperature		\|style="background:LightGrey; color:black"\|Cool plate temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	21 °C		21 °C
	\|-		\|-
	!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates		!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates
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	\|style="background:LightGrey; color:black"\|Batch		\|style="background:LightGrey; color:black"\|Batch
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	1 - 25		1 - 25
	\|-		\|-
	\|}		\|}

Jehem: /* Equipment performance and process related parameters */

2023-01-30T15:38:00Z

Equipment performance and process related parameters

← Older revision		Revision as of 17:38, 30 January 2023
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	\|style="background:LightGrey; color:black"\|HMDS contact angle		\|style="background:LightGrey; color:black"\|HMDS contact angle
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	60 - 80°		60 - 80°
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Coating thickness		\|style="background:LightGrey; color:black"\|Coating thickness

Jehem: /* Equipment performance and process related parameters */

2023-01-30T09:31:25Z

Equipment performance and process related parameters

← Older revision		Revision as of 11:31, 30 January 2023
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	<sup>1)</sup> Requires tool change.		<sup>1)</sup> Requires tool change.

	<br clear="all" />		<br clear="all" />

Jehem: /* Equipment performance and process related parameters */

2023-01-27T13:56:55Z

Equipment performance and process related parameters

← Older revision		Revision as of 15:56, 27 January 2023
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	Silicon and glass		Silicon and glass

	~~Resist~~ and crystalbond is not allowed in the HMDS module		Resists and crystalbond are not allowed in the HMDS module
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Batch		\|style="background:LightGrey; color:black"\|Batch

Jehem: /* Spin Coater: Gamma UV */

2023-01-27T13:47:58Z

Spin Coater: Gamma UV

← Older revision		Revision as of 15:47, 27 January 2023
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	The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8".		The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8".

	The coater is equipped with 3 different ~~resists~~ lines:		The coater is equipped with 3 different resist lines, as well as 1 syringe line:
	*AZ MiR 701		*AZ MiR 701
	*AZ nLOF 2020		*AZ nLOF 2020

Jehem: /* Process information */

2023-01-27T13:44:11Z

Process information

← Older revision		Revision as of 15:44, 27 January 2023
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	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#General_Process_Information\|General Process Information]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#General_Process_Information\|General Process Information]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Quality_Control_(QC)\|Quality Control (QC)]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Quality_Control_(QC)\|Quality Control (QC)]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Standard_Processes\|Standard Processes]]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Standard_Processes\|Standard Processes]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Syringe_processes\|Syringe processes]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Syringe_processes\|Syringe processes]]

Jehem: /* Equipment performance and process related parameters */

2023-01-27T13:43:40Z

Equipment performance and process related parameters

← Older revision		Revision as of 15:43, 27 January 2023
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	{\| border="2" cellspacing="0" cellpadding="2"		{\| border="2" cellspacing="0" cellpadding="2"


	!style="background:silver; color:black;" align="center" width="60"\|Purpose		!style="background:silver; color:black;" align="center" width="60"\|Purpose
	\|style="background:LightGrey; color:black"\|		\|style="background:LightGrey; color:black"\|
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	*HMDS priming		*HMDS priming
	*Spin coating of PGMEA based UV resists		*Spin coating of PGMEA based UV resists
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	!style="background:silver; color:black;" align="center" width="60"\|Resist		!style="background:silver; color:black;" align="center" width="60"\|Resist
	\|style="background:LightGrey; color:black"\|		\|style="background:LightGrey; color:black"\|
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	* AZ MiR 701 (29cps)		* AZ MiR 701 (29cps)
	* AZ nLOF 2020		* AZ nLOF 2020
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	!style="background:silver; color:black" align="center" valign="center" rowspan="2"\|Performance		!style="background:silver; color:black" align="center" valign="center" rowspan="2"\|Performance
	\|style="background:LightGrey; color:black"\|HMDS contact angle		\|style="background:LightGrey; color:black"\|HMDS contact angle
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	60 - 80°		60 - 80°
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Coating thickness		\|style="background:LightGrey; color:black"\|Coating thickness
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	* AZ MiR 701: 1.5-4 µm		* AZ MiR 701: 1.5-4 µm
	* AZ nLOF 2020: 1.5-5 µm		* AZ nLOF 2020: 1.5-5 µm
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	!style="background:silver; color:black" align="center" valign="center" rowspan="5"\|Process parameters		!style="background:silver; color:black" align="center" valign="center" rowspan="5"\|Process parameters
	\|style="background:LightGrey; color:black"\|Priming temperature		\|style="background:LightGrey; color:black"\|Priming temperature
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	120 °C		120 °C
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Spin speed		\|style="background:LightGrey; color:black"\|Spin speed
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	10 - 6000 rpm		10 - 6000 rpm
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Spin acceleration		\|style="background:LightGrey; color:black"\|Spin acceleration
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	10 - 10000 rpm/s		10 - 10000 rpm/s
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Hotplate temperature		\|style="background:LightGrey; color:black"\|Hotplate temperature
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	25 - 200 °C		25 - 200 °C
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Cool plate temperature		\|style="background:LightGrey; color:black"\|Cool plate temperature
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	21 °C		21 °C
	\|-		\|-
	!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates		!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates
	\|style="background:LightGrey; color:black"\|Substrate size		\|style="background:LightGrey; color:black"\|Substrate size
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	* 50 mm wafers <sup>1)</sup>		* 50 mm wafers <sup>1)</sup>
	* 100 mm wafers		* 100 mm wafers
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	\|-		\|-
	\| style="background:LightGrey; color:black"\|Allowed materials		\| style="background:LightGrey; color:black"\|Allowed materials
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	Silicon and glass		Silicon and glass

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	\|-		\|-
	\|style="background:LightGrey; color:black"\|Batch		\|style="background:LightGrey; color:black"\|Batch
	\|style="background:WhiteSmoke; color:black~~" align="center~~"\|		\|style="background:WhiteSmoke; color:black"\|
	1 - 25		1 - 25
	\|-		\|-

← Older revision		Revision as of 15:44, 27 January 2023
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	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#General_Process_Information\|General Process Information]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#General_Process_Information\|General Process Information]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Quality_Control_(QC)\|Quality Control (QC)]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Quality_Control_(QC)\|Quality Control (QC)]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Standard_Processes\|Standard Processes]]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Standard_Processes\|Standard Processes]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Syringe_processes\|Syringe processes]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Syringe_processes\|Syringe processes]]