Specific Process Knowledge/Lithography/Coaters/GammaEbeam - Revision history

Taran: /* Process information */

2025-09-02T14:22:55Z

Process information

← Older revision		Revision as of 16:22, 2 September 2025
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	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information\|General Process information]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information\|General Process information]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control_(QC)\|Quality Control (QC)]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control_(QC)\|Quality Control (QC)]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes\|Standard Processes:]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes\|Standard Processes]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Syringe_Processes\|Syringe Processes]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Syringe_Processes\|Syringe Processes]]

Taran: /* Spin Coater: Gamma E-beam and UV */

2025-01-13T15:33:51Z

Spin Coater: Gamma E-beam and UV

← Older revision		Revision as of 17:33, 13 January 2025
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	*AZ 4562		*AZ 4562

	The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and ''requires'' batch processing - it is not for processing a few wafers now and then.		The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and ''requires'' batch processing - it is not for processing a few wafers now and then.

			Link to information about [[Specific_Process_Knowledge/Pattern_Design#Helpful_information_for_chip_layout\|coater chuck size and hotplate pin positions]].

	'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''		'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''

Jehem: /* Spin Coater: Gamma E-beam and UV */

2023-09-20T13:29:03Z

Spin Coater: Gamma E-beam and UV

← Older revision		Revision as of 15:29, 20 September 2023
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	The 2" coater station is equipped with 1 resist line, as well as 1 syringe line:		The 2" coater station is equipped with 1 resist line, as well as 1 syringe line:
	*AR-P 6200.09 (CSAR)		*AR-P 6200.09 (CSAR)
	*Syringe, which can be used for various resists (anisole-based or PGMEA-based).		*Syringe, which can be used for various resists (anisole-based or PGMEA-based). ''We currently recommend against using the syringe, as the process setup is quite demanding. Use a manual spin coater instead.''


	The 4"/6" coater station is equipped with 4 different resists lines:		The 4"/6" coater station is equipped with 4 different resists lines:
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	*AZ 4562		*AZ 4562

	The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and ~~would as~~ a ~~starting point require batches in excess of 20~~ wafers.		The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and ''requires'' batch processing - it is not for processing a few wafers now and then.

	'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''		'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''

Jehem: /* Equipment performance and process related parameters */

2023-02-03T10:17:02Z

Equipment performance and process related parameters

← Older revision		Revision as of 12:17, 3 February 2023
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	=== Equipment performance and process related parameters ===		=== Equipment performance and process related parameters ===

	{\| border="2" cellspacing="0" cellpadding="2"		{\|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"

	!style="background:silver; color:black;" align="center" width="60"\|Purpose		!style="background:silver; color:black;" align="center" width="60"\|Purpose

Jehem: /* Equipment performance and process related parameters */

2023-02-02T14:50:14Z

Equipment performance and process related parameters

← Older revision		Revision as of 16:50, 2 February 2023
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	\| style="background:LightGrey; color:black"\|Allowed materials		\| style="background:LightGrey; color:black"\|Allowed materials
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	Silicon, III-V, and glass		Silicon, III-V, and glass

	Resists and crystalbond are not allowed in the HMDS module		Resists and crystalbond are not allowed in the HMDS module
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Batch		\|style="background:LightGrey; color:black"\|Batch

Jehem: /* Equipment performance and process related parameters */

2023-02-02T14:49:58Z

Equipment performance and process related parameters

← Older revision		Revision as of 16:49, 2 February 2023
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	\|style="background:LightGrey; color:black"\|HMDS contact angle		\|style="background:LightGrey; color:black"\|HMDS contact angle
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	60 - 80° (on Silicon)		60 - 80° (on Silicon)
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Coating thickness		\|style="background:LightGrey; color:black"\|Coating thickness
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	\|style="background:LightGrey; color:black"\|Priming temperature		\|style="background:LightGrey; color:black"\|Priming temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	120 °C		120 °C
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Spin speed		\|style="background:LightGrey; color:black"\|Spin speed
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	10 - 6000 rpm		10 - 6000 rpm
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Spin acceleration		\|style="background:LightGrey; color:black"\|Spin acceleration
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	10 - 10000 rpm/s		10 - 10000 rpm/s
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Hotplate temperature		\|style="background:LightGrey; color:black"\|Hotplate temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	25 - 200 °C		25 - 200 °C
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Cool plate temperature		\|style="background:LightGrey; color:black"\|Cool plate temperature
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	21 °C		21 °C
	\|-		\|-
	!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates		!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates
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	\|style="background:LightGrey; color:black"\|Batch		\|style="background:LightGrey; color:black"\|Batch
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	1 - 25		1 - 25
	\|-		\|-
	\|}		\|}

	<br clear="all" />		<br clear="all" />

Jehem: /* Spin Coater: Gamma E-beam and UV */

2023-02-02T14:05:46Z

Spin Coater: Gamma E-beam and UV

← Older revision		Revision as of 16:05, 2 February 2023
Line 19:		Line 19:
	'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''		'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''

	~~'''~~The user manual, quality control procedures and results, user APVs, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=417 LabManager]'''		The user manual, quality control procedures and results, user APVs, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=417 LabManager] - '''requires login'''

	===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing\|Process information]]===		===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing\|Process information]]===

Jehem: /* Process information */

2023-01-27T14:03:10Z

Process information

← Older revision		Revision as of 16:03, 27 January 2023
Line 23:		Line 23:
	===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing\|Process information]]===		===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing\|Process information]]===
	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information\|General Process information]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information\|General Process information]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#~~Quality_Control~~(QC)\|Quality Control (QC)]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control_(QC)\|Quality Control (QC)]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes\|Standard Processes:]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes\|Standard Processes:]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Syringe_Processes\|Syringe Processes]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Syringe_Processes\|Syringe Processes]]

Jehem: /* Process information */

2023-01-27T14:01:07Z

Process information

← Older revision		Revision as of 16:01, 27 January 2023
Line 22:		Line 22:

	===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing\|Process information]]===		===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing\|Process information]]===
	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing\|General Process information]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information\|General Process information]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control(QC)\|Quality Control (QC)]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control(QC)\|Quality Control (QC)]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes\|Standard Processes:]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes\|Standard Processes:]]

Jehem: /* Equipment performance and process related parameters */

2023-01-27T13:57:27Z

Equipment performance and process related parameters

← Older revision		Revision as of 15:57, 27 January 2023
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	* AR-P 6200.09 (CSAR)		* AR-P 6200.09 (CSAR)
	* AZ 5214E		* AZ 5214E
	* AZ MiR 701 (29cps) ~~''4"/6" only''~~		* AZ MiR 701 (29cps)
	* AZ 4562 ~~''4"/6" only''~~		* AZ 4562
	* 30cc syringe dispense ~~''2" only''~~		* 30cc syringe dispense
	\|-		\|-
	!style="background:silver; color:black" align="center" valign="center" rowspan="2"\|Performance		!style="background:silver; color:black" align="center" valign="center" rowspan="2"\|Performance

← Older revision		Revision as of 16:22, 2 September 2025
Line 27:		Line 27:
	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information\|General Process information]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information\|General Process information]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control_(QC)\|Quality Control (QC)]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control_(QC)\|Quality Control (QC)]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes\|Standard Processes:]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes\|Standard Processes]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Syringe_Processes\|Syringe Processes]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Syringe_Processes\|Syringe Processes]]

← Older revision		Revision as of 16:03, 27 January 2023
Line 23:		Line 23:
	===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing\|Process information]]===		===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing\|Process information]]===
	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information\|General Process information]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information\|General Process information]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#~~Quality_Control~~(QC)\|Quality Control (QC)]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control_(QC)\|Quality Control (QC)]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes\|Standard Processes:]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes\|Standard Processes:]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Syringe_Processes\|Syringe Processes]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Syringe_Processes\|Syringe Processes]]

← Older revision		Revision as of 16:01, 27 January 2023
Line 22:		Line 22:

	===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing\|Process information]]===		===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing\|Process information]]===
	*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing\|General Process information]]		*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma E-beam and UV processing#General_Process_Information\|General Process information]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control(QC)\|Quality Control (QC)]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Quality_Control(QC)\|Quality Control (QC)]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes\|Standard Processes:]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_E-beam_and_UV_processing#Standard_Processes\|Standard Processes:]]