Specific Process Knowledge/Lithography/Coaters/GammaDUV - Revision history

Jehem: /* Spin coater: Süss stepper */

2025-03-17T13:46:18Z

Spin coater: Süss stepper

← Older revision		Revision as of 15:46, 17 March 2025
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	==Spin coater: Süss stepper==		==Spin coater: Süss stepper==
	[[Image:Gamma_2M.jpg\|~~300x300px~~\|right\|thumb\|The SÜSS Spinner-Stepper is placed in F-3]]		[[Image:Gamma_2M.jpg\|400px\|right\|thumb\|The SÜSS Spinner-Stepper is placed in F-3]]

	This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.		This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.

Jehem: /* Equipment performance and process related parameters */

2023-02-03T10:16:46Z

Equipment performance and process related parameters

← Older revision		Revision as of 12:16, 3 February 2023
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	===Equipment performance and process related parameters===		===Equipment performance and process related parameters===

	{\| border="2" cellspacing="0" cellpadding="2"		{\|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"

	!style="background:silver; color:black;" align="center" width="60"\|Purpose		!style="background:silver; color:black;" align="center" width="60"\|Purpose

Jehem: /* Spin coater: Süss stepper */

2023-02-02T14:05:06Z

Spin coater: Süss stepper

← Older revision		Revision as of 16:05, 2 February 2023
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	This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.		This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.

	~~'''~~The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:~~'''~~		The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:
	Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=279 LabManager]
			Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=279 LabManager] - '''requires login'''

	{{:Specific Process Knowledge/Lithography/Resist/DUVresist}}		{{:Specific Process Knowledge/Lithography/Resist/DUVresist}}

Jehem: /* Equipment performance and process related parameters */

2023-02-02T14:00:08Z

Equipment performance and process related parameters

← Older revision		Revision as of 16:00, 2 February 2023
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	\|-		\|-

	!style="background:silver; color:black;~~" align="center"~~ width="60"\|Resist		!style="background:silver; color:black; width="60"\|Resist
	\|style="background:LightGrey; color:black"\|		\|style="background:LightGrey; color:black"\|
	\|style="background:WhiteSmoke; color:black~~" align="center~~" colspan="2"\|		\|style="background:WhiteSmoke; color:black" colspan="2"\|
	*BARC DUV42S-6		*BARC DUV42S-6
	*Positive tone resist KRF M230Y		*Positive tone resist KRF M230Y
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	!style="background:silver; color:black;" align="center" width="60"\|Performance		!style="background:silver; color:black;" align="center" width="60"\|Performance
	\|style="background:LightGrey; color:black"\|Coating thickness		\|style="background:LightGrey; color:black"\|Coating thickness
	\|style="background:WhiteSmoke; color:black~~" align="center~~" colspan="2"\|		\|style="background:WhiteSmoke; color:black" colspan="2"\|
	*BARC DUV42S-6 60-90nm		*BARC DUV42S-6 60-90nm
	*Positive tone resist KRF M230Y 300-600nm		*Positive tone resist KRF M230Y 300-600nm
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	!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Process parameters		!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Process parameters
	\|style="background:LightGrey; color:black"\|Spin speed		\|style="background:LightGrey; color:black"\|Spin speed
	\|style="background:WhiteSmoke; color:black~~" align="center~~" colspan="2"\|		\|style="background:WhiteSmoke; color:black" colspan="2"\|
	10 - 5000 rpm		10 - 5000 rpm
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Spin acceleration		\|style="background:LightGrey; color:black"\|Spin acceleration
	\|style="background:WhiteSmoke; color:black~~" align="center~~" colspan="2"\|		\|style="background:WhiteSmoke; color:black" colspan="2"\|
	100 - 10000 rpm/s		100 - 10000 rpm/s
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Hotplate temperature		\|style="background:LightGrey; color:black"\|Hotplate temperature
	\|style="background:WhiteSmoke; color:black~~" align="center~~" colspan="2"\|		\|style="background:WhiteSmoke; color:black" colspan="2"\|
	*175°C for BARC baking		*175°C for BARC baking
	*130°C for positive tone resist soft baking and post exposure baking		*130°C for positive tone resist soft baking and post exposure baking
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	!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates		!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates
	\|style="background:LightGrey; color:black"\|Substrate size		\|style="background:LightGrey; color:black"\|Substrate size
	\|style="background:WhiteSmoke; color:black~~" align="center~~" colspan="2"\|		\|style="background:WhiteSmoke; color:black" colspan="2"\|
	*100 mm wafers		*100 mm wafers
	*150 mm wafers		*150 mm wafers
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	\|-		\|-
	\| style="background:LightGrey; color:black"\|Allowed materials		\| style="background:LightGrey; color:black"\|Allowed materials
	\|style="background:WhiteSmoke; color:black~~" align="center~~" colspan="2"\|		\|style="background:WhiteSmoke; color:black" colspan="2"\|
	*Any standard cleanroom material		*Any standard cleanroom material
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Batch		\|style="background:LightGrey; color:black"\|Batch
	\|style="background:WhiteSmoke; color:black~~" align="center~~" colspan="2"\|		\|style="background:WhiteSmoke; color:black" colspan="2"\|
	1 - 25		1 - 25
	\|-		\|-
	\|}		\|}
	<br clear="all" />		<br clear="all" />

Jehem: /* Spin coater: Süss stepper */

2023-01-30T09:30:07Z

Spin coater: Süss stepper

@@ Line 14: / Line 14: @@
 *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Quality_Control_(QC)|Quality Control (QC)]]
 *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Standard_Processes|Standard Processes]]
 ===Equipment performance and process related parameters===
@@ Line 200: / Line 76: @@
 |-
 |}
 <br clear="all" />

Jehem: /* Process information */

2023-01-30T09:29:44Z

Process information

← Older revision		Revision as of 11:29, 30 January 2023
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	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Quality_Control_(QC)\|Quality Control (QC)]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Quality_Control_(QC)\|Quality Control (QC)]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Standard_Processes\|Standard Processes]]		*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Standard_Processes\|Standard Processes]]
	*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Syringe_processes\|Syringe processes]]

	===Quality Control (QC)===		===Quality Control (QC)===

Jehem: /* Quality Control (QC) */

2023-01-30T09:28:47Z

Quality Control (QC)

← Older revision		Revision as of 11:28, 30 January 2023
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	Spin-off speed will be adjusted if film thickness is outside the limit.		Spin-off speed will be adjusted if film thickness is outside the limit.
	\|}		\|}


	===Standard processes===		===Standard processes===

Jehem: /* Spin coater: Süss stepper */

2023-01-30T09:23:52Z

Spin coater: Süss stepper

← Older revision		Revision as of 11:23, 30 January 2023
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	{{:Specific Process Knowledge/Lithography/Resist/DUVresist}}		{{:Specific Process Knowledge/Lithography/Resist/DUVresist}}

			===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma DUV processing\|Process information]]===

			*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#General_Process_Information\|General Process Information]]
			*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Quality_Control_(QC)\|Quality Control (QC)]]
			*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Standard_Processes\|Standard Processes]]
			*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Syringe_processes\|Syringe processes]]

	===Quality Control (QC)===		===Quality Control (QC)===

Jehem: /* Equipment performance and process related parameters */

2023-01-27T14:38:15Z

Equipment performance and process related parameters

← Older revision		Revision as of 16:38, 27 January 2023
Line 134:		Line 134:
	*'''(1406) DCH 100mm M35G 1400nm''' Dispense 1ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C		*'''(1406) DCH 100mm M35G 1400nm''' Dispense 1ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C

	== Equipment performance and process related parameters ==		===Equipment performance and process related parameters===

	{\| border="2" cellspacing="0" cellpadding="2"		{\| border="2" cellspacing="0" cellpadding="2"

Jehem: Created page with "==Spin coater: Süss stepper== The SÜSS Spinner-Stepper is placed in F-3 This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system. '''The user manual, quality control procedures and resul..."

2023-01-27T14:35:25Z

Created page with "==Spin coater: Süss stepper== 300x300px|right|thumb|The SÜSS Spinner-Stepper is placed in F-3 This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system. '''The user manual, quality control procedures and resul..."

New page

==Spin coater: Süss stepper==
[[Image:Gamma_2M.jpg|300x300px|right|thumb|The SÜSS Spinner-Stepper is placed in F-3]]

This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.

'''The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:'''
Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=279 LabManager]

{{:Specific Process Knowledge/Lithography/Resist/DUVresist}}

===Quality Control (QC)===

{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>
*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2" align="center" style="width:400px"

! QC Recipe:
! (1201) DCH 150mm BARC 65nm
|-
|Substrate size
|6"
|-
|Resist volume
|3 ml
|-
|Spin-off speed
|4700 rpm
|-
|Spin-off time
|30 s
|-
|Soft bake temperature
|175°C, contact
|-
|Soft bake time
|60 s
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Spin coater: Süss Stepper - BARC DUV42S-6
|-
|Nominal film thickness
|65 nm
|-
|Film thickness deviation from nominal
|<15%
|-
|Film thickness non-uniformity
|<5%
|-
|}
|-
|}
Spin-off speed will be adjusted if film thickness is outside the limit.
|}

{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>
*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2" align="center" style="width:400px"

! QC Recipe:
! (1202) DCH 100mm BARC 65nm
|-
|Substrate size
|4"
|-
|Resist volume
|1.6 ml
|-
|Spin-off speed
|3000 rpm
|-
|Spin-off time
|30 s
|-
|Soft bake temperature
|175°C, contact
|-
|Soft bake time
|60 s
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Spin coater: Süss Stepper - BARC DUV42S-6
|-
|Nominal film thickness
|65 nm
|-
|Film thickness deviation from nominal
|<15%
|-
|Film thickness non-uniformity
|<5%
|-
|}
|-
|}
Spin-off speed will be adjusted if film thickness is outside the limit.
|}

===Standard processes===

BARC DUV42S-6 coating sequences:
*'''(1201) DCH 150mm BARC 65nm''' Dispense 3ml@1000rpm; spin-off 30s@4700rpm; softbake 60s@175°C
*'''(1202) DCH 100mm BARC 65nm''' Dispense 1.6ml@1000rpm; spin-off 30s@3000rpm; softbake 60s@175°C
KRF M230Y coating sequences:
*'''(1301) DCH 150mm M230Y 360nm''' Dispense 3ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C
*'''(1302) DCH 100mm M230Y 360nm''' Dispense 1ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C
KRF M35G coating sequences:
*'''(1401) DCH 150mm M35G 750nm''' Dispense 3ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
*'''(1402) DCH 100mm M35G 750nm''' Dispense 1ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
*'''(1403) DCH 150mm M35G 1000nm''' Dispense 3ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
*'''(1404) DCH 100mm M35G 1000nm''' Dispense 1ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
*'''(1405) DCH 150mm M35G 1400nm''' Dispense 3ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C
*'''(1406) DCH 100mm M35G 1400nm''' Dispense 1ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C

== Equipment performance and process related parameters ==

{| border="2" cellspacing="0" cellpadding="2"

!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*Spin coating and soft baking of BARC
*Spin coating and soft baking of DUV resists
*Post exposure baking
|-

!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
*BARC DUV42S-6
*Positive tone resist KRF M230Y
*Positive tone resist KRF M35G
*Negative tone resist UVN2300-0.8
|-
!style="background:silver; color:black;" align="center" width="60"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
*BARC DUV42S-6 60-90nm
*Positive tone resist KRF M230Y 300-600nm
*Positive tone resist KRF M35G 800-1600nm
*Negative tone resist UVN2300-0.8 200-1400nm
|-

!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
10 - 5000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 10000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
*175°C for BARC baking
*130°C for positive tone resist soft baking and post exposure baking
*100°C for negative tone resist soft baking and post exposure baking
|-

!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
*100 mm wafers
*150 mm wafers
*200 mm wafers (requires tool change)
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
*Any standard cleanroom material
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1 - 25
|-
|}

<br clear="all" />