Specific Process Knowledge/Lithography/Coaters - Revision history

Jehem at 13:02, 26 June 2026

2026-06-26T13:02:17Z

← Older revision		Revision as of 15:02, 26 June 2026
Line 61:		Line 61:
	**mr-DWL		**mr-DWL
	**other resists		**other resists
	~~OBS~~: this tool is in PolyFabLab
			NB: this tool is in PolyFabLab
	\|		\|
	*Spraying imprint resist		*Spraying imprint resist
Line 119:		Line 120:
	! scope=row\| Manual dispense option		! scope=row\| Manual dispense option
	\|		\|
	* no manual dispense		* No manual dispense
	* ~~syringe~~ dispense (60cc) of PGMEA-based resist		* Syringe dispense (60cc) of PGMEA-based resist
	\|		\|
	* no manual dispense		* No manual dispense
	* ~~syringe~~ dispense (60cc) of PGMEA and anisole-based resist		* Syringe dispense (60cc) of PGMEA and anisole-based resist
	\|		\|
	* no manual dispense		* No manual dispense
	* ~~syringe~~ dispense (30cc) of PGMEA and anisole-based resist (2" only)		* Syringe dispense (30cc) of PGMEA and anisole-based resist (2" only)
	\|		\| Only manual dispense
	* yes
	* pneumatic dispense ~~for SU-8 resist and EBR solvent <span style="color:red">OBS: disabled 2024</span>~~
	\|colspan="2"\| Only manual dispense		\|colspan="2"\| Only manual dispense
	\| Only manual dispense		\| Only manual dispense

Jehem at 12:56, 26 June 2026

2026-06-26T12:56:50Z

Show changes

Jehem at 08:20, 25 June 2026

2026-06-25T08:20:43Z

@@ Line 311: / Line 311: @@
 ==Softbake==
 After spin coating, the solvent in the resist must be evaporated in a baking step, in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface, either in direct contact on the manual hotlpates or by resting on shallow bumps 150 µm above the hotplate in the Gamma tools. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake.
 =Decommisioned tools=

Jehem at 08:20, 25 June 2026

2026-06-25T08:20:04Z

← Older revision		Revision as of 10:20, 25 June 2026
Line 17:		Line 17:
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam\|Spin Coater: Gamma E-beam and UV]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam\|Spin Coater: Gamma E-beam and UV]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/RCD8\|Spin Coater: RCD8]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/RCD8\|Spin Coater: RCD8]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coater~~/labspin\|Spin Coater: LabSpin 02]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 02]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coater~~/labspin\|Spin Coater: LabSpin 03]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 03]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coater~~/labspin04\|Spin Coater: LabSpin 04]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/labspin04\|Spin Coater: LabSpin 04]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]</b>
	\|-		\|-

Jehem at 08:18, 25 June 2026

2026-06-25T08:18:52Z

← Older revision		Revision as of 10:18, 25 June 2026
Line 13:		Line 13:

	!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment		!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spin_Coater:_Gamma_UV~~\|Spin Coater: Gamma UV]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaUV\|Spin Coater: Gamma UV]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~DUVStepperLithography#S.C3.9CSS_Spinner-Stepper~~\|Spin Coater: Süss Stepper]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaDUV\|Spin Coater: Süss Stepper]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spin Coater: Gamma E-beam and UV~~\|Spin Coater: Gamma E-beam and UV]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam\|Spin Coater: Gamma E-beam and UV]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spin_Coater:_RCD8~~\|Spin Coater: RCD8]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/RCD8\|Spin Coater: RCD8]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coaters#Spin_coater:_Labspin~~\|Spin Coater: LabSpin 02]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coater/labspin\|Spin Coater: LabSpin 02]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coaters#Spin_coater:_Labspin~~\|Spin Coater: LabSpin 03]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coater/labspin\|Spin Coater: LabSpin 03]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coaters#Spin_Coater:_LabSpin_04~~\|Spin Coater: LabSpin 04]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coater/labspin04\|Spin Coater: LabSpin 04]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spray Coater~~\|Spray Coater]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]</b>
	\|-		\|-

Jehem: /* Decommisioned tools */

2026-01-13T11:32:24Z

Decommisioned tools

← Older revision		Revision as of 13:32, 13 January 2026
Line 330:		Line 330:
	=Decommisioned tools=		=Decommisioned tools=
	<span style="color:red">The spin track was decommissioned 2018-02-01.</span>		<span style="color:red">The spin track was decommissioned 2018-02-01.</span>

	[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing\|Information about decommissioned tool can be found here.]]		[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing\|Information about decommissioned tool can be found here.]]

Jehem at 09:26, 12 January 2026

2026-01-12T09:26:40Z

@@ Line 313: / Line 313: @@
 =Spin coaters at DTU Nanolab=
 {{:Specific Process Knowledge/Lithography/Coaters/GammaUV}}
@@ Line 330: / Line 326: @@
 {{:Specific Process Knowledge/Lithography/Coaters/labspin04}}
-=Spray Coater=
+{{:Specific Process Knowledge/Lithography/Coaters/sprayCoater}}
-The spray coater at DTU Nanolab is located in Cleanroom C-1. The machine is an ExactaCoat from Sono-tek which can be fitted with one of three different nozzles depending on the nature of the spray coating tasks at hand. The three different nozzles (Impact, AccuMist and Vortex) are optimized for different applications such as spray coating of large areas (e.g. entire wafers), smaller areas (e.g. wafer pieces or other small samples) or already structured samples that cannot be coated uniformly by spin coating. All nozzles use an ultrasonic tranducer for atomizing the solution to be spray coated. It is therefore a prerequisite that all components are compatible with this process. This is the case with most substances, although process parameters may need optimization to give satisfactory results.
+=Decommisioned tools=
+<span style="color:red">The spin track was decommissioned 2018-02-01.</span>
-Practically any sample that will fit inside the spray coater can be processed. Spray patterns are easily programmed either using predefined spray patterns (1D line, 2D rectangles/circles/meanders/spirals) or custom 3D spray patterns.
+[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing|Information about decommissioned tool can be found here.]]

Taran at 10:06, 3 November 2025

2025-11-03T10:06:51Z

← Older revision		Revision as of 12:06, 3 November 2025
Line 64:		Line 64:
	**mr-DWL		**mr-DWL
	**other resists		**other resists
			OBS: this tool is in PolyFabLab
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Spraying imprint resist		*Spraying imprint resist
Line 109:		Line 110:
	* KRF M230Y resist		* KRF M230Y resist
	* KRF M35G resist		* KRF M35G resist
			* PGMEA solvent for edge bead removal and backside rinse
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	* AR-P 6200.09 (CSAR) for 2", 4", and 6"		* AR-P 6200.09 (CSAR) for 2", 4", and 6"
Line 135:		Line 137:
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	* yes		* yes
	* pneumatic dispense for SU-8 resist and EBR solvent		* pneumatic dispense for SU-8 resist and EBR solvent <span style="color:red">OBS: disabled 2024</span>
	\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense		\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense
	\|style="background:WhiteSmoke; color:black"\|Only manual dispense		\|style="background:WhiteSmoke; color:black"\|Only manual dispense

Taran: /* Coater Comparison Table */

2025-11-03T09:45:21Z

Coater Comparison Table

← Older revision		Revision as of 11:45, 3 November 2025
Line 19:		Line 19:
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin\|Spin Coater: LabSpin 02]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin\|Spin Coater: LabSpin 02]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin\|Spin Coater: LabSpin 03]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin\|Spin Coater: LabSpin 03]]</b>
			\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_LabSpin_04\|Spin Coater: LabSpin 04]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spray Coater\|Spray Coater]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spray Coater\|Spray Coater]]</b>
	\|-		\|-
Line 58:		Line 59:
	**AZ5214E, AZ4562, AZMiR701, AZnLOF, SU-8		**AZ5214E, AZ4562, AZMiR701, AZnLOF, SU-8
	*Coating of imprint resists		*Coating of imprint resists
			\|style="background:WhiteSmoke; color:black"\|
			*Coating of
			**SU-8
			**mr-DWL
			**other resists
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Spraying imprint resist		*Spraying imprint resist
Line 86:		Line 92:
	* Vacuum chucks for chips, 2", 4", and 6"		* Vacuum chucks for chips, 2", 4", and 6"
	* 4" edge handling chuck		* 4" edge handling chuck
			\|style="background:WhiteSmoke; color:black"\|
			* Single substrate
			* Vacuum chucks for chips, 4", and 6"
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	Can handle almost any sample size and shape		Can handle almost any sample size and shape
Line 109:		Line 118:
	No permanent media		No permanent media
	\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense		\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense
			\|style="background:WhiteSmoke; color:black"\|Only manual dispense
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	No permanent media		No permanent media
Line 127:		Line 137:
	* pneumatic dispense for SU-8 resist and EBR solvent		* pneumatic dispense for SU-8 resist and EBR solvent
	\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense		\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense
			\|style="background:WhiteSmoke; color:black"\|Only manual dispense
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	Two syringe pumps		Two syringe pumps
Line 142:		Line 153:
	10 - 5000 rpm (3000 rpm with non-vacuum chuck)		10 - 5000 rpm (3000 rpm with non-vacuum chuck)
	\|colspan="2" style="background:WhiteSmoke; color:black"\|		\|colspan="2" style="background:WhiteSmoke; color:black"\|
	100 - ~~5000~~ rpm (3000 rpm with edge handling chuck)		100 - 8000 rpm (3000 rpm with edge handling chuck)
			\|style="background:WhiteSmoke; color:black"\|
			100 - 8000 rpm
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	\|-		\|-
Line 156:		Line 169:
	optional (max. speed 3000 rpm)		optional (max. speed 3000 rpm)
	\|colspan="2" style="background:WhiteSmoke; color:black"\|		\|colspan="2" style="background:WhiteSmoke; color:black"\|
			no
			\|style="background:WhiteSmoke; color:black"\|
	no		no
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
Line 182:		Line 197:
	*100 mm wafers		*100 mm wafers
	*150 mm wafer		*150 mm wafer
	*small pieces down to ~~10x10~~ mm2		*small pieces down to 5x5 mm2
			\|style="background:WhiteSmoke; color:black"\|
			*100 mm wafers
			*150 mm wafer
			*small pieces down to 5x5 mm2
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	Any sample(s) that fit inside machine		Any sample(s) that fit inside machine
Line 197:		Line 216:
	1		1
	\|colspan="2" style="background:WhiteSmoke; color:black"\|		\|colspan="2" style="background:WhiteSmoke; color:black"\|
			1
			\|style="background:WhiteSmoke; color:black"\|
	1		1
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
Line 223:		Line 244:
	*III-V materials		*III-V materials
	*Glass		*Glass
			\|style="background:WhiteSmoke; color:black"\|
			All PolyFabLab materials
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*All chemicals to be spray coated must be approved specifically for spray coating		*All chemicals to be spray coated must be approved specifically for spray coating

Taran at 08:34, 3 November 2025

2025-11-03T08:34:43Z

← Older revision		Revision as of 10:34, 3 November 2025
Line 302:		Line 302:

	{{:Specific Process Knowledge/Lithography/Coaters/labspin}}		{{:Specific Process Knowledge/Lithography/Coaters/labspin}}

			{{:Specific Process Knowledge/Lithography/Coaters/labspin04}}

	=Spray Coater=		=Spray Coater=

← Older revision		Revision as of 10:20, 25 June 2026
Line 17:		Line 17:
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam\|Spin Coater: Gamma E-beam and UV]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam\|Spin Coater: Gamma E-beam and UV]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/RCD8\|Spin Coater: RCD8]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/RCD8\|Spin Coater: RCD8]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coater~~/labspin\|Spin Coater: LabSpin 02]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 02]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coater~~/labspin\|Spin Coater: LabSpin 03]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 03]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coater~~/labspin04\|Spin Coater: LabSpin 04]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/labspin04\|Spin Coater: LabSpin 04]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]</b>
	\|-		\|-

← Older revision		Revision as of 10:18, 25 June 2026
Line 13:		Line 13:

	!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment		!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spin_Coater:_Gamma_UV~~\|Spin Coater: Gamma UV]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaUV\|Spin Coater: Gamma UV]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~DUVStepperLithography#S.C3.9CSS_Spinner-Stepper~~\|Spin Coater: Süss Stepper]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaDUV\|Spin Coater: Süss Stepper]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spin Coater: Gamma E-beam and UV~~\|Spin Coater: Gamma E-beam and UV]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam\|Spin Coater: Gamma E-beam and UV]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spin_Coater:_RCD8~~\|Spin Coater: RCD8]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/RCD8\|Spin Coater: RCD8]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coaters#Spin_coater:_Labspin~~\|Spin Coater: LabSpin 02]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coater/labspin\|Spin Coater: LabSpin 02]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coaters#Spin_coater:_Labspin~~\|Spin Coater: LabSpin 03]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coater/labspin\|Spin Coater: LabSpin 03]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coaters#Spin_Coater:_LabSpin_04~~\|Spin Coater: LabSpin 04]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coater/labspin04\|Spin Coater: LabSpin 04]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spray Coater~~\|Spray Coater]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]</b>
	\|-		\|-