Specific Process Knowledge/Lithography/Coaters - Revision history

Meenadh at 11:02, 15 September 2026

2026-09-15T11:02:58Z

← Older revision		Revision as of 13:02, 15 September 2026
Line 18:		Line 18:
	! [[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 02]]		! [[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 02]]
	! [[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 03]]		! [[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 03]]
	! [[Specific_Process_Knowledge/Lithography/Coaters/~~labspin04~~\|Spin Coater: LabSpin 04]]		! [[Specific_Process_Knowledge/Lithography/Coaters/labspin05\|Spin Coater: LabSpin 05]]
	! [[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]		! [[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]
	\|-		\|-

Taran: /* Coater Comparison Table */

2026-08-05T11:51:32Z

Coater Comparison Table

← Older revision		Revision as of 13:51, 5 August 2026
Line 38:		Line 38:
	*Coating and baking of		*Coating and baking of
	**AR-P 6200 (CSAR)		**AR-P 6200 (CSAR)
			**ZEP 520A diluted 1:2 (pay-per-use)
	**AZ 5214E		**AZ 5214E
	**AZ MiR 701 (29cps)		**AZ MiR 701 (29cps)
Line 107:		Line 108:
	* PGMEA solvent for edge bead removal and backside rinse		* PGMEA solvent for edge bead removal and backside rinse
	\|		\|
	* AR-P 6200.09 (CSAR) for 2", 4", and 6"		* AR-P 6200.09 (CSAR) for 4", and 6"
	* AZ5214E for ~~2",~~ 4", and 6"		* ZEP 520A diluted 1:2 for 4", and 6"
			* AZ5214E for 4", and 6"
	* AZ MiR 701 (29cps) for 4", and 6"		* AZ MiR 701 (29cps) for 4", and 6"
	* AZ4562 for 4", and 6"		* AZ4562 for 4", and 6"
Line 127:		Line 129:
	\|		\|
	* No manual dispense		* No manual dispense
	* Syringe dispense (30cc) of PGMEA and anisole-based resist (2" only)		* Syringe dispense (30cc) of PGMEA and anisole-based resist (Coater1 only)
	\| Only manual dispense		\| Only manual dispense
	\|colspan="2"\| Only manual dispense		\|colspan="2"\| Only manual dispense
Line 162:		Line 164:
	*200 mm wafers (may require tool change)		*200 mm wafers (may require tool change)
	\|		\|
	*2" or 50 mm wafers		*2" or 50 mm wafers (tool change required)
	*100 mm wafers		*100 mm wafers
	*150 mm wafers		*150 mm wafers

Jehem at 13:02, 26 June 2026

2026-06-26T13:02:17Z

← Older revision		Revision as of 15:02, 26 June 2026
Line 61:		Line 61:
	**mr-DWL		**mr-DWL
	**other resists		**other resists
	~~OBS~~: this tool is in PolyFabLab
			NB: this tool is in PolyFabLab
	\|		\|
	*Spraying imprint resist		*Spraying imprint resist
Line 119:		Line 120:
	! scope=row\| Manual dispense option		! scope=row\| Manual dispense option
	\|		\|
	* no manual dispense		* No manual dispense
	* ~~syringe~~ dispense (60cc) of PGMEA-based resist		* Syringe dispense (60cc) of PGMEA-based resist
	\|		\|
	* no manual dispense		* No manual dispense
	* ~~syringe~~ dispense (60cc) of PGMEA and anisole-based resist		* Syringe dispense (60cc) of PGMEA and anisole-based resist
	\|		\|
	* no manual dispense		* No manual dispense
	* ~~syringe~~ dispense (30cc) of PGMEA and anisole-based resist (2" only)		* Syringe dispense (30cc) of PGMEA and anisole-based resist (2" only)
	\|		\| Only manual dispense
	* yes
	* pneumatic dispense ~~for SU-8 resist and EBR solvent <span style="color:red">OBS: disabled 2024</span>~~
	\|colspan="2"\| Only manual dispense		\|colspan="2"\| Only manual dispense
	\| Only manual dispense		\| Only manual dispense

Jehem at 12:56, 26 June 2026

2026-06-26T12:56:50Z

Show changes

Jehem at 08:20, 25 June 2026

2026-06-25T08:20:43Z

@@ Line 311: / Line 311: @@
 ==Softbake==
 After spin coating, the solvent in the resist must be evaporated in a baking step, in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface, either in direct contact on the manual hotlpates or by resting on shallow bumps 150 µm above the hotplate in the Gamma tools. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake.
 =Decommisioned tools=

Jehem at 08:20, 25 June 2026

2026-06-25T08:20:04Z

← Older revision		Revision as of 10:20, 25 June 2026
Line 17:		Line 17:
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam\|Spin Coater: Gamma E-beam and UV]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam\|Spin Coater: Gamma E-beam and UV]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/RCD8\|Spin Coater: RCD8]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/RCD8\|Spin Coater: RCD8]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coater~~/labspin\|Spin Coater: LabSpin 02]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 02]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coater~~/labspin\|Spin Coater: LabSpin 03]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 03]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coater~~/labspin04\|Spin Coater: LabSpin 04]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/labspin04\|Spin Coater: LabSpin 04]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]</b>
	\|-		\|-

Jehem at 08:18, 25 June 2026

2026-06-25T08:18:52Z

← Older revision		Revision as of 10:18, 25 June 2026
Line 13:		Line 13:

	!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment		!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spin_Coater:_Gamma_UV~~\|Spin Coater: Gamma UV]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaUV\|Spin Coater: Gamma UV]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~DUVStepperLithography#S.C3.9CSS_Spinner-Stepper~~\|Spin Coater: Süss Stepper]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaDUV\|Spin Coater: Süss Stepper]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spin Coater: Gamma E-beam and UV~~\|Spin Coater: Gamma E-beam and UV]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam\|Spin Coater: Gamma E-beam and UV]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spin_Coater:_RCD8~~\|Spin Coater: RCD8]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/RCD8\|Spin Coater: RCD8]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coaters#Spin_coater:_Labspin~~\|Spin Coater: LabSpin 02]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coater/labspin\|Spin Coater: LabSpin 02]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coaters#Spin_coater:_Labspin~~\|Spin Coater: LabSpin 03]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coater/labspin\|Spin Coater: LabSpin 03]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coaters#Spin_Coater:_LabSpin_04~~\|Spin Coater: LabSpin 04]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coater/labspin04\|Spin Coater: LabSpin 04]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spray Coater~~\|Spray Coater]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]</b>
	\|-		\|-

Jehem: /* Decommisioned tools */

2026-01-13T11:32:24Z

Decommisioned tools

← Older revision		Revision as of 13:32, 13 January 2026
Line 330:		Line 330:
	=Decommisioned tools=		=Decommisioned tools=
	<span style="color:red">The spin track was decommissioned 2018-02-01.</span>		<span style="color:red">The spin track was decommissioned 2018-02-01.</span>

	[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing\|Information about decommissioned tool can be found here.]]		[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing\|Information about decommissioned tool can be found here.]]

Jehem at 09:26, 12 January 2026

2026-01-12T09:26:40Z

@@ Line 313: / Line 313: @@
 =Spin coaters at DTU Nanolab=
 {{:Specific Process Knowledge/Lithography/Coaters/GammaUV}}
@@ Line 330: / Line 326: @@
 {{:Specific Process Knowledge/Lithography/Coaters/labspin04}}
-=Spray Coater=
+{{:Specific Process Knowledge/Lithography/Coaters/sprayCoater}}
-The spray coater at DTU Nanolab is located in Cleanroom C-1. The machine is an ExactaCoat from Sono-tek which can be fitted with one of three different nozzles depending on the nature of the spray coating tasks at hand. The three different nozzles (Impact, AccuMist and Vortex) are optimized for different applications such as spray coating of large areas (e.g. entire wafers), smaller areas (e.g. wafer pieces or other small samples) or already structured samples that cannot be coated uniformly by spin coating. All nozzles use an ultrasonic tranducer for atomizing the solution to be spray coated. It is therefore a prerequisite that all components are compatible with this process. This is the case with most substances, although process parameters may need optimization to give satisfactory results.
+=Decommisioned tools=
+<span style="color:red">The spin track was decommissioned 2018-02-01.</span>
-Practically any sample that will fit inside the spray coater can be processed. Spray patterns are easily programmed either using predefined spray patterns (1D line, 2D rectangles/circles/meanders/spirals) or custom 3D spray patterns.
+[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing|Information about decommissioned tool can be found here.]]

Taran at 10:06, 3 November 2025

2025-11-03T10:06:51Z

← Older revision		Revision as of 12:06, 3 November 2025
Line 64:		Line 64:
	**mr-DWL		**mr-DWL
	**other resists		**other resists
			OBS: this tool is in PolyFabLab
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Spraying imprint resist		*Spraying imprint resist
Line 109:		Line 110:
	* KRF M230Y resist		* KRF M230Y resist
	* KRF M35G resist		* KRF M35G resist
			* PGMEA solvent for edge bead removal and backside rinse
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	* AR-P 6200.09 (CSAR) for 2", 4", and 6"		* AR-P 6200.09 (CSAR) for 2", 4", and 6"
Line 135:		Line 137:
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	* yes		* yes
	* pneumatic dispense for SU-8 resist and EBR solvent		* pneumatic dispense for SU-8 resist and EBR solvent <span style="color:red">OBS: disabled 2024</span>
	\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense		\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense
	\|style="background:WhiteSmoke; color:black"\|Only manual dispense		\|style="background:WhiteSmoke; color:black"\|Only manual dispense

← Older revision		Revision as of 13:02, 15 September 2026
Line 18:		Line 18:
	! [[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 02]]		! [[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 02]]
	! [[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 03]]		! [[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 03]]
	! [[Specific_Process_Knowledge/Lithography/Coaters/~~labspin04~~\|Spin Coater: LabSpin 04]]		! [[Specific_Process_Knowledge/Lithography/Coaters/labspin05\|Spin Coater: LabSpin 05]]
	! [[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]		! [[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]
	\|-		\|-

← Older revision		Revision as of 10:20, 25 June 2026
Line 17:		Line 17:
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam\|Spin Coater: Gamma E-beam and UV]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam\|Spin Coater: Gamma E-beam and UV]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/RCD8\|Spin Coater: RCD8]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/RCD8\|Spin Coater: RCD8]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coater~~/labspin\|Spin Coater: LabSpin 02]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 02]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coater~~/labspin\|Spin Coater: LabSpin 03]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/labspin\|Spin Coater: LabSpin 03]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coater~~/labspin04\|Spin Coater: LabSpin 04]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/labspin04\|Spin Coater: LabSpin 04]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]</b>
	\|-		\|-

← Older revision		Revision as of 10:18, 25 June 2026
Line 13:		Line 13:

	!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment		!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spin_Coater:_Gamma_UV~~\|Spin Coater: Gamma UV]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaUV\|Spin Coater: Gamma UV]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~DUVStepperLithography#S.C3.9CSS_Spinner-Stepper~~\|Spin Coater: Süss Stepper]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaDUV\|Spin Coater: Süss Stepper]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spin Coater: Gamma E-beam and UV~~\|Spin Coater: Gamma E-beam and UV]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam\|Spin Coater: Gamma E-beam and UV]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spin_Coater:_RCD8~~\|Spin Coater: RCD8]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/RCD8\|Spin Coater: RCD8]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coaters#Spin_coater:_Labspin~~\|Spin Coater: LabSpin 02]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coater/labspin\|Spin Coater: LabSpin 02]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coaters#Spin_coater:_Labspin~~\|Spin Coater: LabSpin 03]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coater/labspin\|Spin Coater: LabSpin 03]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/~~Coaters#Spin_Coater:_LabSpin_04~~\|Spin Coater: LabSpin 04]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coater/labspin04\|Spin Coater: LabSpin 04]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters~~#Spray Coater~~\|Spray Coater]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater\|Spray Coater]]</b>
	\|-		\|-