Specific Process Knowledge/Lithography/Coaters - Revision history

Jehem: /* Decommisioned tools */

2026-01-13T11:32:24Z

Decommisioned tools

← Older revision		Revision as of 13:32, 13 January 2026
Line 330:		Line 330:
	=Decommisioned tools=		=Decommisioned tools=
	<span style="color:red">The spin track was decommissioned 2018-02-01.</span>		<span style="color:red">The spin track was decommissioned 2018-02-01.</span>

	[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing\|Information about decommissioned tool can be found here.]]		[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing\|Information about decommissioned tool can be found here.]]

Jehem at 09:26, 12 January 2026

2026-01-12T09:26:40Z

@@ Line 313: / Line 313: @@
 =Spin coaters at DTU Nanolab=
 {{:Specific Process Knowledge/Lithography/Coaters/GammaUV}}
@@ Line 330: / Line 326: @@
 {{:Specific Process Knowledge/Lithography/Coaters/labspin04}}
-=Spray Coater=
+{{:Specific Process Knowledge/Lithography/Coaters/sprayCoater}}
-The spray coater at DTU Nanolab is located in Cleanroom C-1. The machine is an ExactaCoat from Sono-tek which can be fitted with one of three different nozzles depending on the nature of the spray coating tasks at hand. The three different nozzles (Impact, AccuMist and Vortex) are optimized for different applications such as spray coating of large areas (e.g. entire wafers), smaller areas (e.g. wafer pieces or other small samples) or already structured samples that cannot be coated uniformly by spin coating. All nozzles use an ultrasonic tranducer for atomizing the solution to be spray coated. It is therefore a prerequisite that all components are compatible with this process. This is the case with most substances, although process parameters may need optimization to give satisfactory results.
+=Decommisioned tools=
+<span style="color:red">The spin track was decommissioned 2018-02-01.</span>
-Practically any sample that will fit inside the spray coater can be processed. Spray patterns are easily programmed either using predefined spray patterns (1D line, 2D rectangles/circles/meanders/spirals) or custom 3D spray patterns.
+[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing|Information about decommissioned tool can be found here.]]

Taran at 10:06, 3 November 2025

2025-11-03T10:06:51Z

← Older revision		Revision as of 12:06, 3 November 2025
Line 64:		Line 64:
	**mr-DWL		**mr-DWL
	**other resists		**other resists
			OBS: this tool is in PolyFabLab
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Spraying imprint resist		*Spraying imprint resist
Line 109:		Line 110:
	* KRF M230Y resist		* KRF M230Y resist
	* KRF M35G resist		* KRF M35G resist
			* PGMEA solvent for edge bead removal and backside rinse
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	* AR-P 6200.09 (CSAR) for 2", 4", and 6"		* AR-P 6200.09 (CSAR) for 2", 4", and 6"
Line 135:		Line 137:
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	* yes		* yes
	* pneumatic dispense for SU-8 resist and EBR solvent		* pneumatic dispense for SU-8 resist and EBR solvent <span style="color:red">OBS: disabled 2024</span>
	\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense		\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense
	\|style="background:WhiteSmoke; color:black"\|Only manual dispense		\|style="background:WhiteSmoke; color:black"\|Only manual dispense

Taran: /* Coater Comparison Table */

2025-11-03T09:45:21Z

Coater Comparison Table

← Older revision		Revision as of 11:45, 3 November 2025
Line 19:		Line 19:
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin\|Spin Coater: LabSpin 02]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin\|Spin Coater: LabSpin 02]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin\|Spin Coater: LabSpin 03]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin\|Spin Coater: LabSpin 03]]</b>
			\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_LabSpin_04\|Spin Coater: LabSpin 04]]</b>
	\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spray Coater\|Spray Coater]]</b>		\|style="background:WhiteSmoke; color:black"\|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spray Coater\|Spray Coater]]</b>
	\|-		\|-
Line 58:		Line 59:
	**AZ5214E, AZ4562, AZMiR701, AZnLOF, SU-8		**AZ5214E, AZ4562, AZMiR701, AZnLOF, SU-8
	*Coating of imprint resists		*Coating of imprint resists
			\|style="background:WhiteSmoke; color:black"\|
			*Coating of
			**SU-8
			**mr-DWL
			**other resists
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Spraying imprint resist		*Spraying imprint resist
Line 86:		Line 92:
	* Vacuum chucks for chips, 2", 4", and 6"		* Vacuum chucks for chips, 2", 4", and 6"
	* 4" edge handling chuck		* 4" edge handling chuck
			\|style="background:WhiteSmoke; color:black"\|
			* Single substrate
			* Vacuum chucks for chips, 4", and 6"
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	Can handle almost any sample size and shape		Can handle almost any sample size and shape
Line 109:		Line 118:
	No permanent media		No permanent media
	\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense		\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense
			\|style="background:WhiteSmoke; color:black"\|Only manual dispense
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	No permanent media		No permanent media
Line 127:		Line 137:
	* pneumatic dispense for SU-8 resist and EBR solvent		* pneumatic dispense for SU-8 resist and EBR solvent
	\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense		\|colspan="2" style="background:WhiteSmoke; color:black"\|Only manual dispense
			\|style="background:WhiteSmoke; color:black"\|Only manual dispense
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	Two syringe pumps		Two syringe pumps
Line 142:		Line 153:
	10 - 5000 rpm (3000 rpm with non-vacuum chuck)		10 - 5000 rpm (3000 rpm with non-vacuum chuck)
	\|colspan="2" style="background:WhiteSmoke; color:black"\|		\|colspan="2" style="background:WhiteSmoke; color:black"\|
	100 - ~~5000~~ rpm (3000 rpm with edge handling chuck)		100 - 8000 rpm (3000 rpm with edge handling chuck)
			\|style="background:WhiteSmoke; color:black"\|
			100 - 8000 rpm
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	\|-		\|-
Line 156:		Line 169:
	optional (max. speed 3000 rpm)		optional (max. speed 3000 rpm)
	\|colspan="2" style="background:WhiteSmoke; color:black"\|		\|colspan="2" style="background:WhiteSmoke; color:black"\|
			no
			\|style="background:WhiteSmoke; color:black"\|
	no		no
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
Line 182:		Line 197:
	*100 mm wafers		*100 mm wafers
	*150 mm wafer		*150 mm wafer
	*small pieces down to ~~10x10~~ mm2		*small pieces down to 5x5 mm2
			\|style="background:WhiteSmoke; color:black"\|
			*100 mm wafers
			*150 mm wafer
			*small pieces down to 5x5 mm2
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	Any sample(s) that fit inside machine		Any sample(s) that fit inside machine
Line 197:		Line 216:
	1		1
	\|colspan="2" style="background:WhiteSmoke; color:black"\|		\|colspan="2" style="background:WhiteSmoke; color:black"\|
			1
			\|style="background:WhiteSmoke; color:black"\|
	1		1
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
Line 223:		Line 244:
	*III-V materials		*III-V materials
	*Glass		*Glass
			\|style="background:WhiteSmoke; color:black"\|
			All PolyFabLab materials
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*All chemicals to be spray coated must be approved specifically for spray coating		*All chemicals to be spray coated must be approved specifically for spray coating

Taran at 08:34, 3 November 2025

2025-11-03T08:34:43Z

← Older revision		Revision as of 10:34, 3 November 2025
Line 302:		Line 302:

	{{:Specific Process Knowledge/Lithography/Coaters/labspin}}		{{:Specific Process Knowledge/Lithography/Coaters/labspin}}

			{{:Specific Process Knowledge/Lithography/Coaters/labspin04}}

	=Spray Coater=		=Spray Coater=

Jehem: /* Spin coating */

2025-09-26T12:09:05Z

Spin coating

← Older revision		Revision as of 14:09, 26 September 2025
Line 233:		Line 233:
	=Spin coating=		=Spin coating=
	The typical spin coating process consists of the following steps:		The typical spin coating process consists of the following steps:
	#Priming (typically HMDS)		#Priming (typically HMDS) followed by cooling to room temperature
	#Resist dispense (static or dynamic)		#Resist dispense (rotation: static or dynamic rotation)(arm: stationary or moving)
	#*Optional: Acceleration to a low spin speed if dynamic dispense is used		#*Optional: Acceleration to a low spin speed if dynamic dispense is used
	#*Optional: Resist spreading at low spin speed		#*Optional: Resist spreading at low spin speed for spreading thicker resists
	#Spin-off		#Spin-off
	#Backside rinse (typically during spin-off)		#Backside rinse (typically during spin-off)
	#Optional: Edge-bead removal		#Optional: Edge-bead removal
	#Softbake (contact or proximity)		#Softbake (contact or proximity)
			#Cooling to room temperature


	After priming, the wafer is is transferred to the spin coater. If static dispense is used, the wafer ~~remains static~~ during the resist dispense. In the case of dynamic dispense, the wafer rotates at low spin speed during the dispense. Using too high spin speed during dispense can cause surface wetting issues, while a too low spin speed causes the resist to flow onto the backside of the wafer. After dispense, a short spin at low spin speed may be used in order to spread the resist over the wafer surface before spin-off.		After priming, the wafer is cooled to room temperature and then transferred to the spin coater. If static dispense is used, the wafer is not rotating during the resist dispense. In the case of dynamic dispense, the wafer rotates at low spin speed during the dispense. The dispense arm is normally stationary during dispense, but some substrates may require the arm to move slowly across the substrate area while dispensing. Moving arm dispensing is usually only done with a rotating substrate.

			Using too high spin speed during dispense can cause surface wetting issues, while a too low spin speed causes the resist to flow onto the backside of the wafer. After dispense, a short spin at low spin speed may be used in order to spread the resist over the wafer surface before spin-off.

	==Spin-off==		==Spin-off==

Taran: /* Softbake */

2025-08-30T07:05:09Z

Softbake

← Older revision		Revision as of 09:05, 30 August 2025
Line 282:		Line 282:

	==Softbake==		==Softbake==
	After spin coating, the solvent in the resist must be evaporated in a baking step, in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface, either in direct contact on a manual ~~hotlpate~~ or by resting on shallow bumps 150 µm above the hotplate in the Gamma tools. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake.		After spin coating, the solvent in the resist must be evaporated in a baking step, in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface, either in direct contact on the manual hotlpates or by resting on shallow bumps 150 µm above the hotplate in the Gamma tools. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake.

	=Spin coaters at DTU Nanolab=		=Spin coaters at DTU Nanolab=

Taran: /* Softbake */

2025-08-30T07:04:24Z

Softbake

← Older revision		Revision as of 09:04, 30 August 2025
Line 282:		Line 282:

	==Softbake==		==Softbake==
	After spin coating, the solvent in the resist must be evaporated in a baking step, in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface, either in direct contact or by resting on shallow bumps (150 µm above the hotplate in the Gamma tools). In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake.		After spin coating, the solvent in the resist must be evaporated in a baking step, in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface, either in direct contact on a manual hotlpate or by resting on shallow bumps 150 µm above the hotplate in the Gamma tools. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake.

	=Spin coaters at DTU Nanolab=		=Spin coaters at DTU Nanolab=

Taran: /* Softbake */

2025-08-30T07:03:42Z

Softbake

← Older revision		Revision as of 09:03, 30 August 2025
Line 282:		Line 282:

	==Softbake==		==Softbake==
	After spin coating, the solvent in the resist must be evaporated in a baking step, in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface ~~while~~ resting on shallow bumps ~~only~~ 150 µm above the hotplate. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake.		After spin coating, the solvent in the resist must be evaporated in a baking step, in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface, either in direct contact or by resting on shallow bumps (150 µm above the hotplate in the Gamma tools). In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake.

	=Spin coaters at DTU Nanolab=		=Spin coaters at DTU Nanolab=

Jehem: /* Spin track */

2025-01-22T07:27:51Z

Spin track

← Older revision		Revision as of 09:27, 22 January 2025
Line 286:		Line 286:
	=Spin coaters at DTU Nanolab=		=Spin coaters at DTU Nanolab=
	==Spin track==		==Spin track==
	<span style="color:red">The spin track was decommissioned ~~2019~~-01.</span>		<span style="color:red">The spin track was decommissioned 2018-02-01.</span>

	[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing\|Information about decommissioned tool can be found here.]]		[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing\|Information about decommissioned tool can be found here.]]