Specific Process Knowledge/Lithography/ARN8200 - Revision history

Thope: /* Results at 30 kV (Raith eLINE) */

2022-08-08T10:42:15Z

Results at 30 kV (Raith eLINE)

← Older revision		Revision as of 12:42, 8 August 2022
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	Area/curved element dose: Fully insoluble dose is around 150-180 µC/cm2.		Area/curved element dose: Fully insoluble dose is around 150-180 µC/cm2.

	Line dose: Fully insoluble dose is around 1700 µC/cm.		Line dose: Fully insoluble dose is around 1700 pC/cm.

	Dot dose: Fully insoluble dose is around 0.1 µC, this gives a circular diameter of 60 nm. Diameter can be varied by increasing dose, at 0.4 µC diameter is about 100 nm and at 1.2 µC it is about 170 nm.		Dot dose: Fully insoluble dose is around 0.1 pC, this gives a circular diameter of 60 nm. Diameter can be varied by increasing dose, at 0.4 pC diameter is about 100 nm and at 1.2 pC it is about 170 nm.

2022-08-08T10:39:42Z

Results at 30 kV (Raith eLINE)

← Older revision		Revision as of 12:39, 8 August 2022
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			Area/curved element dose: Fully insoluble dose is around 150-180 µC/cm2.

			Line dose: Fully insoluble dose is around 1700 µC/cm.

			Dot dose: Fully insoluble dose is around 0.1 µC, this gives a circular diameter of 60 nm. Diameter can be varied by increasing dose, at 0.4 µC diameter is about 100 nm and at 1.2 µC it is about 170 nm.

2022-08-08T09:30:33Z

← Older revision		Revision as of 11:30, 8 August 2022
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	[[file:ARN8200DoseCurve.png]]		[[file:ARN8200DoseCurve.png]]

			== Results at 30 kV (Raith eLINE) ==

			A dose test is carried out with the following parameters

			{\|border="1" cellspacing="0" cellpadding="3" style="text-align:left;" style="width: 95%"
			\|-

			\|-
			\|-style="background:Black; color:White"
			!colspan="5"\|AR-N 8200 30 kV dose test, Processed by THOPE, AUG 2022
			\|-

			\|-
			\|-style="background:WhiteSmoke; color:black"
			!Resist
			!Spin Coat
			!E-beam exposure
			!PEB
			!Development
			\|-

			\|-
			\|-style="background:WhiteSmoke; color:black"
			\|AR-N8200.06
			\|LabSpin 2, 4000 rpm for 60s, softbake 10 min @ 150 degC, thickness is 120 nm
			\|Raith eLINE Plus, 30 kV, 60 µm aperture, 168 pA
			\|Labspin 2 hotplate 170 degC for 10 min
			\|EBL development fumehood, 60 sec development in AR300-47:DIW (1:1), 30 sec rinse in DIW, nitrogen gun dry
			\|-

			\|}

2022-08-08T09:25:34Z

Contrast curve

← Older revision		Revision as of 11:25, 8 August 2022
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	Allresist also provides these [https://www.allresist.com/wp-content/uploads/sites/2/2020/03/SXAR-N8200-1_english_Allresist_product_information.pdf processing guidelines.]		Allresist also provides these [https://www.allresist.com/wp-content/uploads/sites/2/2020/03/SXAR-N8200-1_english_Allresist_product_information.pdf processing guidelines.]

	== Contrast curve ==		== Contrast curve @ 100 kV (JEOL 9500) ==

	Exposure dose for AR-N 8200 is very dependent on Post Exposure Bake (PEB) temperature. A contrast curve for four different PEB processes were obtained with the following process parameters.		Exposure dose for AR-N 8200 is very dependent on Post Exposure Bake (PEB) temperature. A contrast curve for four different PEB processes were obtained with the following process parameters.

2022-03-17T09:01:26Z

Contrast curve

← Older revision		Revision as of 11:01, 17 March 2022
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	Exposure dose for AR-N 8200 is very dependent on Post Exposure Bake (PEB) temperature. A contrast curve for four different PEB processes were obtained with the following process parameters.		Exposure dose for AR-N 8200 is very dependent on Post Exposure Bake (PEB) temperature. A contrast curve for four different PEB processes were obtained with the following process parameters.


	{\|border="1" cellspacing="0" cellpadding="3" style="text-align:left;" style="width: 95%"		{\|border="1" cellspacing="0" cellpadding="3" style="text-align:left;" style="width: 95%"
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	\|}		\|}


	Hotplate temperatures are assumed surface temperatures based on the 0.90 correction factor in use on the hotplate.		Hotplate temperatures are assumed surface temperatures based on the 0.90 correction factor in use on the hotplate.


	The resulting resist structure height is mapped with Dektak XTa and plotted as a contrast curve below. It is apparent that the dose and contrast is very dependent on the PEB parameters.		The resulting resist structure height is mapped with Dektak XTa and plotted as a contrast curve below. It is apparent that the dose and contrast is very dependent on the PEB parameters.

2022-03-17T08:48:04Z

Contrast curve

← Older revision		Revision as of 10:48, 17 March 2022
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	Hotplate temperatures are assumed surface temperatures based on the 0.90 correction factor in use on the hotplate.		Hotplate temperatures are assumed surface temperatures based on the 0.90 correction factor in use on the hotplate.

			The resulting resist structure height is mapped with Dektak XTa and plotted as a contrast curve below. It is apparent that the dose and contrast is very dependent on the PEB parameters.


	[[file:ARN8200DoseCurve.png]]		[[file:ARN8200DoseCurve.png]]

2022-03-17T08:39:46Z

Contrast curve

← Older revision		Revision as of 10:39, 17 March 2022
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	\|AR-N8200.06		\|AR-N8200.06
	\|LabSpin 2, 4000 rpm for 60s, softbake 10 min @ 150 degC, thickness is ~~105~~ nm		\|LabSpin 2, 4000 rpm for 60s, softbake 10 min @ 150 degC, thickness is 110 nm
	\|JBX9500, 60 nA, doses 100-1600 µC/cm2, 150 µm x 300 µm rectangles		\|JBX9500, 60 nA, doses 100-1600 µC/cm2, 150 µm x 300 µm rectangles
	\|Labspin 2 hotplate, 130, 150, 160 or 170 degC for 10 min		\|Labspin 2 hotplate, 130, 150, 160 or 170 degC for 10 min

2022-03-17T08:39:27Z

Contrast curve

← Older revision		Revision as of 10:39, 17 March 2022
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	\|AR-N8200.06		\|AR-N8200.06
	\|LabSpin 2, 4000 rpm for 60s, softbake 10 min @ 150 degC		\|LabSpin 2, 4000 rpm for 60s, softbake 10 min @ 150 degC, thickness is 105 nm
	\|JBX9500, 60 nA, doses 100-1600 µC/cm2, 150 µm x 300 µm rectangles		\|JBX9500, 60 nA, doses 100-1600 µC/cm2, 150 µm x 300 µm rectangles
	\|Labspin 2 hotplate, 130, 150, 160 or 170 degC for 10 min		\|Labspin 2 hotplate, 130, 150, 160 or 170 degC for 10 min

2022-03-17T08:36:59Z

Contrast curve

← Older revision		Revision as of 10:36, 17 March 2022
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	\|}		\|}

	~~Spin coating~~		Hotplate temperatures are assumed surface temperatures based on the 0.90 correction factor in use on the hotplate.
	~~Labspin 2~~


	[[file:ARN8200DoseCurve.png]]		[[file:ARN8200DoseCurve.png]]

2022-03-17T08:32:14Z

Contrast curve

← Older revision		Revision as of 10:32, 17 March 2022
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	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	\|AR-N8200.06 ~~AllResist~~		\|AR-N8200.06
	\|LabSpin ~~E-5~~, 4000 rpm, 60s, ~~softbaked~~ 10 min @ 150 degC		\|LabSpin 2, 4000 rpm for 60s, softbake 10 min @ 150 degC
	\|~~09-02-2016,~~ JBX9500 ~~E-2~~, ~~2nA aperture 5~~, doses 40-~~600~~ µC/cm2, ~~100 nm lines and~~ 300 ~~nm spaces~~		\|JBX9500, 60 nA, doses 100-1600 µC/cm2, 150 µm x 300 µm rectangles
	\|~~11-02-2016~~, ~~Fumehood D-2~~, ~~AR-600-546~~, ~~rinsed in IPA 60s.~~		\|Labspin 2 hotplate, 130, 150, 160 or 170 degC for 10 min
	\|~~02-03-2016 AFM Icon~~, F-2, ~~ScanAsyst~~ in ~~Air~~		\|EBL development fumehood, 60 sec development in AR300-47:DIW (1:1), 30 sec rinse in DIW, nitrogen gun dry
	\|-		\|-