Specific Process Knowledge/Lithography/4562 - Revision history

Jehem at 11:26, 20 April 2026

2026-04-20T11:26:17Z

← Older revision		Revision as of 13:26, 20 April 2026
Line 1:		Line 1:
	{{~~:Specific Process Knowledge/Lithography/authors_generic~~}}		{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/4562 click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/4562 click here]'''

2025-08-25T13:20:52Z

← Older revision		Revision as of 15:20, 25 August 2025
Line 22:		Line 22:


	The thickest achievable coating using a normal spin cycle is 10 µm. However, reducing the spin-off time to a few seconds at 2000 rpm, has successfully been used to increase the coating thickness beyond 20 µm on a Gamma coater. The substrate waits for 1 min before softbake, in order to reduce the edge bead height.		The thickest achievable coating using a normal spin cycle is 10 µm. However, reducing the spin-off time to a few seconds at 2000 rpm, has successfully been used to increase the coating thickness beyond 20 µm on a Gamma coater. The substrate waits for 1 min before softbake, in order to reduce the edge bead height. For these thicker coatings, the softbake time must be increased.

	<br clear="all" />		<br clear="all" />

2023-04-05T14:04:05Z

Spin coating

← Older revision		Revision as of 16:04, 5 April 2023
Line 15:		Line 15:

	==Spin coating==		==Spin coating==
	[[Image:4562spincurves.JPG\|500x500px\|thumb\|Spin curves for AZ 4562 using ~~60s~~ spin-off and ~~60s~~@100°C softbake on LabSpin, and ~~30s~~ spin-off and ~~300s~~@100°C ~~1mm~~ proximity softbake on Gamma]]		[[Image:4562spincurves.JPG\|500x500px\|thumb\|Spin curves for AZ 4562 using 60 s spin-off and 60 s @ 100°C softbake on LabSpin, and 30 s spin-off and 300 s @ 100°C 1 mm proximity softbake on Gamma]]

	'''Typical spin parameters:'''		'''Typical spin parameters:'''

2023-04-05T14:03:19Z

Spin coating

← Older revision		Revision as of 16:03, 5 April 2023
Line 22:		Line 22:


	The thickest achievable coating using a normal spin cycle is ~~probably~~ 10~~-15µm~~. However, reducing the spin-off time to a few seconds at 2000 rpm, has successfully been used to increase the coating thickness beyond 20 µm on a Gamma coater. The substrate waits for 1 min before softbake, in order to reduce the edge bead height.		The thickest achievable coating using a normal spin cycle is 10 µm. However, reducing the spin-off time to a few seconds at 2000 rpm, has successfully been used to increase the coating thickness beyond 20 µm on a Gamma coater. The substrate waits for 1 min before softbake, in order to reduce the edge bead height.

	<br clear="all" />		<br clear="all" />

2023-04-05T14:02:28Z

Resist description

← Older revision		Revision as of 16:02, 5 April 2023
Line 9:		Line 9:

	==Resist description==		==Resist description==
	AZ 4562 is a positive UV photoresist for thick coatings (5 - 20 µm).		AZ 4562 is a positive UV photoresist for thick coatings (5 - 10 µm).

	==Priming==		==Priming==

2023-04-05T13:32:32Z

Exposure

← Older revision		Revision as of 15:32, 5 April 2023
Line 34:		Line 34:

	After exposure, the nitrogen generated in the resist film must be allowed to diffuse out, in order to avoid bubble formation (in particular before any heating). This process is similar to rehydration, but usually slower.		After exposure, the nitrogen generated in the resist film must be allowed to diffuse out, in order to avoid bubble formation (in particular before any heating). This process is similar to rehydration, but usually slower.


	'''Exposure in mask aligner:'''<br>		'''Exposure in mask aligner:'''<br>

2023-04-05T13:32:23Z

Exposure

← Older revision		Revision as of 15:32, 5 April 2023
Line 35:		Line 35:
	After exposure, the nitrogen generated in the resist film must be allowed to diffuse out, in order to avoid bubble formation (in particular before any heating). This process is similar to rehydration, but usually slower.		After exposure, the nitrogen generated in the resist film must be allowed to diffuse out, in order to avoid bubble formation (in particular before any heating). This process is similar to rehydration, but usually slower.

	'''Exposure in mask aligner:'''		'''Exposure in mask aligner:'''<br>
	In order to avoid heating during exposure, leading to the formation of bubbles, it is recommended to use multiple exposure, limiting the exposure time for each cycle to 10-15 s, and using a 10-15 s pause between cycles.		In order to avoid heating during exposure, leading to the formation of bubbles, it is recommended to use multiple exposure, limiting the exposure time for each cycle to 10-15 s, and using a 10-15 s pause between cycles.

2023-04-05T13:31:11Z

Resist description

← Older revision		Revision as of 15:31, 5 April 2023
Line 9:		Line 9:

	==Resist description==		==Resist description==
	AZ 4562 is a positive UV photoresist for thick coatings (5 - 30 µm).		AZ 4562 is a positive UV photoresist for thick coatings (5 - 20 µm).

	==Priming==		==Priming==

2023-04-05T13:30:56Z

Resist description

← Older revision		Revision as of 15:30, 5 April 2023
Line 9:		Line 9:

	==Resist description==		==Resist description==
	AZ 4562 is a positive UV photoresist for thick coatings (~~above 5µm~~).		AZ 4562 is a positive UV photoresist for thick coatings (5 - 30 µm).

	==Priming==		==Priming==

2023-01-31T10:13:12Z

← Older revision		Revision as of 12:13, 31 January 2023
Line 1:		Line 1:
			{{:Specific Process Knowledge/Lithography/authors_generic}}

			'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/4562 click here]'''

			[[Category: Lithography\|Resist]]
			[[Category: Resist\|AZ 4562]]

	__TOC__		__TOC__