Specific Process Knowledge/Imprinting - Revision history

Mmat: /* Stamp for imprint */

2025-06-10T15:25:16Z

Stamp for imprint

← Older revision		Revision as of 17:25, 10 June 2025
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	== Stamp for imprint ==		== Stamp for imprint ==
	A stamp for imprint lithography is usually made in Si or SiO, however other materials could also be used.		A stamp for imprint lithography is usually made in Si or SiO, however other materials could also be used.
	Here is a process flow for stamp made of SU8 resist.[[~~index.php?title=~~Media:Stamp Fabrication.docx\| Stamp fabrication flow.]]		Here is a process flow for stamp made of SU8 resist.[[Media:Stamp Fabrication.docx\| Stamp fabrication flow.]]

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Mmat: /* Nano Imrint Lithography */

2025-05-27T17:07:24Z

Nano Imrint Lithography

← Older revision		Revision as of 19:07, 27 May 2025
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	__TOC__		__TOC__

	= Nano ~~Imrint~~ Lithography =		= Nano Imprint Lithography =

	Nano Imprint Lithography, similar to Hot Embossing, is a parallel transfer of a pattern made by a serial technique (often e-beam). First a stamp is made, usually in Si or SiO<math>\rm{_2}</math> however other materials could also be used. The pattern on the stamp is then transferred to a polymer (on a different substrate), by heating both stamp and substrate to above the glass transition temperature T<math>_g</math> of the polymer and then pressing the stamp and the substrate together, hence deforming the polymer on the substrate. The stamp and substrate are then cooled down and only separated when the temperature is well below T<math>_g</math> of the polymer. Normally the stack is often cooled to room temperature to easily separate the two parts.		Nano Imprint Lithography, similar to Hot Embossing, is a parallel transfer of a pattern made by a serial technique (often e-beam). First a stamp is made, usually in Si or SiO<math>\rm{_2}</math> however other materials could also be used. The pattern on the stamp is then transferred to a polymer (on a different substrate), by heating both stamp and substrate to above the glass transition temperature T<math>_g</math> of the polymer and then pressing the stamp and the substrate together, hence deforming the polymer on the substrate. The stamp and substrate are then cooled down and only separated when the temperature is well below T<math>_g</math> of the polymer. Normally the stack is often cooled to room temperature to easily separate the two parts.

Mmat: /* Choose an Equipment */

2025-05-27T10:11:13Z

Choose an Equipment

← Older revision		Revision as of 12:11, 27 May 2025
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	== Choose an Equipment ==		== Choose an Equipment ==
			*[[Specific_Process_Knowledge/Lithography/NanoImprintLithography#EVG_NIL\|Imprinter 01]] - ''Tool to Imprint''
	*[[Specific Process Knowledge/Thin_film_deposition/MVD\|MVD]] - Molecular Vapor Deposition - ''Tool to deposit an antistiction coating for silicon or metal stamps''		*[[Specific Process Knowledge/Thin_film_deposition/MVD\|MVD]] - Molecular Vapor Deposition - ''Tool to deposit an antistiction coating for silicon or metal stamps''
	*[[Specific_Process_Knowledge/Lithography/NanoImprintLithography#EVG_NIL\|Imprinter 01]] - ''Tool to Imprint''
	*[[Specific Process Knowledge/Characterization/Drop Shape Analyzer\|Drop Shape Analyzer]] - ''Tool to measure the hydrophobicity of the antistiction layer''		*[[Specific Process Knowledge/Characterization/Drop Shape Analyzer\|Drop Shape Analyzer]] - ''Tool to measure the hydrophobicity of the antistiction layer''

Mmat: /* Choose an Equipment */

2025-05-27T10:11:02Z

Choose an Equipment

← Older revision		Revision as of 12:11, 27 May 2025
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	== Choose an Equipment ==		== Choose an Equipment ==
	*[[Specific Process Knowledge/Thin_film_deposition/MVD\|MVD]] - ''Molecular Vapor Deposition - ~~Antistiction coater~~ for silicon stamps''		*[[Specific Process Knowledge/Thin_film_deposition/MVD\|MVD]] - Molecular Vapor Deposition - ''Tool to deposit an antistiction coating for silicon or metal stamps''
	*[Specific_Process_Knowledge/Lithography/NanoImprintLithography#EVG_NIL\|Imprinter 01]] - ''Tool to ~~imprint~~''		*[[Specific_Process_Knowledge/Lithography/NanoImprintLithography#EVG_NIL\|Imprinter 01]] - ''Tool to Imprint''
	*[[Specific Process Knowledge/Characterization/Drop Shape Analyzer\|Drop Shape Analyzer]] - ''Tool to measure the hydrophobicity of the antistiction layer''		*[[Specific Process Knowledge/Characterization/Drop Shape Analyzer\|Drop Shape Analyzer]] - ''Tool to measure the hydrophobicity of the antistiction layer''

Mmat at 10:09, 27 May 2025

2025-05-27T10:09:25Z

← Older revision		Revision as of 12:09, 27 May 2025
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	== Choose an Equipment ==		== Choose an Equipment ==
	*[[Specific Process Knowledge/Thin_film_deposition/MVD\|MVD]] - ''Molecular Vapor Deposition - Antistiction coater for silicon stamps''		*[[Specific Process Knowledge/Thin_film_deposition/MVD\|MVD]] - ''Molecular Vapor Deposition - Antistiction coater for silicon stamps''
			*[Specific_Process_Knowledge/Lithography/NanoImprintLithography#EVG_NIL\|Imprinter 01]] - ''Tool to imprint''
	*[[Specific Process Knowledge/Characterization/Drop Shape Analyzer\|Drop Shape Analyzer]] - ''Tool to measure the hydrophobicity of the antistiction layer''		*[[Specific Process Knowledge/Characterization/Drop Shape Analyzer\|Drop Shape Analyzer]] - ''Tool to measure the hydrophobicity of the antistiction layer''
	*[[Specific_Process_Knowledge/Lithography/NanoImprintLithography#EVG_NIL\|Imprinter 01]] - ''Tool to imprint''

Mmat at 10:09, 27 May 2025

2025-05-27T10:09:10Z

← Older revision		Revision as of 12:09, 27 May 2025
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	__TOC__		__TOC__

	= ~~Imprinting~~ =		= Nano Imrint Lithography =

	Nano Imprint Lithography, similar to Hot Embossing, is a parallel transfer of a pattern made by a serial technique (often e-beam). First a stamp is made, usually in Si or SiO<math>\rm{_2}</math> however other materials could also be used. The pattern on the stamp is then transferred to a polymer (on a different substrate), by heating both stamp and substrate to above the glass transition temperature T<math>_g</math> of the polymer and then pressing the stamp and the substrate together, hence deforming the polymer on the substrate. The stamp and substrate are then cooled down and only separated when the temperature is well below T<math>_g</math> of the polymer. Normally the stack is often cooled to room temperature to easily separate the two parts.		Nano Imprint Lithography, similar to Hot Embossing, is a parallel transfer of a pattern made by a serial technique (often e-beam). First a stamp is made, usually in Si or SiO<math>\rm{_2}</math> however other materials could also be used. The pattern on the stamp is then transferred to a polymer (on a different substrate), by heating both stamp and substrate to above the glass transition temperature T<math>_g</math> of the polymer and then pressing the stamp and the substrate together, hence deforming the polymer on the substrate. The stamp and substrate are then cooled down and only separated when the temperature is well below T<math>_g</math> of the polymer. Normally the stack is often cooled to room temperature to easily separate the two parts.
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	It is necessary to deposit anti stiction coating on the stamp to ensure that it can be separated from the substrate, this is done in either the MVD or the ASE. If the stamp it not anti stiction coated it is likely that either (or both) the stamp and substrate will break during separation. It is only necessary to deposit anti stiction coating on the stamp one time even though it is used a multiple of times.		It is necessary to deposit anti stiction coating on the stamp to ensure that it can be separated from the substrate, this is done in either the MVD or the ASE. If the stamp it not anti stiction coated it is likely that either (or both) the stamp and substrate will break during separation. It is only necessary to deposit anti stiction coating on the stamp one time even though it is used a multiple of times.

	= Stamp for imprint =		== Stamp for imprint ==

	A stamp for imprint lithography is usually made in Si or SiO, however other materials could also be used.		A stamp for imprint lithography is usually made in Si or SiO, however other materials could also be used.
	Here is a process flow for stamp made of SU8 resist.[[~~media~~:~~Stamp_Fabrication~~.~~docx‎~~ \| Stamp fabrication flow.]]		Here is a process flow for stamp made of SU8 resist.[[index.php?title=Media:Stamp Fabrication.docx\| Stamp fabrication flow.]]

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	==Imprinting ~~parameters~~==		==Imprinting Parameters==

	When you do an imprint you may consider 3 most important parameters: pressure, temperature and imprinting time. All those parameters are depending of printable resists molecular weight and its glas transition temperature.		When you do an imprint you may consider 3 most important parameters: pressure, temperature and imprinting time. All those parameters are depending of printable resists molecular weight and its glas transition temperature.

	== Choose an ~~equipment~~ ==		== Choose an Equipment ==
	*[[Specific Process Knowledge/Thin_film_deposition/MVD\|MVD]] - ''Molecular Vapor Deposition - Antistiction coater for silicon stamps''		*[[Specific Process Knowledge/Thin_film_deposition/MVD\|MVD]] - ''Molecular Vapor Deposition - Antistiction coater for silicon stamps''
	*[[Specific Process Knowledge/Characterization/Drop Shape Analyzer\|Drop Shape Analyzer]] - ''Tool to measure the hydrophobicity of the antistiction layer''		*[[Specific Process Knowledge/Characterization/Drop Shape Analyzer\|Drop Shape Analyzer]] - ''Tool to measure the hydrophobicity of the antistiction layer''
	*[[Specific_Process_Knowledge/Lithography/NanoImprintLithography#EVG_NIL\|Imprinter 01]] - ''Tool to imprint''		*[[Specific_Process_Knowledge/Lithography/NanoImprintLithography#EVG_NIL\|Imprinter 01]] - ''Tool to imprint''

Mmat: /* Imprint resist */

2025-05-27T10:08:31Z

Imprint resist

← Older revision		Revision as of 12:08, 27 May 2025
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	Here is a process flow for stamp made of SU8 resist.[[media:Stamp_Fabrication.docx‎ \| Stamp fabrication flow.]]		Here is a process flow for stamp made of SU8 resist.[[media:Stamp_Fabrication.docx‎ \| Stamp fabrication flow.]]

			<!--
	= Imprint resist =		= Imprint resist =
	{{:Specific Process Knowledge/Lithography/Resist/NILresist}}		{{:Specific Process Knowledge/Lithography/Resist/NILresist
			!-->

	==Imprinting parameters==		==Imprinting parameters==

Mmat: /* Imprinting */

2025-05-27T10:07:01Z

Imprinting

← Older revision		Revision as of 12:07, 27 May 2025
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	= Imprinting =		= Imprinting =

	~~Imprinting (hot embossing)~~ is a parallel transfer of a pattern made by a serial technique (often e-beam). First a stamp is made, usually in Si or SiO<math>\rm{_2}</math> however other materials could also be used. The pattern on the stamp is then transferred to a polymer (on a different substrate), by heating both stamp and substrate to above the glass transition temperature T<math>_g</math> of the polymer and then pressing the stamp and the substrate together, hence deforming the polymer on the substrate. The stamp and substrate are then cooled down and only separated when the temperature is well below T<math>_g</math> of the polymer. Normally the stack is often cooled to room temperature to easily separate the two parts.		Nano Imprint Lithography, similar to Hot Embossing, is a parallel transfer of a pattern made by a serial technique (often e-beam). First a stamp is made, usually in Si or SiO<math>\rm{_2}</math> however other materials could also be used. The pattern on the stamp is then transferred to a polymer (on a different substrate), by heating both stamp and substrate to above the glass transition temperature T<math>_g</math> of the polymer and then pressing the stamp and the substrate together, hence deforming the polymer on the substrate. The stamp and substrate are then cooled down and only separated when the temperature is well below T<math>_g</math> of the polymer. Normally the stack is often cooled to room temperature to easily separate the two parts.

	[[File:Imprint schematic new.png\|thumb\|Illustration of the hot embossing process.]]		[[File:Imprint schematic new.png\|thumb\|Illustration of the hot embossing process.]]

Jehem at 12:44, 10 May 2023

2023-05-10T12:44:38Z

← Older revision		Revision as of 14:44, 10 May 2023
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	{{~~:Specific Process Knowledge/Lithography/authors_generic~~}}		{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Imprinting click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Imprinting click here]'''

Jehem at 09:18, 31 January 2023

2023-01-31T09:18:29Z

← Older revision		Revision as of 11:18, 31 January 2023
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	'''Feedback to this page''': '''[mailto:~~photolith~~@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Imprinting click here]'''		{{:Specific Process Knowledge/Lithography/authors_generic}}

			'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Imprinting click here]'''

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	= Imprinting =		= Imprinting =