Specific Process Knowledge/Etch/Wet Gold Etch - Revision history

Mbec: et komma

2025-07-28T13:19:05Z

et komma

← Older revision		Revision as of 15:19, 28 July 2025
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	'''Feedback to this page''': '''[mailto:wetchemistry@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Gold_Etch click here]'''		'''Feedback to this page''': '''[mailto:wetchemistry@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Gold_Etch click here]'''

	'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''		'''Unless anything else is stated, everything on this page text and pictures are made by DTU Nanolab.'''

	'''All links to Kemibrug (SDS) and Labmanager Including APV requires login.'''		'''All links to Kemibrug (SDS) and Labmanager Including APV requires login.'''
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	'''All measurements on this page has been made by Nanolab staff.'''		'''All measurements on this page has been made by Nanolab staff.'''

	[[Category: Equipment\|Etch Wet Gold]]		[[index.php?title=Category:Equipment\|Etch Wet Gold]]
	[[Category: Etch (Wet) bath\|Gold]]		[[index.php?title=Category:Etch (Wet) bath\|Gold]]

	Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE]] by sputtering with Ar ions.		Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE]] by sputtering with Ar ions.

Hvje at 13:22, 31 January 2023

2023-01-31T13:22:25Z

← Older revision		Revision as of 15:22, 31 January 2023
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	'''Feedback to this page''': '''[mailto:wetchemistry@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Gold_Etch click here]'''		'''Feedback to this page''': '''[mailto:wetchemistry@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Gold_Etch click here]'''

			'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''

			'''All links to Kemibrug (SDS) and Labmanager Including APV requires login.'''

			'''All measurements on this page has been made by Nanolab staff.'''

	[[Category: Equipment\|Etch Wet Gold]]		[[Category: Equipment\|Etch Wet Gold]]

Mbec: /* Etching of Gold */

2022-08-05T12:55:36Z

Etching of Gold

← Older revision		Revision as of 14:55, 5 August 2022
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	# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at DTU Nanolab. Can be used with AZ resist as mask.		# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at DTU Nanolab. Can be used with AZ resist as mask.
	# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and is therefore used when you wish to remove all the gold from your wafer. '''You must be very careful when working with Aqua Regia (Kongevand). It can generate nitrogen oxide gases which are very toxic!!'''		# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and is therefore used when you wish to remove all the gold from your wafer. '''You must be very careful when working with Aqua Regia (Kongevand). It can generate nitrogen oxide gases which are very toxic!'''

Jmli: /* Etching of Gold */

2019-11-25T16:55:09Z

Etching of Gold

← Older revision		Revision as of 18:55, 25 November 2019
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	We have two different solutions:		We have two different solutions:

	# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at ~~Danchip~~. Can be used with AZ resist as mask.		# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at DTU Nanolab. Can be used with AZ resist as mask.
	# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and is therefore used when you wish to remove all the gold from your wafer. '''You must be very careful when working with Aqua Regia (Kongevand). It can generate nitrogen oxide gases which are very toxic!!'''		# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and is therefore used when you wish to remove all the gold from your wafer. '''You must be very careful when working with Aqua Regia (Kongevand). It can generate nitrogen oxide gases which are very toxic!!'''

Jmli at 16:17, 25 November 2019

2019-11-25T16:17:20Z

← Older revision		Revision as of 18:17, 25 November 2019
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	'''Feedback to this page''': '''[mailto:wetchemistry@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.~~danchip~~.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Gold_Etch click here]'''		'''Feedback to this page''': '''[mailto:wetchemistry@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Gold_Etch click here]'''

	[[Category: Equipment\|Etch Wet Gold]]		[[Category: Equipment\|Etch Wet Gold]]

Choi: /* Comparing the two solutions */

2018-01-23T14:05:48Z

Comparing the two solutions

← Older revision		Revision as of 16:05, 23 January 2018
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	!		!
	! Iodine based gold etch		! Iodine based gold etch
	! Aqua Regia (~~Kongevand~~)		! Aqua Regia (kongevand)
			! Dilute Aqua Regia (fortyndet kongevand)
	\|-		\|-

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	!General description		!General description
	\|		\|
	Etch of ~~pure Gold~~ with or without photoresist mask.		Etch of gold with or without photoresist mask.
	\|		\|
	Etch of ~~pure Gold~~ (as stripper).		Etch of gold (as stripper).
			\|
			Etch of gold.
	\|-		\|-

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	!Link to safety APV		!Link to safety APV
	\|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here].		\|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here].
			\|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here]
	\|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here]		\|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here]
	\|-		\|-
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	\|KI:I<sub>2</sub>:H<sub>2</sub>O (100g:25g:500ml)		\|KI:I<sub>2</sub>:H<sub>2</sub>O (100g:25g:500ml)
	\|HCl:HNO<sub>3</sub> (3:1)		\|HCl:HNO<sub>3</sub> (3:1)
			\|HCl:HNO<sub>3</sub>:H<sub>2</sub>O (3:1:2)
	\|-		\|-

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	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	!Process temperature		!Process temperature
	\|~~20 <sup>o</sup>C~~		\|20°C

	\|~~20 <sup>o</sup>C~~		\|20°C

			\|20-30°C
	\|-		\|-

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	\|		\|
	Unmasked - used as a stripper		Unmasked - used as a stripper
			\|
			Difficult to mask. Mainly used as a stripper.
	\|-		\|-

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	\|		\|
	~(??) nm/min - fast etch		~(??) nm/min - fast etch
			\|
			~680 nm/min at 30°C
	\|-		\|-

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	!Batch size		!Batch size
	\|		\|
	1-5 4" wafers at a time		1-5 4" wafers at a time
	\|		\|
	1-5 4" ~~wafer~~ at a time		1-5 4" wafers at a time
			\|
			1-5 4" wafers at a time
	\|-		\|-

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	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	!Size of substrate		!Size of substrate
			\|Any size and number that can go inside the beaker in use
	\|Any size and number that can go inside the beaker in use		\|Any size and number that can go inside the beaker in use
	\|Any size and number that can go inside the beaker in use		\|Any size and number that can go inside the beaker in use
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	\|		\|
	No restrictions when used in beaker.		No restrictions when used in beaker.
			Make a note on the beaker of which materials have been processed.
			\|
			No restrictions when used in beaker.
	Make a note on the beaker of which materials have been processed.		Make a note on the beaker of which materials have been processed.
	\|-		\|-
	\|}		\|}

Choi: /* Etching of Gold */

2018-01-23T13:55:35Z

Etching of Gold

← Older revision		Revision as of 15:55, 23 January 2018
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	# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask.		# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask.
	# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and ~~are~~ therefore used when you wish to remove all the gold from your wafer. '''You must be very careful when working with Aqua Regia (Kongevand). It can generate ~~nitrous~~ oxide gases which are very toxic!!'''		# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and is therefore used when you wish to remove all the gold from your wafer. '''You must be very careful when working with Aqua Regia (Kongevand). It can generate nitrogen oxide gases which are very toxic!!'''

Choi: /* Etching of Gold */

2017-02-27T10:43:47Z

Etching of Gold

← Older revision		Revision as of 12:43, 27 February 2017
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	==Etching of Gold==		==Etching of Gold==
	[[Image:~~Stinkskab RR2~~.jpg \|300x300px\|thumb\|Wet Gold Etch can be done in ~~Fumehood(RCA) in cleanroom B-1 or~~ Fumehood 1 or 2 in cleanroom D-3]]		[[Image:Fumehood1-2.jpg \|300x300px\|thumb\|Wet Gold Etch can be done in Fumehood 1 or 2 in cleanroom D-3]]
	Wet etching of gold is done making your own set up using a beaker in a fumehood. You can see the APV [http://labmanager~~.danchip~~.dtu.dk/d4Show.php?id=~~2479~~&mach=~~146~~ here].		Wet etching of gold is done making your own set up using a beaker in a fumehood. You can see the APV [http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 here].

	We have two different solutions:		We have two different solutions:
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	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	!Link to safety APV		!Link to safety APV
	\|[http://labmanager~~.danchip~~.dtu.dk/d4Show.php?id=~~2479~~&mach=~~146 see~~ APV here].		\|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here].
	\|[http://labmanager~~.danchip~~.dtu.dk/d4Show.php?id=~~2479~~&mach=~~146 see~~ APV here]		\|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here]
	\|-		\|-

Choi: /* Etching of Gold */

2017-02-27T08:59:15Z

Etching of Gold

← Older revision		Revision as of 10:59, 27 February 2017
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	==Etching of Gold==		==Etching of Gold==
	[[Image:Stinkskab RR2.jpg \|300x300px\|thumb\|Wet Gold Etch can be done in ~~the fumehood positioned~~ in cleanroom B-1]]		[[Image:Stinkskab RR2.jpg \|300x300px\|thumb\|Wet Gold Etch can be done in Fumehood(RCA) in cleanroom B-1 or Fumehood 1 or 2 in cleanroom D-3]]
	~~Etching~~ of ~~Gold~~ is done ~~wet at Danchip~~ making your own set up in a beaker in ~~the~~ fumehood. You can see the APV [http://labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 here].		Wet etching of gold is done making your own set up using a beaker in a fumehood. You can see the APV [http://labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 here].

	We have two different solutions:		We have two different solutions:

	# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask.		# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask.
	# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and are therefore used when you wish to remove all the gold from your wafer. '''~~you have to~~ be very ~~carefull~~ when ~~you work~~ with Aqua Regia (Kongevand) It can generate nitrous gases ~~witch~~ are very toxic!!'''		# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and are therefore used when you wish to remove all the gold from your wafer. '''You must be very careful when working with Aqua Regia (Kongevand). It can generate nitrous oxide gases which are very toxic!!'''

Bghe at 13:49, 25 August 2014

2014-08-25T13:49:48Z

← Older revision		Revision as of 15:49, 25 August 2014
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	'''Feedback to this page''': '''[mailto:wetchemistry@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Gold_Etch click here]'''		'''Feedback to this page''': '''[mailto:wetchemistry@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Gold_Etch click here]'''

			[[Category: Equipment\|Etch Wet Gold]]
			[[Category: Etch (Wet) bath\|Gold]]

	Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE]] by sputtering with Ar ions.		Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE]] by sputtering with Ar ions.