Specific Process Knowledge/Etch/Titanium Oxide - Revision history

Bghe: /* Comparison of Titanium Oxide (ALD) etch Methods 70px */

2025-09-04T13:23:54Z

Comparison of Titanium Oxide (ALD) etch Methods 70px

← Older revision		Revision as of 15:23, 4 September 2025
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	==Comparison of Titanium Oxide (ALD) etch Methods ~~[[Image:section under construction.jpg\|70px]]~~==		==Comparison of Titanium Oxide (ALD) etch Methods ==

	{\|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"		{\|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"

2025-09-04T13:23:25Z

Comparison of Titanium Oxide (ALD) etch Methods

← Older revision		Revision as of 15:23, 4 September 2025
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	\|2,5 nm/min		\|2,5 nm/min
	\|		\|
	*~~~30nm~~/min ~~(pure Al)~~		*It has not been explored
			*current recipe ~8 nm/min
	\|-		\|-

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	*Isotropic		*Isotropic
	\|		\|
	*~~Isotropic~~		*Anisotropic
	\|-		\|-

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	*Any size (in beaker)		*Any size (in beaker)
	\|		\|
	*~~Chips (6-60 mm)~~		*Samples < 150 mm wafers on carrier
	*100 mm wafers		*one 150 mm wafer at a time
	*150 mm ~~wafers~~
	\|-		\|-

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	*Any material		*Any material
	\|		\|
	*~~Every thing that is allowed in the Developer: TMAH Manual~~		*silicon, silicon oxides and nitrides
			*Al, Cr, Ti (incl. oxides and nitrides)
			*Ta, W, Nb (incl. oxides and nitrides)
	\|-		\|-
	\|}		\|}

2025-09-04T13:19:03Z

Comparison of Titanium Oxide (ALD) etch Methods

2025-05-27T07:37:31Z

Etch of Titanium oxide has been test in the ICP metal etcher.

← Older revision		Revision as of 09:37, 27 May 2025
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	*[[/ICP metal\|Titanium Oxide etch using ICP metal]]		*[[/ICP metal\|Titanium Oxide etch using ICP metal]]
			*Titanium Oxide etch using BHF

2025-05-27T07:32:14Z

Comparison of Titanium Oxide (ALD) etch Methods

@@ Line 19: / Line 19: @@
 !BHF
 !ICP Metal Etcher
 |-
@@ Line 28: / Line 26: @@
 |Wet etch of TiO2 (ALD)
+|
 |-
@@ Line 38: / Line 34: @@
+|
 *~30nm/min (pure Al)
 |-
@@ Line 51: / Line 43: @@
+|
 *Isotropic
 |-
@@ Line 68: / Line 56: @@
 *100 mm wafers
 *150 mm wafers
 |-
@@ Line 87: / Line 65: @@
+|
 *Every thing that is allowed in the Developer: TMAH Manual
 |-
 |}

2025-05-27T07:30:33Z

Comparison of Titanium Oxide (ALD) etch Methods

← Older revision		Revision as of 09:30, 27 May 2025
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	!'''Allowed materials'''		!'''Allowed materials'''
	\|~~In 'Aluminium Etch' bath:~~		\|In beaker:
	*See Cross Contamination Sheet for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=381 Aluminium Etch] bath (require login)
	In beaker:
	*Any material		*Any material
	\|		\|

2025-05-27T07:29:39Z

Comparison of Titanium Oxide (ALD) etch Methods

2025-05-13T12:19:31Z

Comparison of Aluminium Etch Methods

← Older revision		Revision as of 14:19, 13 May 2025
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	==Comparison of ~~Aluminium Etch~~ Methods [[Image:section under construction.jpg\|70px]]==		==Comparison of Titanium Oxide (ALD) etch Methods [[Image:section under construction.jpg\|70px]]==

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2025-05-13T12:18:33Z

Comparison of Aluminium Etch Methods

← Older revision		Revision as of 14:18, 13 May 2025
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	!Generel description		!Generel description
	\|Wet etch of Al		\|Wet etch of TiO2 (ALD)
	\|~~Wet etch/removal: TMAH<br>~~		\|
	~~Mainly used for removing Al on e-beam resist after e-beam exposure, see process flow [[Specific_Process_Knowledge/Lithography/EBeamLithography#Aluminum_coating\| here]]~~
	\|Dry plasma etch of Al		\|Dry plasma etch of Al
	\|Sputtering of Al - pure physical etch.		\|Sputtering of Al - pure physical etch.
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	\|-style="background:LightGrey; color:black"		\|-style="background:LightGrey; color:black"
	!Etch rate range		!Etch rate range
	\|		\|2,5 nm/min
	*~60-100nm/min
	\|		\|
	*~30nm/min (pure Al)		*~30nm/min (pure Al)

2025-05-13T12:16:21Z

Comparison of Aluminium Etch Methods

← Older revision		Revision as of 14:16, 13 May 2025
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	\|-style="background:silver; color:black"		\|-style="background:silver; color:black"
	!		!
	!~~[[Specific Process Knowledge/Etch/Wet Aluminium Etch\|Aluminium Etch]]~~		!BHF
	!~~[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual\|Developer TMAH manual]]~~		!ICP Metal Etcher
	!~~[[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher\|ICP metal]]~~		!
	!~~[[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE (Ionfab300+)]]~~		!
	\|-		\|-