Specific Process Knowledge/Etch/RIE (Reactive Ion Etch) - Revision history

Thes at 10:56, 31 July 2026

2026-07-31T10:56:51Z

← Older revision		Revision as of 12:56, 31 July 2026
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	[[image:Cluster1a.jpg\|200x200px\|right\|thumb\|RIE1 (part of cluster1) - positioned in cleanroom2]]		[[image:Cluster1a.jpg\|200x200px\|right\|thumb\|RIE1 (part of cluster1) - positioned in cleanroom2]]
	[[image:Cluster2x.jpg\|200x200px\|right\|thumb\|RIE2 (part of cluster2)- positioned in cleanroom3]]		[[image:Cluster2x.jpg\|200x200px\|right\|thumb\|RIE2 (part of cluster2)- positioned in cleanroom3]]
	We have three RIE's. Two (RIE1 and RIE2) for etching silicon based materials (silicon, silicon oxide, silicon nitride) and one (III-V RIE) for etching III-V materials. The hardware of RIE1 and RIE2 is very similar but you cannot count on that identical recipes on RIE1 and RIE2 perform exactly the same. In addition to that the main difference between RIE1 and RIE2 is the cleanness of the two equipment. In rough terms RIE1 is the clean system and the RIE2 is the dirty system. This means that in RIE2 opposed to RIE1 it is allowed to have small amounts of metals exposed to the plasma. Look in the manuals for RIE1 and RIE2 to read the details for this difference (you can find the manuals in LabManager [~~http~~://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=18 RIE1], [~~http~~://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=19 RIE2]).		We have three RIE's. Two (RIE1 and RIE2) for etching silicon based materials (silicon, silicon oxide, silicon nitride) and one (III-V RIE) for etching III-V materials. The hardware of RIE1 and RIE2 is very similar but you cannot count on that identical recipes on RIE1 and RIE2 perform exactly the same. In addition to that the main difference between RIE1 and RIE2 is the cleanness of the two equipment. In rough terms RIE1 is the clean system and the RIE2 is the dirty system. This means that in RIE2 opposed to RIE1 it is allowed to have small amounts of metals exposed to the plasma. Look in the manuals for RIE1 and RIE2 to read the details for this difference (you can find the manuals in LabManager [https://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=18 RIE1], [https://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=19 RIE2]).

	== Process information ==		== Process information ==

Thes at 10:56, 31 July 2026

2026-07-31T10:56:04Z

← Older revision		Revision as of 12:56, 31 July 2026
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	<!-- remember to remove the type of documents that are not present -->		<!-- remember to remove the type of documents that are not present -->

	[~~http~~://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=19 RIE2 info page in LabManager]		[https://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=19 RIE2 info page in LabManager]

	== Process information ==		== Process information ==

Mmat: /* Process information */

2025-06-20T14:24:47Z

Process information

← Older revision		Revision as of 16:24, 20 June 2025
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	*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2\|Etch of silicon oxide using RIE]]		*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2\|Etch of silicon oxide using RIE]]
	*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE\|Etch of silicon nitride using RIE]]		*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE\|Etch of silicon nitride using RIE]]
	*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE\|Etch of photo resist using RIE]]
	<br clear="all" />		<br clear="all" />

Mmat at 14:23, 20 June 2025

2025-06-20T14:23:46Z

← Older revision		Revision as of 16:23, 20 June 2025
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	[[Category: Equipment \|Etch RIE]]		[[Category: Equipment \|Etch RIE]]
	[[Category: Etch (Dry) Equipment \|RIE]]		[[Category: Etch (Dry) Equipment \|RIE]]


	<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned. </span>		<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned. </span>

Mmat at 14:23, 20 June 2025

2025-06-20T14:23:38Z

← Older revision		Revision as of 16:23, 20 June 2025
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	~~{{cc-nanolab}}~~
	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''<br>
	[[Category: Equipment \|Etch RIE]]		[[Category: Equipment \|Etch RIE]]
	[[Category: Etch (Dry) Equipment \|RIE]]		[[Category: Etch (Dry) Equipment \|RIE]]

Mmat at 14:23, 16 June 2025

2025-06-16T14:23:52Z

← Older revision		Revision as of 16:23, 16 June 2025
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	=<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> =		<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned. </span>
			<br><br>
	<span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems.		<span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems.
	== Etching using the dry etch technique RIE (Reactive Ion Etch) ==		== Etching using the dry etch technique RIE (Reactive Ion Etch) ==

Mmat at 14:23, 16 June 2025

2025-06-16T14:23:15Z

← Older revision		Revision as of 16:23, 16 June 2025
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			{{cc-nanolab}}
	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''<br>		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''<br>
	[[Category: Equipment \|Etch RIE]]		[[Category: Equipment \|Etch RIE]]
	[[Category: Etch (Dry) Equipment \|RIE]]		[[Category: Etch (Dry) Equipment \|RIE]]
	~~{{CC1}}~~

	=<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> =		=<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> =
	* <span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems.		<span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems.
	== Etching using the dry etch technique RIE (Reactive Ion Etch) ==		== Etching using the dry etch technique RIE (Reactive Ion Etch) ==
	<!--		<!--

Bghe at 09:43, 24 March 2023

2023-03-24T09:43:18Z

← Older revision		Revision as of 11:43, 24 March 2023
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	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''<br>
	[[Category: Equipment \|Etch RIE]]		[[Category: Equipment \|Etch RIE]]
	[[Category: Etch (Dry) Equipment \|RIE]]		[[Category: Etch (Dry) Equipment \|RIE]]

Bghe at 09:43, 24 March 2023

2023-03-24T09:43:06Z

← Older revision		Revision as of 11:43, 24 March 2023
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	[[Category: Equipment \|Etch RIE]]		[[Category: Equipment \|Etch RIE]]
	[[Category: Etch (Dry) Equipment \|RIE]]		[[Category: Etch (Dry) Equipment \|RIE]]
			{{CC1}}
	=<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> =		=<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> =
	* <span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems.		* <span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems.

Bghe: /* Equipment performance and process related parameters - HAS BEEN DECOMMISSIONED */

2023-03-24T09:42:00Z

Equipment performance and process related parameters - HAS BEEN DECOMMISSIONED

← Older revision		Revision as of 11:42, 24 March 2023
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	<br clear="all" />		<br clear="all" />

	==Equipment performance and process related parameters ~~- HAS BEEN DECOMMISSIONED~~==		==Equipment performance and process related parameters ==

	{\| border="2" cellspacing="0" cellpadding="2"		{\| border="2" cellspacing="0" cellpadding="2"
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	!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment		!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment
	\|style="background:WhiteSmoke; color:black"\|<b>RIE1 - '''HAS BEEN DECOMMISSIONED'''</b>		\|style="background:WhiteSmoke; color:black"\|<b>RIE1 - '''HAS BEEN DECOMMISSIONED'''</b>
	\|style="background:WhiteSmoke; color:black"\|<b>RIE2</b>		\|style="background:WhiteSmoke; color:black"\|<b>RIE2 - '''HAS BEEN DECOMMISSIONED'''</b>
	\|-		\|-
	!style="background:silver; color:black;" align="center" width="60"\|Purpose		!style="background:silver; color:black;" align="center" width="60"\|Purpose