Specific Process Knowledge/Etch/RIE (Reactive Ion Etch) - Revision history

Mmat: /* Process information */

2025-06-20T14:24:47Z

Process information

← Older revision		Revision as of 16:24, 20 June 2025
Line 24:		Line 24:
	*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2\|Etch of silicon oxide using RIE]]		*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2\|Etch of silicon oxide using RIE]]
	*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE\|Etch of silicon nitride using RIE]]		*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE\|Etch of silicon nitride using RIE]]
	*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE\|Etch of photo resist using RIE]]
	<br clear="all" />		<br clear="all" />

2025-06-20T14:23:46Z

← Older revision		Revision as of 16:23, 20 June 2025
Line 1:		Line 1:
	[[Category: Equipment \|Etch RIE]]		[[Category: Equipment \|Etch RIE]]
	[[Category: Etch (Dry) Equipment \|RIE]]		[[Category: Etch (Dry) Equipment \|RIE]]


	<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned. </span>		<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned. </span>

2025-06-20T14:23:38Z

← Older revision		Revision as of 16:23, 20 June 2025
Line 1:		Line 1:
	~~{{cc-nanolab}}~~
	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''<br>
	[[Category: Equipment \|Etch RIE]]		[[Category: Equipment \|Etch RIE]]
	[[Category: Etch (Dry) Equipment \|RIE]]		[[Category: Etch (Dry) Equipment \|RIE]]

2025-06-16T14:23:52Z

← Older revision		Revision as of 16:23, 16 June 2025
Line 5:		Line 5:


	=<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> =		<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned. </span>
			<br><br>
	<span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems.		<span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems.
	== Etching using the dry etch technique RIE (Reactive Ion Etch) ==		== Etching using the dry etch technique RIE (Reactive Ion Etch) ==

2025-06-16T14:23:15Z

← Older revision		Revision as of 16:23, 16 June 2025
Line 1:		Line 1:
			{{cc-nanolab}}
	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''<br>		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''<br>
	[[Category: Equipment \|Etch RIE]]		[[Category: Equipment \|Etch RIE]]
	[[Category: Etch (Dry) Equipment \|RIE]]		[[Category: Etch (Dry) Equipment \|RIE]]
	~~{{CC1}}~~

	=<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> =		=<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> =
	* <span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems.		<span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems.
	== Etching using the dry etch technique RIE (Reactive Ion Etch) ==		== Etching using the dry etch technique RIE (Reactive Ion Etch) ==
	<!--		<!--

2023-03-24T09:43:18Z

← Older revision		Revision as of 11:43, 24 March 2023
Line 1:		Line 1:
	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''<br>
	[[Category: Equipment \|Etch RIE]]		[[Category: Equipment \|Etch RIE]]
	[[Category: Etch (Dry) Equipment \|RIE]]		[[Category: Etch (Dry) Equipment \|RIE]]

2023-03-24T09:43:06Z

← Older revision		Revision as of 11:43, 24 March 2023
Line 2:		Line 2:
	[[Category: Equipment \|Etch RIE]]		[[Category: Equipment \|Etch RIE]]
	[[Category: Etch (Dry) Equipment \|RIE]]		[[Category: Etch (Dry) Equipment \|RIE]]
			{{CC1}}
	=<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> =		=<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> =
	* <span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems.		* <span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems.

2023-03-24T09:42:00Z

Equipment performance and process related parameters - HAS BEEN DECOMMISSIONED

← Older revision		Revision as of 11:42, 24 March 2023
Line 27:		Line 27:
	<br clear="all" />		<br clear="all" />

	==Equipment performance and process related parameters ~~- HAS BEEN DECOMMISSIONED~~==		==Equipment performance and process related parameters ==

	{\| border="2" cellspacing="0" cellpadding="2"		{\| border="2" cellspacing="0" cellpadding="2"
Line 33:		Line 33:
	!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment		!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment
	\|style="background:WhiteSmoke; color:black"\|<b>RIE1 - '''HAS BEEN DECOMMISSIONED'''</b>		\|style="background:WhiteSmoke; color:black"\|<b>RIE1 - '''HAS BEEN DECOMMISSIONED'''</b>
	\|style="background:WhiteSmoke; color:black"\|<b>RIE2</b>		\|style="background:WhiteSmoke; color:black"\|<b>RIE2 - '''HAS BEEN DECOMMISSIONED'''</b>
	\|-		\|-
	!style="background:silver; color:black;" align="center" width="60"\|Purpose		!style="background:silver; color:black;" align="center" width="60"\|Purpose

2023-03-24T09:41:09Z

Equipment performance and process related parameters

← Older revision		Revision as of 11:41, 24 March 2023
Line 27:		Line 27:
	<br clear="all" />		<br clear="all" />

	==Equipment performance and process related parameters==		==Equipment performance and process related parameters - HAS BEEN DECOMMISSIONED==

	{\| border="2" cellspacing="0" cellpadding="2"		{\| border="2" cellspacing="0" cellpadding="2"

2022-09-06T11:05:34Z

Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned

← Older revision		Revision as of 13:05, 6 September 2022
Line 4:		Line 4:

	=<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> =		=<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> =
			* <span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems.
	== Etching using the dry etch technique RIE (Reactive Ion Etch) ==		== Etching using the dry etch technique RIE (Reactive Ion Etch) ==
	<!--		<!--