Specific Process Knowledge/Etch/Lithium niobate - Revision history

Bghe at 13:03, 28 March 2025

2025-03-28T13:03:01Z

← Older revision		Revision as of 15:03, 28 March 2025
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	'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''		'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''

	'''Feedback to this page''': '''[mailto:labadviser@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.~~danchip~~.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Lithium_niobate click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Lithium_niobate click here]'''

Bghe at 13:01, 28 March 2025

2025-03-28T13:01:54Z

← Older revision		Revision as of 15:01, 28 March 2025
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	~~=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png\|200px]]=~~

	'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''		'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''

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	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Lithium_niobate click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Lithium_niobate click here]'''
	~~<!--Page reviewed by jmli 1/8-2016 -->~~

	==Etching of Lithium Niobate==		==Etching of Lithium Niobate==
	*Etching af Lithium niobate is new to DTU Nanolab. There are some users doing it on the IBE and the ASE. We do not have any results we can show.		*Etching af Lithium niobate is new to DTU Nanolab. There are some users doing it on the IBE and the ASE. We do not have any results we can show.

Bghe: /* Etching of Titanium */

2025-03-28T13:00:47Z

Etching of Titanium

← Older revision		Revision as of 15:00, 28 March 2025
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	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Lithium_niobate click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Lithium_niobate click here]'''
	<!--Page reviewed by jmli 1/8-2016 -->		<!--Page reviewed by jmli 1/8-2016 -->
	==Etching of ~~Titanium~~==		==Etching of Lithium Niobate==
	*Etching af Lithium niobate is new to DTU Nanolab. There are some users doing it on the IBE and the ASE. We do not have any results we can show.		*Etching af Lithium niobate is new to DTU Nanolab. There are some users doing it on the IBE and the ASE. We do not have any results we can show.
	<br clear="all" />		<br clear="all" />

Bghe: /* Etching of Titanium */

2025-03-28T13:00:31Z

Etching of Titanium

← Older revision		Revision as of 15:00, 28 March 2025
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	<!--Page reviewed by jmli 1/8-2016 -->		<!--Page reviewed by jmli 1/8-2016 -->
	==Etching of Titanium==		==Etching of Titanium==
			*Etching af Lithium niobate is new to DTU Nanolab. There are some users doing it on the IBE and the ASE. We do not have any results we can show.
	Etching ~~of titanium~~ can ~~be done either by wet etch, dry etch or by sputtering with ions~~.
	*[[Specific Process Knowledge/Etch/Wet Titanium Etch\|Etching of Ti by wet etch]]
	*[[Specific Process Knowledge/Etch/ICP Metal Etcher/Titanium\|Etching of Ti by dry etch]]
	*[[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300/IBE Ti etch\|Sputtering of Ti]]
	<br clear="all" />		<br clear="all" />

	==Comparison of ~~Titanium~~ Etch ~~Methodes~~==		==Comparison of Lithium niobate Etch Methods==

	{\|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"		{\|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"

Bghe: /* Comparison of Titanium Etch Methodes */

2025-03-28T12:56:27Z

Comparison of Titanium Etch Methodes

← Older revision		Revision as of 14:56, 28 March 2025
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	\|		\|
	\|Sputtering of Lithium niobate - pure physical etch		\|Sputtering of Lithium niobate - pure physical etch
	\|~~Dry plasma~~ etch ~~of Ti~~		This is the dryetcher we prefer you use for Lithium niobate etching as lithium does not form any volatile etch products. You can assist it with CHF3 if you want that.
			\|This is an ICP and is for etching materials that forms volatile etch products with fluorine chemistry. We have allowed some lithium niobate etching to be done in this machine but we are not super happy with that since there will be redeposition inside the chamber. Please talk to us about it if you can to do it.
	\|		\|
	\|-		\|-
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	**~20nm/min		**~20nm/min
	\|		\|
	*~~~50-200 nm/min (depending~~ on features size and etch load and recipe settings)		*Depending on features size and etch load and recipe settings. We have not recipe for this - you are on your own.
	\|		\|
	\|-		\|-
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	**Anisotropic (angles sidewalls, typical around 70 dg)		**Anisotropic (angles sidewalls, typical around 70 dg)
	\|		\|
	*Anisotropic ~~(vertical~~ sidewalls)		*Anisotropic - expect angles sidewalls.
	\|		\|

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	\|		\|
	*smaller pieces on a carrier wafer		*smaller pieces on a carrier wafer
	*<nowiki>#</nowiki>1 ~~100mm wafers (if you place it/bond it on a 150~~ mm ~~carrier~~ wafer)		*<nowiki>#</nowiki>1 100 mm wafer
	*<nowiki>#</nowiki>1 150mm wafers
	\|		\|

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	*Silicon oxide		*Silicon oxide
	*Silicon (oxy)nitride		*Silicon (oxy)nitride
	*~~Aluminium~~		*Less than 4 cm2 of many other materials, check out the cross contamination sheet in LabManager
	*Titanium
	*Chromium
	\|		\|

Bghe: /* Comparison of Titanium Etch Methodes */

2025-03-28T12:48:49Z

Comparison of Titanium Etch Methodes

← Older revision		Revision as of 14:48, 28 March 2025
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	!		!
	![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE (Ionfab300+)]]		![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE (Ionfab300+)]]
	!		![[Specific_Process_Knowledge/Etch/ASE_(Advanced_Silicon_Etch)\|ASE]]
	!		!
	\|-		\|-

Bghe: /* Comparison of Titanium Etch Methodes */

2025-03-28T12:29:30Z

Comparison of Titanium Etch Methodes

← Older revision		Revision as of 14:29, 28 March 2025
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	!		!
	![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE (Ionfab300+)]]		![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE (Ionfab300+)]]
	!~~[[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher\|ICP metal]]~~		!
	!		!
	\|-		\|-
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	!Generel description		!Generel description
	\|		\|
	\|Sputtering of Ti - pure physical etch		\|Sputtering of Lithium niobate - pure physical etch
	\|Dry plasma etch of Ti		\|Dry plasma etch of Ti
	\|		\|

Bghe: /* Comparison of Titanium Etch Methodes */

2025-03-28T12:28:20Z

Comparison of Titanium Etch Methodes

← Older revision		Revision as of 14:28, 28 March 2025
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	*Silicon oxides		*Silicon oxides
	*Silicon nitrides		*Silicon nitrides
			*Lithium niobate
	*Metals from the +list		*Metals from the +list
	*Metals from the -list		*Metals from the -list
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	*Polymers		*Polymers
	*Capton tape		*Capton tape
			*And many more, please ask the Dryetch group
	\|		\|
	*Silicon		*Silicon

Bghe: /* Comparison of Titanium Etch Methodes */

2025-03-28T12:27:21Z

Comparison of Titanium Etch Methodes

← Older revision		Revision as of 14:27, 28 March 2025
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	!		!
	!		!
			![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE (Ionfab300+)]]
			![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher\|ICP metal]]
	!		!
	~~![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher\|ICP metal]]~~
	~~![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE (Ionfab300+)]]~~
	\|-		\|-

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	!Generel description		!Generel description
	\|		\|
			\|Sputtering of Ti - pure physical etch
			\|Dry plasma etch of Ti
	\|		\|
	~~\|Dry plasma etch of Ti~~
	~~\|Sputtering of Ti - pure physical etch~~
	\|-		\|-

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	*		*
	\|		\|
	*		**~20nm/min
	\|		\|
	*~50-200 nm/min (depending on features size and etch load and recipe settings)		*~50-200 nm/min (depending on features size and etch load and recipe settings)
	\|		\|
	*~20nm/min
	\|-		\|-

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	*		*
	\|		\|
	*		**Anisotropic (angles sidewalls, typical around 70 dg)
	\|		\|
	*Anisotropic (vertical sidewalls)		*Anisotropic (vertical sidewalls)
	\|		\|
	*Anisotropic (angles sidewalls, typical around 70 dg)
	\|-		\|-

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	*		*
	\|		\|
			Smaller pieces glued to carrier wafer
			*<nowiki>#</nowiki>1 50mm wafer
			*<nowiki>#</nowiki>1 100mm wafer
			*<nowiki>#</nowiki>1 150mm wafer
			*<nowiki>#</nowiki>1 200mm wafer
	*		*
	\|		\|
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	*<nowiki>#</nowiki>1 150mm wafers		*<nowiki>#</nowiki>1 150mm wafers
	\|		\|
	~~Smaller pieces glued to carrier wafer~~
	*<nowiki>#</nowiki>1 50mm wafer
	*<nowiki>#</nowiki>1 100mm wafer
	*<nowiki>#</nowiki>1 150mm wafer
	*<nowiki>#</nowiki>1 200mm wafer
	\|-		\|-

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	!'''Allowed materials'''		!'''Allowed materials'''
	\|		\|
	\|
	\|
	*Silicon
	*Quartz/fused silica
	*Photoresist/e-beam resist
	*PolySilicon,
	*Silicon oxide
	*Silicon (oxy)nitride
	*Aluminium
	*Titanium
	*Chromium
	\|		\|
	*Silicon		*Silicon
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	*Polymers		*Polymers
	*Capton tape		*Capton tape
			\|
			*Silicon
			*Quartz/fused silica
			*Photoresist/e-beam resist
			*PolySilicon,
			*Silicon oxide
			*Silicon (oxy)nitride
			*Aluminium
			*Titanium
			*Chromium
			\|

	\|-		\|-

	\|}		\|}

Bghe: /* Comparison of Titanium Etch Methodes */

2025-03-28T12:25:35Z

Comparison of Titanium Etch Methodes

← Older revision		Revision as of 14:25, 28 March 2025
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	\|-style="background:silver; color:black"		\|-style="background:silver; color:black"
	!		!
	!~~[[Specific Process Knowledge/Etch/Wet Titanium Etch\|Ti wet etch 1]]~~		!
	!~~[[Specific Process Knowledge/Etch/Wet Titanium Etch\|Ti wet etch 2]]~~		!
	![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher\|ICP metal]]		![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher\|ICP metal]]
	![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE (Ionfab300+)]]		![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE (Ionfab300+)]]
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	!Generel description		!Generel description
	\|~~BHF Etch of titanium with or without photoresist mask.~~		\|
	\|~~Cold RCA1 mix etch of titanium (as stripper or with eagle resist).~~		\|
	\|Dry plasma etch of Ti		\|Dry plasma etch of Ti
	\|Sputtering of Ti - pure physical etch		\|Sputtering of Ti - pure physical etch
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	!Etch rate range		!Etch rate range
	\|		\|
	*~~~?nm/min~~		*
	\|		\|
	*~~~?nm/min~~		*
	\|		\|
	*~50-200 nm/min (depending on features size and etch load and recipe settings)		*~50-200 nm/min (depending on features size and etch load and recipe settings)
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	!Etch profile		!Etch profile
	\|		\|
	*~~Isotropic~~		*
	\|		\|
	*~~Isotropic~~		*
	\|		\|
	*Anisotropic (vertical sidewalls)		*Anisotropic (vertical sidewalls)
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	!Substrate size		!Substrate size
	\|		\|
	*~~Any size and number that can go inside the beaker in use~~		*
	\|		\|
	*~~Any size and number that can go inside the beaker in use~~		*
	\|		\|
	*smaller pieces on a carrier wafer		*smaller pieces on a carrier wafer
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	!'''Allowed materials'''		!'''Allowed materials'''
	\|		\|
	~~No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals~~
	\|		\|
	~~No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals~~
	\|		\|
	*Silicon		*Silicon