Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE Au etch - Revision history

Bghe at 09:21, 4 September 2025

2025-09-04T09:21:56Z

← Older revision		Revision as of 11:21, 4 September 2025
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	!style="background:silver; color:black" align="left" valign="top"\|Etch rate uniformity		!style="background:silver; color:black" align="left" valign="top"\|Etch rate uniformity
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*<+-2%		*<±2%
	\|		\|
	*+-(0.2% +-0.2%)		*±(0.2% +-0.2%)
	\|-		\|-
	!style="background:silver; color:black" align="left" valign="top"\|Reproducibility		!style="background:silver; color:black" align="left" valign="top"\|Reproducibility
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*<+-2%		*<±2%
	\|		\|
	*+-0.9%		*±0.9%
	\|-		\|-
	!style="background:silver; color:black" align="left" valign="top"\|Selectivity (Au etch rate/ZEP etch rate)		!style="background:silver; color:black" align="left" valign="top"\|Selectivity (Au etch rate/ZEP etch rate)

Bghe at 14:25, 6 February 2023

2023-02-06T14:25:41Z

← Older revision		Revision as of 16:25, 6 February 2023
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	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300/IBE_Au_etch click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300/IBE_Au_etch click here]'''
	<br> {{CC-~~bghe~~}}		<br> {{CC-bghe1}}

Bghe at 14:25, 6 February 2023

2023-02-06T14:25:30Z

← Older revision		Revision as of 16:25, 6 February 2023
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	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300/IBE_Au_etch click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300/IBE_Au_etch click here]'''
			<br> {{CC-bghe}}

Bghe: /* Some SEM profile images of the etched Au */

2023-02-06T14:23:12Z

Some SEM profile images of the etched Au

← Older revision		Revision as of 16:23, 6 February 2023
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	{\| border="1" cellspacing="1" cellpadding="2"		{\| border="1" cellspacing="1" cellpadding="2"
	\|		\|
	[[image:IBE ~~acceptance~~ S18-AU-ZEP3.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP3]]		[[image:IBE accpetance S18-AU-ZEP3.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP3]]
	\|		\|
	[[image:IBE ~~accpetance~~ S18-AU-ZEP5.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP5]]		[[image:IBE acceptance S18-AU-ZEP5.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP5]]
	\|}		\|}

Bghe: /* Some SEM profile images of the etched Au */

2023-02-06T14:22:55Z

Some SEM profile images of the etched Au

← Older revision		Revision as of 16:22, 6 February 2023
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	[[image:IBE acceptance S18-AU-ZEP3.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP3]]		[[image:IBE acceptance S18-AU-ZEP3.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP3]]
	\|		\|
	[[image:IBE ~~acceptance~~ S18-AU-ZEP5.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP5]]		[[image:IBE accpetance S18-AU-ZEP5.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP5]]
	\|}		\|}

Bghe: /* Some SEM profile images of the etched Au */

2022-09-07T08:04:18Z

Some SEM profile images of the etched Au

← Older revision		Revision as of 10:04, 7 September 2022
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	===Some SEM profile images of the etched Au===		===Some SEM profile images of the etched Au===
	{\| border="1" cellspacing="1" cellpadding="2"		{\| border="1" cellspacing="1" cellpadding="2"
	!		\|
	[[image:IBE acceptance S18-AU-ZEP3.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP3]]		[[image:IBE acceptance S18-AU-ZEP3.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP3]]
	!		\|
	[[image:IBE acceptance S18-AU-ZEP5.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP5]]		[[image:IBE acceptance S18-AU-ZEP5.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP5]]
	\|}		\|}





	==IBE Au etch with Ti mask==		==IBE Au etch with Ti mask==

Bghe: /* IBE Au etch with Ti mask */

2022-03-30T07:45:50Z

IBE Au etch with Ti mask

← Older revision		Revision as of 09:45, 30 March 2022
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	!Recipe name		!Recipe name
	\|		\|
	~~test~~ Ti acceptance 20111129		Ti acceptance 20111129
	\|		\|
	Au_acceptance_with_O2		Au_acceptance_with_O2

Jmli at 15:54, 25 November 2019

2019-11-25T15:54:32Z

← Older revision		Revision as of 17:54, 25 November 2019
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	'''Feedback to this page''': '''[mailto:labadviser@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.~~danchip~~.dtu.dk/index.php/Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300/IBE_Au_etch click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300/IBE_Au_etch click here]'''


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	*50 mm SSP Si wafer		*50 mm SSP Si wafer
	*525 µm thick		*525 µm thick
	*Supplied by ~~Danchip~~		*Supplied by Nanolab
	\|.		\|.
	\|-		\|-
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	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*E-beam resist mask:		*E-beam resist mask:
	# ~~400nm~~ of spin coated ZEP520A e-beam resist		# 400 nm of spin coated ZEP520A e-beam resist
	#Patterned by E-beam lithography		#Patterned by E-beam lithography
	\|.		\|.
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	!style="background:silver; color:black" align="left" valign="top"\|Features to be etched		!style="background:silver; color:black" align="left" valign="top"\|Features to be etched
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~300nm~~ - 3µm dots and lines + a square of 200µmx200µm		*300 nm - 3µm dots and lines + a square of 200µmx200µm
	\|.		\|.
	\|-		\|-
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	!style="background:silver; color:black" align="left" valign="top"\|Etch profile		!style="background:silver; color:black" align="left" valign="top"\|Etch profile
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*70-~~90dg~~.		*70-90 dg.
	\|		\|
	*~~75dg~~		*75 dg
	\|}		\|}

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	!Au etch acceptance		!Au etch acceptance
	\|-		\|-
	\|~~Neutalizer~~ current [mA]		\|Neutralizer current [mA]
	\|550		\|550
	\|-		\|-
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	{\| border="1" cellspacing="1" cellpadding="2"		{\| border="1" cellspacing="1" cellpadding="2"
	!		!
	[[image:IBE ~~accpetance~~ S18-AU-ZEP3.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP3]]		[[image:IBE acceptance S18-AU-ZEP3.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP3]]
	!		!
	[[image:IBE acceptance S18-AU-ZEP5.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP5]]		[[image:IBE acceptance S18-AU-ZEP5.jpg\|450x450px\|thumb\|center\|s18-Au-ZEP5]]
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	''by bghe@nanolab''		''by bghe@nanolab''

	Work has been started to find a good process for etching gold with a Titanium mask with high ~~selektivity~~.		Work has been started to find a good process for etching gold with a Titanium mask with high selectivity.

	{\|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"		{\|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
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	\|-		\|-
	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	!~~Generel~~ description		!General description
	\|This recipe has a good selectivity between ZEP520A resist and Ti, which makes it good for ~~pattering~~ the Ti that should be used as masking layer for the Au etch. It can also be used to etch Au if the selectivity to the mask is good enough.		\|This recipe has a good selectivity between ZEP520A resist and Ti, which makes it good for patterning the Ti that should be used as masking layer for the Au etch. It can also be used to etch Au if the selectivity to the mask is good enough.
	\|This recipe has especially good selectivity between Ti and Au which makes it good for gold etching using a thin Ti mask as masking layer. The selectivity to resist is very bad so do not use it with a resist mask.		\|This recipe has especially good selectivity between Ti and Au which makes it good for gold etching using a thin Ti mask as masking layer. The selectivity to resist is very bad so do not use it with a resist mask.
	\|-		\|-
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	!Etch rate in resist		!Etch rate in resist
	\|		\|
	12.~~8nm~~/min (15-12-2011)		12.8 nm/min (15-12-2011)
	\|		\|
	~~72nm~~/min (13-12-2011)		72 nm/min (13-12-2011)
	\|-		\|-

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	image:IBE_Au_Ti_nr13_2.jpg\|Line profile through Ti and Au.		image:IBE_Au_Ti_nr13_2.jpg\|Line profile through Ti and Au.
	</gallery>		</gallery>
	<gallery widths="150px" ~~heights~~="150px" perrow="3">		<gallery widths="150px" height ="150px" perrow="3">
	image:IBE_Au_Ti_uden_Ti_nr13_1.jpg\|Several line profiles in Au after Ti has been removed.		image:IBE_Au_Ti_uden_Ti_nr13_1.jpg\|Several line profiles in Au after Ti has been removed.
	image:IBE_Au_Ti_uden_Ti_nr13_2.jpg\|Line profile in Au after Ti has been removed.		image:IBE_Au_Ti_uden_Ti_nr13_2.jpg\|Line profile in Au after Ti has been removed.
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	</gallery>		</gallery>
	\|		\|
	<gallery caption="Ti mask etched for 6min30sec with recipe ''test Ti acceptance 20111129''. The Au was etched for 7min with recipe ''Au_acceptance_with_O2''. The result was less fenching because a thinner mask was used (Ti instead off resist)" widths="150px" ~~heights~~="150px" perrow="3" >		<gallery caption="Ti mask etched for 6min30sec with recipe ''test Ti acceptance 20111129''. The Au was etched for 7min with recipe ''Au_acceptance_with_O2''. The result was less fenching because a thinner mask was used (Ti instead off resist)" widths="150px" height="150px" perrow="3" >
	image:IBE_Au_Ti_w14_20130926_500nmT_BHF5min_2.jpg\|Tilted line in Au after Ti has been removed.		image:IBE_Au_Ti_w14_20130926_500nmT_BHF5min_2.jpg\|Tilted line in Au after Ti has been removed.
	image:IBE_Au_Ti_W14_20130926_500nm_1.jpg\|Profile in Au after Ti has been removed.		image:IBE_Au_Ti_W14_20130926_500nm_1.jpg\|Profile in Au after Ti has been removed.

Bghe: /* Al2O3 using Ti mask etching with the "Au acceptance recipe" */

2019-05-03T13:21:16Z

Al2O3 using Ti mask etching with the "Au acceptance recipe"

← Older revision		Revision as of 15:21, 3 May 2019
Line 250:		Line 250:

	==Al2O3 using Ti mask etching with the "Au acceptance recipe"==		==Al2O3 using Ti mask etching with the "Au acceptance recipe"==
	''This work was done by Sezer Köse @fotonik April 2019''		''This work was done by Sezer Köse @fotonik April 2019'' <br>
	[[File:Sezer Al2O3 and Ti.JPG\|~~400px~~]]		[[File:Sezer Al2O3 and Ti.JPG\|600px]]

Bghe at 13:20, 3 May 2019

2019-05-03T13:20:58Z

← Older revision		Revision as of 15:20, 3 May 2019
Line 248:		Line 248:

	<br clear="all" />		<br clear="all" />

			==Al2O3 using Ti mask etching with the "Au acceptance recipe"==
			''This work was done by Sezer Köse @fotonik April 2019''
			[[File:Sezer Al2O3 and Ti.JPG\|400px]]