Specific Process Knowledge/Etch/Etching of Platinum - Revision history

Mbec at 13:44, 28 March 2025

2025-03-28T13:44:04Z

← Older revision		Revision as of 15:44, 28 March 2025
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	'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''		'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.~~danchip~~.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Platin click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Platin click here]'''

	[[Category: Equipment\|Etch Wet Platinum]]		[[Category: Equipment\|Etch Wet Platinum]]

Rkch at 14:47, 6 February 2023

2023-02-06T14:47:58Z

← Older revision		Revision as of 16:47, 6 February 2023
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			'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''

			'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''

	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Platin click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Platin click here]'''

Bghe at 08:06, 17 March 2020

2020-03-17T08:06:14Z

← Older revision		Revision as of 10:06, 17 March 2020
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	'''Feedback to this page''': '''[mailto:labadviser@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Platin click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Platin click here]'''

	[[Category: Equipment\|Etch Wet Platinum]]		[[Category: Equipment\|Etch Wet Platinum]]

Choi: /* Comparison of Platinum Etch Methods */

2017-02-27T08:54:01Z

Comparison of Platinum Etch Methods

← Older revision		Revision as of 10:54, 27 February 2017
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	!Etch rate range		!Etch rate range
	\|		\|
	*~?nm/min		*~ 1 - 10 nm/min (not tested yet)
	\|		\|
	*~30nm/min (not tested yet)		*~30nm/min (not tested yet)

Bghe at 13:50, 25 August 2014

2014-08-25T13:50:16Z

← Older revision		Revision as of 15:50, 25 August 2014
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	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Platin click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Platin click here]'''

			[[Category: Equipment\|Etch Wet Platinum]]
			[[Category: Etch (Wet) bath\|Platinum]]

	==Etching of Platinum==		==Etching of Platinum==

BGE at 10:05, 8 April 2013

2013-04-08T10:05:35Z

← Older revision		Revision as of 12:05, 8 April 2013
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	~~=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png\|200px]]=~~




	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Platin click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Platin click here]'''

BGE: /* Comparison of Platinum Etch Methods */

2013-04-08T10:04:25Z

Comparison of Platinum Etch Methods

← Older revision		Revision as of 12:04, 8 April 2013
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	*~?nm/min		*~?nm/min
	\|		\|
	*~~~55nm~~/min (not tested yet)		*~30nm/min (not tested yet)
	\|-		\|-

BGE: /* Comparison of Platinum Etch Methods */

2013-04-08T10:00:51Z

Comparison of Platinum Etch Methods

← Older revision		Revision as of 12:00, 8 April 2013
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	!Etch rate range		!Etch rate range
	\|		\|
	*~~~100nm~~/min		*~?nm/min
	\|		\|
	*~55nm/min (not tested yet)		*~55nm/min (not tested yet)

BGE: /* Comparison of Platinum Etch Methods */

2013-04-08T09:59:08Z

Comparison of Platinum Etch Methods

← Older revision		Revision as of 11:59, 8 April 2013
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	\|-style="background:silver; color:black"		\|-style="background:silver; color:black"
	!		!
	![[Specific Process Knowledge/Etch/Wet ~~Patinum~~ Etch\|Pt wet etch]]		![[Specific Process Knowledge/Etch/Wet Platinum Etch\|Pt wet etch]]
	![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE (Ionfab300+)]]		![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE (Ionfab300+)]]
	\|-		\|-

BGE: /* Comparison of Gold Etch Methods */

2013-04-08T09:58:01Z

Comparison of Gold Etch Methods

← Older revision		Revision as of 11:58, 8 April 2013
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	<br clear="all" />		<br clear="all" />

	==Comparison of ~~Gold~~ Etch Methods==		==Comparison of Platinum Etch Methods==

	{\|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"		{\|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
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	\|-style="background:silver; color:black"		\|-style="background:silver; color:black"
	!		!
	![[Specific Process Knowledge/Etch/Wet ~~Gold~~ Etch\|Au wet etch ~~1]]~~		![[Specific Process Knowledge/Etch/Wet Patinum Etch\|Pt wet etch]]
	~~![[Specific Process Knowledge/Etch/Wet Gold Etch\|Au wet etch 2~~]]
	![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE (Ionfab300+)]]		![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE (Ionfab300+)]]
	\|-		\|-
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	!Generel description		!Generel description
	\|Wet etch of ~~Au using Iodine based chemistry~~		\|Wet etch of Pt
	~~\|Wet etch of Au using Aqua Regina~~		\|Sputtering of Pt
	\|Sputtering of ~~Au - pure physical etch~~
	\|-		\|-

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	*~100nm/min		*~100nm/min
	\|		\|
	*~?nm/min - fast etch		*~55nm/min (not tested yet)
	\|
	*~55nm/min (~~acceptance test~~)
	\|-		\|-

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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	!Etch profile		!Etch profile
	\|
	*Isotropic
	\|		\|
	*Isotropic		*Isotropic
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	!Masking material		!Masking material
	\|		\|
	*Photoresist		*None (only used for stripping Pt)
	\|
	*None (only used for ~~stipping Au~~)
	\|		\|
	*Any material that is allowed in the chamber, photoresists included		*Any material that is allowed in the chamber, photoresists included
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	!Substrate size		!Substrate size
	\|		\|
	*Any size and number that can go inside the beaker in use		*Any size and number that can go inside the beaker in use
	\|
	*Any size and number that can go inside the beaker in use

	\|		\|
	Smaller pieces glued to carrier wafer		Smaller pieces glued to carrier wafer
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	!'''Allowed materials'''		!'''Allowed materials'''
	\|		\|
	No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals		No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals
	\|
	~~No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals~~
	\|		\|
	*Silicon		*Silicon