Specific Process Knowledge/Etch/Etching of Gold - Revision history

Mbec at 13:43, 28 March 2025

2025-03-28T13:43:33Z

← Older revision		Revision as of 15:43, 28 March 2025
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	==Etching of Gold==		==Etching of Gold==

Rkch at 14:47, 6 February 2023

2023-02-06T14:47:34Z

← Older revision		Revision as of 16:47, 6 February 2023
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			'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''

			'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''

	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Gold click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Gold click here]'''

Mbec: /* Etching of Gold */

2021-01-25T12:30:10Z

Etching of Gold

← Older revision		Revision as of 14:30, 25 January 2021
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	==Etching of Gold==		==Etching of Gold==

	Etching of Gold can be done either by wet etch or by sputtering with ions.		Etching of Gold can be done either by wet etch, or by sputtering with ions.
	*[[Specific Process Knowledge/Etch/Wet Gold Etch\|Etching of Gold by wet etch]]		*[[Specific Process Knowledge/Etch/Wet Gold Etch\|Etching of Gold by wet etch]]
	*[[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300/IBE Au etch\|Sputtering of Au]]		*[[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300/IBE Au etch\|Sputtering of Au]]

Choi: /* Comparison of Gold Etch Methods */

2018-01-23T14:10:01Z

Comparison of Gold Etch Methods

← Older revision		Revision as of 16:10, 23 January 2018
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	*~100nm/min		*~100nm/min
	\|		\|
	*~~fast etch, mainly~~ used for complete removal of metals		*680 nm/min (dilute) or faster (concentrated). Mainly used for complete removal of metals
	\|		\|
	*~55nm/min (acceptance test)		*~55nm/min (acceptance test)

Choi: /* Comparison of Gold Etch Methods */

2018-01-23T13:52:59Z

Comparison of Gold Etch Methods

← Older revision		Revision as of 15:52, 23 January 2018
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	\|-style="background:WhiteSmoke; color:black"		\|-style="background:WhiteSmoke; color:black"
	!Generel description		!Generel description
	\|Wet etch of Au using ~~Iodine~~ based chemistry		\|Wet etch of Au using iodine based chemistry
	\|Wet etch of Au using Aqua Regina		\|Wet etch of Au using Aqua Regina
	\|Sputtering of Au - pure physical etch		\|Sputtering of Au - pure physical etch

Kabi: /* Comparison of Gold Etch Methods */

2015-11-19T08:46:18Z

Comparison of Gold Etch Methods

← Older revision		Revision as of 10:46, 19 November 2015
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	*Photoresist		*Photoresist
	\|		\|
	*None (~~only~~ used for ~~stipping~~ Au)		*None (mainly used for stripping Au)
	\|		\|
	*Any material that is allowed in the chamber, photoresists included		*Any material that is allowed in the chamber, photoresists included

Kabi: /* Comparison of Gold Etch Methods */

2015-11-19T08:44:58Z

Comparison of Gold Etch Methods

← Older revision		Revision as of 10:44, 19 November 2015
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	*~100nm/min		*~100nm/min
	\|		\|
	*~~~?nm/min -~~ fast etch		*fast etch, mainly used for complete removal of metals
	\|		\|
	*~55nm/min (acceptance test)		*~55nm/min (acceptance test)

BGE: /* Etching of Gold */

2013-04-08T09:01:15Z

Etching of Gold

← Older revision		Revision as of 11:01, 8 April 2013
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	==Etching of Gold==		==Etching of Gold==

	Etching of Gold can be done either by wet ~~etch, dry~~ etch or by sputtering with ions.		Etching of Gold can be done either by wet etch or by sputtering with ions.
	*[[Specific Process Knowledge/Etch/Wet Gold Etch\|Etching of Gold by wet etch]]		*[[Specific Process Knowledge/Etch/Wet Gold Etch\|Etching of Gold by wet etch]]
	*[[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300/IBE Au etch\|Sputtering of Au]]		*[[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300/IBE Au etch\|Sputtering of Au]]

BGE at 09:00, 8 April 2013

2013-04-08T09:00:52Z

← Older revision		Revision as of 11:00, 8 April 2013
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	Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE]] by sputtering with Ar ions.



	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Gold click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Gold click here]'''

	~~=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png\|200px]]=~~


	==Etching of Gold==		==Etching of Gold==

BGE: /* Etching of Gold */

2013-04-08T09:00:19Z

Etching of Gold

← Older revision		Revision as of 11:00, 8 April 2013
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	Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE]] by sputtering with Ar ions.		Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300\|IBE]] by sputtering with Ar ions.


	~~==Etching of Gold==~~
	~~[[Image:fumehoodetch-gold.jpg \|300x300px\|thumb\|Wet Gold Etch: Done in the fumehood positioned in cleanroom 2]]~~
	~~Etching of Gold is done wet at Danchip making your own set up in a beaker in the fumehood. We have two different solutions:~~

	~~# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask.~~
	# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid witch will etch most metals and are therefore used when you wish to remove all the gold from your wafer. '''you have to be very carefull when you work with Aqua Regia (Kongevand) It can generate nitrous gases witch are very toxic!!'''


	~~===Comparing the two solutions===~~

	~~{\| border="2" cellspacing="0" cellpadding="4" align="left"~~
	!
	~~! Iodine based gold etch~~
	~~! Aqua Regia (Kongevand)~~
	\|-
	~~\|'''General description'''~~
	\|
	~~Etch of pure Gold with or without photoresist mask.~~
	\|
	~~Etch of pure Gold (as stripper).~~
	\|-
	~~\|'''Chemical solution'''~~
	~~\|KI:I<sub>2</sub>:H<sub>2</sub>O (100g:25g:500ml)~~
	~~\|HCl:HNO<sub>3</sub> (3:1)~~
	\|-
	~~\|'''Process temperature'''~~
	~~\|20 <sup>o</sup>C~~

	~~\|20 <sup>o</sup>C~~

	\|-

	~~\|'''Possible masking materials'''~~
	\|
	~~Photoresist (1.5 µm AZ5214E)~~
	\|
	~~Unmasked - used as a stripper~~
	\|-
	~~\|'''Etch rate'''~~
	\|
	~~~100 nm/min~~
	\|
	~~~(??) nm/min - fast etch~~
	\|-
	~~\|'''Batch size'''~~
	\|
	~~1-5 4" wafers at a time~~
	\|
	~~1-5 4" wafer at a time~~
	\|-
	~~\|'''Size of substrate'''~~
	\|
	~~2-6" wafers~~
	\|
	~~2-6" wafers~~
	\|-
	\|}