Specific Process Knowledge/Etch/DryEtchProcessing/OES - Revision history

Jmli at 09:39, 21 October 2025

2025-10-21T09:39:08Z

← Older revision		Revision as of 11:39, 21 October 2025
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	== Optical Endpoint detection systems ==		== Optical Endpoint detection systems ==

Jmli at 10:59, 3 February 2023

2023-02-03T10:59:21Z

← Older revision		Revision as of 12:59, 3 February 2023
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	== Optical Endpoint detection systems ==		== Optical Endpoint detection systems ==
			{{Template:Contentbydryetch}}
			<!--Checked for updates on 3/2-2023 - ok/jmli -->

	During a process, the plasma dissociates the gas molecules present in the process chamber into reactive species that emit light at certain wavelengths. This means that the light coming from the process chamber will be a spectrum in which elements of both process gases and process reactants are found. By analyzing the spectrum we can keep track of when certain species change concentration, i.e. when, for instance, the etch of a thin layer is complete. This is the end point of the etch hence the name.		During a process, the plasma dissociates the gas molecules present in the process chamber into reactive species that emit light at certain wavelengths. This means that the light coming from the process chamber will be a spectrum in which elements of both process gases and process reactants are found. By analyzing the spectrum we can keep track of when certain species change concentration, i.e. when, for instance, the etch of a thin layer is complete. This is the end point of the etch hence the name.

Jmli at 09:00, 9 August 2022

2022-08-09T09:00:23Z

← Older revision		Revision as of 11:00, 9 August 2022
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	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch click here]'''
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	== Optical Endpoint detection systems ==		== Optical Endpoint detection systems ==

Jmli at 10:35, 25 November 2019

2019-11-25T10:35:28Z

← Older revision		Revision as of 12:35, 25 November 2019
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	'''Feedback to this page''': '''[mailto:labadviser@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.~~danchip~~.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch click here]'''
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Jmli at 09:00, 14 May 2018

2018-05-14T09:00:34Z

← Older revision		Revision as of 11:00, 14 May 2018
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	== Optical Endpoint detection systems ==		== Optical Endpoint detection systems ==

Bghe: /* Optical Endpoint detection systems */

2017-10-26T11:41:08Z

Optical Endpoint detection systems

← Older revision		Revision as of 13:41, 26 October 2017
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	During a process, the plasma dissociates the gas molecules present in the process chamber into reactive species that emit light at certain wavelengths. This means that the light coming from the process chamber will be a spectrum in which elements of both process gases and process reactants are found. By analyzing the spectrum we can keep track of when certain species change concentration, i.e. when, for instance, the etch of a thin layer is complete. This is the end point of the etch hence the name.		During a process, the plasma dissociates the gas molecules present in the process chamber into reactive species that emit light at certain wavelengths. This means that the light coming from the process chamber will be a spectrum in which elements of both process gases and process reactants are found. By analyzing the spectrum we can keep track of when certain species change concentration, i.e. when, for instance, the etch of a thin layer is complete. This is the end point of the etch hence the name.

	The DRIE-Pegasus, the ICP Metal Etcher and the III-V ICP are all equipped with a Verity SD1024 Spectrometer and the SpectraView software package. The SpectraView software enables you to monitor any number of any wavelength in the 200-800 nm range and do complicated mathematical analysis of the spectra. Some application examples can be seen [[Specific Process Knowledge/Etch/Using OES to monitor etch process\|here]].		The DRIE-Pegasus, the ICP Metal Etcher and the III-V ICP are all equipped with a Verity SD1024 Spectrometer and the SpectraView software package. The SpectraView software enables you to monitor any number of any wavelength in the 200-800 nm range and do complicated mathematical analysis of the spectra. Some application examples can be seen [[Specific Process Knowledge/Etch/DRIE-Pegasus/Using OES to monitor etch process\|here]].

Bghe: /* Optical Endpoint detection systems */

2017-10-26T11:40:27Z

Optical Endpoint detection systems

← Older revision		Revision as of 13:40, 26 October 2017
Line 3:		Line 3:
	During a process, the plasma dissociates the gas molecules present in the process chamber into reactive species that emit light at certain wavelengths. This means that the light coming from the process chamber will be a spectrum in which elements of both process gases and process reactants are found. By analyzing the spectrum we can keep track of when certain species change concentration, i.e. when, for instance, the etch of a thin layer is complete. This is the end point of the etch hence the name.		During a process, the plasma dissociates the gas molecules present in the process chamber into reactive species that emit light at certain wavelengths. This means that the light coming from the process chamber will be a spectrum in which elements of both process gases and process reactants are found. By analyzing the spectrum we can keep track of when certain species change concentration, i.e. when, for instance, the etch of a thin layer is complete. This is the end point of the etch hence the name.

	The DRIE-Pegasus, the ICP Metal Etcher and the III-V ICP are all equipped with a Verity SD1024 Spectrometer and the SpectraView software package. The SpectraView software enables you to monitor any number of any wavelength in the 200-800 nm range and do complicated mathematical analysis of the spectra. Some application examples can be seen [[Using OES to monitor etch process\|here]].		The DRIE-Pegasus, the ICP Metal Etcher and the III-V ICP are all equipped with a Verity SD1024 Spectrometer and the SpectraView software package. The SpectraView software enables you to monitor any number of any wavelength in the 200-800 nm range and do complicated mathematical analysis of the spectra. Some application examples can be seen [[Specific Process Knowledge/Etch/Using OES to monitor etch process\|here]].

Bincha: /* Optical Endpoint detection systems */

2017-10-23T07:00:32Z

Optical Endpoint detection systems

← Older revision		Revision as of 09:00, 23 October 2017
Line 3:		Line 3:
	During a process, the plasma dissociates the gas molecules present in the process chamber into reactive species that emit light at certain wavelengths. This means that the light coming from the process chamber will be a spectrum in which elements of both process gases and process reactants are found. By analyzing the spectrum we can keep track of when certain species change concentration, i.e. when, for instance, the etch of a thin layer is complete. This is the end point of the etch hence the name.		During a process, the plasma dissociates the gas molecules present in the process chamber into reactive species that emit light at certain wavelengths. This means that the light coming from the process chamber will be a spectrum in which elements of both process gases and process reactants are found. By analyzing the spectrum we can keep track of when certain species change concentration, i.e. when, for instance, the etch of a thin layer is complete. This is the end point of the etch hence the name.

	The DRIE-Pegasus, the ICP Metal Etcher and the III-V ICP are all equipped with a Verity SD1024 Spectrometer and the SpectraView software package. The SpectraView software enables you to monitor any number of any wavelength in the 200-800 nm range and do complicated mathematical analysis of the spectra. Some application examples can be seen [[here]].		The DRIE-Pegasus, the ICP Metal Etcher and the III-V ICP are all equipped with a Verity SD1024 Spectrometer and the SpectraView software package. The SpectraView software enables you to monitor any number of any wavelength in the 200-800 nm range and do complicated mathematical analysis of the spectra. Some application examples can be seen [[Using OES to monitor etch process\|here]].

Bincha at 06:58, 23 October 2017

2017-10-23T06:58:38Z

← Older revision		Revision as of 08:58, 23 October 2017
Line 3:		Line 3:
	During a process, the plasma dissociates the gas molecules present in the process chamber into reactive species that emit light at certain wavelengths. This means that the light coming from the process chamber will be a spectrum in which elements of both process gases and process reactants are found. By analyzing the spectrum we can keep track of when certain species change concentration, i.e. when, for instance, the etch of a thin layer is complete. This is the end point of the etch hence the name.		During a process, the plasma dissociates the gas molecules present in the process chamber into reactive species that emit light at certain wavelengths. This means that the light coming from the process chamber will be a spectrum in which elements of both process gases and process reactants are found. By analyzing the spectrum we can keep track of when certain species change concentration, i.e. when, for instance, the etch of a thin layer is complete. This is the end point of the etch hence the name.

	The DRIE-Pegasus, the ICP Metal Etcher and the III-V ICP are all equipped with a Verity SD1024 Spectrometer and the SpectraView software package. The SpectraView software enables you to monitor any number of any wavelength in the 200-800 nm range and do complicated mathematical analysis of the spectra.		The DRIE-Pegasus, the ICP Metal Etcher and the III-V ICP are all equipped with a Verity SD1024 Spectrometer and the SpectraView software package. The SpectraView software enables you to monitor any number of any wavelength in the 200-800 nm range and do complicated mathematical analysis of the spectra. Some application examples can be seen [[here]].

Jmli at 12:13, 17 January 2017

2017-01-17T12:13:04Z

← Older revision		Revision as of 14:13, 17 January 2017
Line 1:		Line 1:
	== Optical Endpoint detection systems ==		== Optical Endpoint detection systems ==

	During a process, the plasma dissociates the gas molecules present in the process chamber into reactive species that emit light at certain wavelengths. This means that the light coming from the process chamber will be a spectrum in which elements of both process gases and process reactants are found. By analyzing the spectrum we can keep track of when certain species change concentration, i.e. when, for instance, the etch of a thin layer is complete. This is the end point of the etch hence the name.		During a process, the plasma dissociates the gas molecules present in the process chamber into reactive species that emit light at certain wavelengths. This means that the light coming from the process chamber will be a spectrum in which elements of both process gases and process reactants are found. By analyzing the spectrum we can keep track of when certain species change concentration, i.e. when, for instance, the etch of a thin layer is complete. This is the end point of the etch hence the name.