Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10 - Revision history

Jmli at 08:27, 4 September 2025

2025-09-04T08:27:30Z

← Older revision		Revision as of 10:27, 4 September 2025
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	<!--Checked for updates on 30/7-2018 - ok/jmli -->		<!--Checked for updates on 30/7-2018 - ok/jmli -->
	<!--Checked for updates on 5/10-2020 - ok/jmli -->		<!--Checked for updates on 5/10-2020 - ok/jmli -->
			<!--Checked for updates on 4/9-2025 - ok/jmli -->
	== The nano1.0 recipe ==		== The nano1.0 recipe ==
	{{Template:Author-jmli1}}		{{Template:Author-jmli1}}

2023-02-02T14:17:58Z

The nano1.0 recipe

← Older revision		Revision as of 16:17, 2 February 2023
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	== The nano1.0 recipe ==		== The nano1.0 recipe ==
	<!--~~foo~~-->		{{Template:Author-jmli1}}
			<!--Checked for updates on 2/02-2023 - ok/jmli -->

	{\| border="2" cellpadding="2" cellspacing="1"		{\| border="2" cellpadding="2" cellspacing="1"
	\|+ '''Recipe nano1.0'''		\|+ '''Recipe nano1.0'''

2020-10-05T06:30:48Z

← Older revision		Revision as of 08:30, 5 October 2020
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	'''Feedback to this page''': '''[mailto:labadviser@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.~~danchip~~.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10 click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10 click here]'''
	<!--Checked for updates on 30/7-2018 - ok/jmli -->		<!--Checked for updates on 30/7-2018 - ok/jmli -->
			<!--Checked for updates on 5/10-2020 - ok/jmli -->

	== The nano1.0 recipe ==		== The nano1.0 recipe ==

2018-07-30T11:41:39Z

← Older revision		Revision as of 13:41, 30 July 2018
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	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10 click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10 click here]'''
	<!--Checked for updates on 3/2-~~2016~~ - ok/jmli -->		<!--Checked for updates on 30/7-2018 - ok/jmli -->

	== The nano1.0 recipe ==		== The nano1.0 recipe ==

2016-02-03T14:25:05Z

← Older revision		Revision as of 16:25, 3 February 2016
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	'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10 click here]'''		'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10 click here]'''
			<!--Checked for updates on 3/2-2016 - ok/jmli -->

	== The nano1.0 recipe ==		== The nano1.0 recipe ==

2013-10-22T10:33:31Z

← Older revision		Revision as of 12:33, 22 October 2013
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			'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10 click here]'''

	== The nano1.0 recipe ==		== The nano1.0 recipe ==
	<!--foo-->		<!--foo-->

2011-05-10T12:33:26Z

The nano1.0 recipe

← Older revision		Revision as of 14:33, 10 May 2011
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	\| align="center" style="background:#f0f0f0;"\|'''Std'''		\| align="center" style="background:#f0f0f0;"\|'''Std'''
	\|-		\|-
	\| ER\|\|nm/min\|\|239\|\|281\|\|306\|\|320\|\|328\|\|295\|\|36		\| Etch rates\|\|nm/min\|\|239\|\|281\|\|306\|\|320\|\|328\|\|295\|\|36
	\|-		\|-
	\| SA\|\|degs\|\|93\|\|94\|\|93\|\|92\|\|93\|\|93\|\|1		\| Sidewall angle\|\|degs\|\|93\|\|94\|\|93\|\|92\|\|93\|\|93\|\|1
	\|-		\|-
	\| ~~base~~\|\|nm/edge\|\|-1\|\|-5\|\|-11\|\|-9\|\|-32\|\|-11\|\|12		\| CD loss\|\|nm/edge\|\|-1\|\|-5\|\|-11\|\|-9\|\|-32\|\|-11\|\|12
	\|-		\|-
	\| foot\|\|nm/edge\|\|-1\|\|-5\|\|-11\|\|-9\|\|-2\|\|-5\|\|5		\| CD loss foot\|\|nm/edge\|\|-1\|\|-5\|\|-11\|\|-9\|\|-2\|\|-5\|\|5
	\|-		\|-
	\| Bowing\|\|\|\|41\|\|33\|\|29\|\|30\|\|22\|\|31\|\|7		\| Bowing\|\|\|\|41\|\|33\|\|29\|\|30\|\|22\|\|31\|\|7
	\|-		\|-
	\| ~~Curve~~\|\|\|\|-51\|\|-50\|\|-43\|\|-39\|\|-42\|\|-45\|\|5		\| Curvature\|\|\|\|-51\|\|-50\|\|-43\|\|-39\|\|-42\|\|-45\|\|5
	\|-		\|-
	\| zep\|\|nm/min\|\|\|\|\|\|\|\|\|\|\|\|46\|\|		\| zep\|\|nm/min\|\|\|\|\|\|\|\|\|\|\|\|46\|\|

2011-05-10T11:50:53Z

The nano1.0 recipe

@@ Line 44: / Line 44: @@
 C4F8 52 sccm, SF6 38 sccm, 4 mTorr, Strike 3 secs @ 15 mTorr, 800 W CP, 50 W PP, 10 degs, 120 secs
 </gallery>
 == Comments ==

2011-04-28T09:52:08Z

The nano1.0 recipe

← Older revision		Revision as of 11:52, 28 April 2011
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	== The nano1.0 recipe ==		== The nano1.0 recipe ==
			<!--foo-->
	{\| border="2" cellpadding="2" cellspacing="1"		{\| border="2" cellpadding="2" cellspacing="1"
	\|+ '''Recipe nano1.0'''		\|+ '''Recipe nano1.0'''
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	C4F8 52 sccm, SF6 38 sccm, 4 mTorr, Strike 3 secs @ 15 mTorr, 800 W CP, 50 W PP, 10 degs, 120 secs		C4F8 52 sccm, SF6 38 sccm, 4 mTorr, Strike 3 secs @ 15 mTorr, 800 W CP, 50 W PP, 10 degs, 120 secs
	</gallery>		</gallery>


	== Comments ==		== Comments ==

2011-03-31T07:43:08Z

Comments

← Older revision		Revision as of 09:43, 31 March 2011
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	\|-		\|-
	\| Gas Flow (sccm)		\| Gas Flow (sccm)
	\| SF<sub>6</sub> 38 + C<sub>4</sub>F<sub>8</sub> 70		\| SF<sub>6</sub> 38 + '''C<sub>4</sub>F<sub>8</sub> 70'''
	\|-		\|-
	\| Pressure (mT)		\| Pressure (mT)
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	\|-		\|-
	\| Coil power (W)		\| Coil power (W)
	\| 450		\| '''450'''
	\|-		\|-
	\| Matching (Forward/ Load)		\| Matching (Forward/ Load)
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	\|-		\|-
	\| HF Platen power (W)		\| HF Platen power (W)
	\| 100		\| '''100'''
	\|-		\|-
	\| Matching (Forward/ Load)		\| Matching (Forward/ Load)
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	\| 10°C		\| 10°C
	\|}		\|}

			The highlighted sections are the main differences between the Process C conditions Vs new Imprint Trenches conditions: all of the changes would push the process to be more passivant, less etch aggressive and more directional.

			Is there any reason why these conditions are not suitable for the Imprint Trenches etch?