Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation - Revision history

Mmat: /* Where have these numbers been used? */

2025-06-03T07:47:31Z

Where have these numbers been used?

← Older revision		Revision as of 09:47, 3 June 2025
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	=== Where have these numbers been used? ===		=== Where have these numbers been used? ===

	* [~~http://labadviser.danchip.dtu.dk/index.php/~~Specific_Process_Knowledge/Etch/DRIE-Pegasus/processA~~#Results:_Etched_depths_in_trenches_of_different_widths\| Investigation of Process A performance on Pegasus 1~~]		* [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/processA]]

Jmli: /* Where have these numbers been used? */

2025-02-03T09:38:08Z

Where have these numbers been used?

← Older revision		Revision as of 11:38, 3 February 2025
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	* [http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/processA#Results:_Etched_depths_in_trenches_of_different_widths\| Investigation of Process A performance on Pegasus 1]		* [http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/processA#Results:_Etched_depths_in_trenches_of_different_widths\| Investigation of Process A performance on Pegasus 1]


	~~[[File:S032384a006.jpg\|400px]]~~

Jmli: /* Where have these numbers been used? */

2025-02-03T09:28:52Z

Where have these numbers been used?

← Older revision		Revision as of 11:28, 3 February 2025
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	* [http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/processA#Results:_Etched_depths_in_trenches_of_different_widths\| Investigation of Process A performance on Pegasus 1]		* [http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/processA#Results:_Etched_depths_in_trenches_of_different_widths\| Investigation of Process A performance on Pegasus 1]


			[[File:S032384a006.jpg\|400px]]

Jmli: /* Using Matlab scripts */

2023-08-15T13:03:40Z

Using Matlab scripts

← Older revision		Revision as of 15:03, 15 August 2023
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	## Chamber conditioning, steps before the actual etch		## Chamber conditioning, steps before the actual etch
	## Wafer ID, Labmanager process log		## Wafer ID, Labmanager process log
	## Recipe, duration		## Recipe, duration, number of cycles
	## Comments		## Comments
	#		## Mask thickness before and after etch
			# '''Input images''': A list of SEM images (only tiff format images from Carl Zeiss SEM's that have a correct header can be used) is entered and measurement points are added to every image one by one.
			## The pixel size in the the SEM image is read from the tiff image header

	~~=== Input parameters ===~~

	~~'''At the SEM'''~~

	However, The only requirement is that the pixel size of every SEM image is known - one can add it to the datazone: See any SEM manual for instructions - for instance [http://labmanager.dtu.dk/d4Show.php?id=2180&mach=275#dafs29430 '''HERE''']

	'''Making measurements'''		'''Making measurements'''

Jmli: /* Characterization of DRIE silicon trenches */

2023-08-15T08:16:01Z

Characterization of DRIE silicon trenches

← Older revision		Revision as of 10:16, 15 August 2023
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	= Characterization of DRIE silicon trenches =		= Characterization of DRIE silicon trenches =
	Dry etched silicon trenches come in many sizes and shapes. In most cases the best way of characterizing them is to cleave the wafer perpendicularly to the trench and inspect the profile in an SEM or optical microscope. The SEM provides by far the best information as there are no challenges with limited depth of focus or image resolution. To make a complete data set with, say, variations trench widths as		Dry etched silicon trenches come in many sizes and shapes. In most cases the best way of characterizing them is to cleave the wafer perpendicularly to the trench and inspect the profile in an SEM or optical microscope. The SEM provides by far the best information as there are no challenges with limited depth of focus or image resolution. To make a complete data set with, say, variations trench widths or etch loads
	~~The~~ work of adding measurements to SEM images, collecting the data and making sure that it is complete is, however, tedious.		the work of adding measurements to SEM images, collecting the data and making sure that it is complete is, however, tedious. Instead of adding a ton of measurements to each SEM image while at the SEM and hence spend an unreasonable amount of time there, one can postpone making the measurements till afterwards by using a Matlab script as the one described below.

	== Using Matlab scripts ==		== Using Matlab scripts ==

	A Matlab script automating the measurements from SEM images has been developed. It follows the sequence:		A Matlab script automating the measurements from SEM images on etched trenches has been developed in the Matlab AppDesigner. It follows the sequence:
	# '''Input parameters''': The information ~~required in terms of~~		# '''Input parameters''': The information about the etch process can be entered manually or read from a text file.
	## Date		## Date
	## Wafer info: Substrate size, ~~conditions~~, mask material and thickness		## User
	## ~~Material etched~~, ~~exposed area~~		## Wafer info: Substrate size, material etched, etch load, mask material and thickness
	## Recipe:		## Chamber conditioning, steps before the actual etch
			## Wafer ID, Labmanager process log
	~~Many users make measurements using the annotations in the SEM. Either top view measurements of heights/widths or tilted samples~~		## Recipe, duration
			## Comments
			#

	=== Input parameters ===		=== Input parameters ===
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	'''At the SEM'''		'''At the SEM'''

	However, ~~instead of adding a ton of measurements to each SEM image while at the SEM and hence spend an unreasonable amount of time there, one can postpone making the measurements till afterwards.~~ The only requirement is that the pixel size of every SEM image is known - one can add it to the datazone: See any SEM manual for instructions - for instance [http://labmanager.dtu.dk/d4Show.php?id=2180&mach=275#dafs29430 '''HERE''']		However, The only requirement is that the pixel size of every SEM image is known - one can add it to the datazone: See any SEM manual for instructions - for instance [http://labmanager.dtu.dk/d4Show.php?id=2180&mach=275#dafs29430 '''HERE''']

	'''Making measurements'''		'''Making measurements'''

Jmli at 07:56, 15 August 2023

2023-08-15T07:56:58Z

← Older revision		Revision as of 09:56, 15 August 2023
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	<!-- Ok, jmli 20180629 -->		<!-- Ok, jmli 20180629 -->
	<!--Checked for updates on 5/10-2020 - ok/jmli -->		<!--Checked for updates on 5/10-2020 - ok/jmli -->
			<!--Checked for updates on 15/8-2023 - ok/jmli -->
			{{contentbydryetch}}

	'''Feedback to this page:		'''Feedback to this page:
	[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisaion click here]'''		[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisaion click here]'''

Jmli: /* Characterization of DRIE silicon trenches */

2023-05-03T13:56:01Z

Characterization of DRIE silicon trenches

← Older revision		Revision as of 15:56, 3 May 2023
Line 9:		Line 9:

	= Characterization of DRIE silicon trenches =		= Characterization of DRIE silicon trenches =
	Dry etched silicon trenches come in many sizes and shapes. In most cases the best way of characterizing them is to cleave the wafer perpendicularly to the trench and inspect the profile in an SEM or optical microscope. The SEM provides by far the best information as there are no challenges with limited depth of focus or image resolution. The work of adding measurements to SEM images, collecting the data and making sure that it is complete is, however, tedious.		Dry etched silicon trenches come in many sizes and shapes. In most cases the best way of characterizing them is to cleave the wafer perpendicularly to the trench and inspect the profile in an SEM or optical microscope. The SEM provides by far the best information as there are no challenges with limited depth of focus or image resolution. To make a complete data set with, say, variations trench widths as
			The work of adding measurements to SEM images, collecting the data and making sure that it is complete is, however, tedious.

	== Using Matlab scripts ==		== Using Matlab scripts ==

Jmli: /* Measurements */

2023-05-02T15:37:01Z

Measurements

← Older revision		Revision as of 17:37, 2 May 2023
Line 11:		Line 11:
	Dry etched silicon trenches come in many sizes and shapes. In most cases the best way of characterizing them is to cleave the wafer perpendicularly to the trench and inspect the profile in an SEM or optical microscope. The SEM provides by far the best information as there are no challenges with limited depth of focus or image resolution. The work of adding measurements to SEM images, collecting the data and making sure that it is complete is, however, tedious.		Dry etched silicon trenches come in many sizes and shapes. In most cases the best way of characterizing them is to cleave the wafer perpendicularly to the trench and inspect the profile in an SEM or optical microscope. The SEM provides by far the best information as there are no challenges with limited depth of focus or image resolution. The work of adding measurements to SEM images, collecting the data and making sure that it is complete is, however, tedious.

	== ~~Measurements~~ ==		== Using Matlab scripts ==

			A Matlab script automating the measurements from SEM images has been developed. It follows the sequence:
			# '''Input parameters''': The information required in terms of
			## Date
			## Wafer info: Substrate size, conditions, mask material and thickness
			## Material etched, exposed area
			## Recipe:

	Many users make measurements using the annotations in the SEM. Either top view measurements of heights/widths or tilted samples		Many users make measurements using the annotations in the SEM. Either top view measurements of heights/widths or tilted samples

Jmli: /* Characterization of DRIE silicon trenches */

2023-05-02T15:13:25Z

Characterization of DRIE silicon trenches

← Older revision		Revision as of 17:13, 2 May 2023
Line 9:		Line 9:

	= Characterization of DRIE silicon trenches =		= Characterization of DRIE silicon trenches =
	Dry etched silicon trenches come in many sizes and shapes. In most cases the best way of characterizing them is to cleave the wafer perpendicularly to the trench and inspect the profile in an SEM or optical microscope. The SEM provides by far the best information as there are no challenges with limited depth of focus or image resolution. The work of adding measurements to SEM images, collecting the data and making sure that it is complete is, however, tedious. ~~Often the time available on the SEM is limited. Below is an example with suggestions of possible measurements.~~		Dry etched silicon trenches come in many sizes and shapes. In most cases the best way of characterizing them is to cleave the wafer perpendicularly to the trench and inspect the profile in an SEM or optical microscope. The SEM provides by far the best information as there are no challenges with limited depth of focus or image resolution. The work of adding measurements to SEM images, collecting the data and making sure that it is complete is, however, tedious.

	~~[[File:etched profiles (3).PNG\|1000px]]~~

	== Measurements ==		== Measurements ==

Jmli: /* Characterization of DRIE silicon trenches */

2023-05-02T13:25:04Z

Characterization of DRIE silicon trenches

← Older revision		Revision as of 15:25, 2 May 2023
Line 9:		Line 9:

	= Characterization of DRIE silicon trenches =		= Characterization of DRIE silicon trenches =
	Dry etched silicon trenches come in many sizes and shapes. In most cases the best way of characterizing them is to cleave the wafer ~~perpendicular~~ to the trench and inspect the profile in an SEM or optical microscope. ~~In the~~ SEM ~~the challenge is to get~~ the best information ~~possible about the profile in~~ as ~~little time as possible~~. The ~~information acquired must be simple~~ and ~~useful~~. Below is an example.		Dry etched silicon trenches come in many sizes and shapes. In most cases the best way of characterizing them is to cleave the wafer perpendicularly to the trench and inspect the profile in an SEM or optical microscope. The SEM provides by far the best information as there are no challenges with limited depth of focus or image resolution. The work of adding measurements to SEM images, collecting the data and making sure that it is complete is, however, tedious. Often the time available on the SEM is limited. Below is an example with suggestions of possible measurements.

	[[File:etched profiles (3).PNG\|1000px]]		[[File:etched profiles (3).PNG\|1000px]]