Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/SiO2 Etch/Cr mask - Revision history

Mmat at 21:33, 16 June 2025

2025-06-16T21:33:17Z

← Older revision		Revision as of 23:33, 16 June 2025
Line 4:		Line 4:
	=SiO2 trench etching with Cr mask=		=SiO2 trench etching with Cr mask=

	~~[[test12]]~~

	{\| border="2" cellspacing="2" cellpadding="3"		{\| border="2" cellspacing="2" cellpadding="3"

Bghe: /* Profile SEM images */

2025-03-27T10:28:57Z

Profile SEM images

← Older revision		Revision as of 12:28, 27 March 2025
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	*Pressure:Fully open APC valve (<2 mTorr)		*Pressure:Fully open APC valve (<2 mTorr)
	*Electromagnetic coils (EM) 'outer coil' / 'inner coil':'0 A' / '0 A'		*Electromagnetic coils (EM) 'outer coil' / 'inner coil':'0 A' / '0 A'
	\|After some major chemical cleans I could not repeat the results of C10834. I need to increase the ~~C4H8~~ to fairly match the results		\|After some major chemical cleans I could not repeat the results of C10834. I need to increase the C4F8 to fairly match the results
	\|		\|
	<gallery caption=" C12508: SiO2 etch with Cr mask on wafer piece on Si carrier 50 min etch, EM:0/0 H2:0sccm, C4F8:11.5sccm He:100sccm O2:10sccm, Pressure:?mTorr; platen power 25W, coil power:300W" perrow="6" widths="200px" heights="150px">		<gallery caption=" C12508: SiO2 etch with Cr mask on wafer piece on Si carrier 50 min etch, EM:0/0 H2:0sccm, C4F8:11.5sccm He:100sccm O2:10sccm, Pressure:?mTorr; platen power 25W, coil power:300W" perrow="6" widths="200px" heights="150px">

Bghe: /* Profile SEM images */

2025-02-10T05:58:53Z

Profile SEM images

← Older revision		Revision as of 07:58, 10 February 2025
Line 607:		Line 607:
	*Pressure:Fully open APC valve (<2 mTorr)		*Pressure:Fully open APC valve (<2 mTorr)
	*Electromagnetic coils (EM) 'outer coil' / 'inner coil':'0 A' / '0 A'		*Electromagnetic coils (EM) 'outer coil' / 'inner coil':'0 A' / '0 A'
	\|~~Decreased~~ the ~~platen power a little~~ to ~~see if this could remove~~ the ~~trenching. Not much different from~~ the ~~last.~~		\|After some major chemical cleans I could not repeat the results of C10834. I need to increase the C4H8 to fairly match the results
	\|		\|
	<gallery caption=" C12508: SiO2 etch with Cr mask on wafer piece on Si carrier 50 min etch, EM:0/0 H2:0sccm, C4F8:11.5sccm He:100sccm O2:10sccm, Pressure:?mTorr; platen power 25W, coil power:300W" perrow="6" widths="200px" heights="150px">		<gallery caption=" C12508: SiO2 etch with Cr mask on wafer piece on Si carrier 50 min etch, EM:0/0 H2:0sccm, C4F8:11.5sccm He:100sccm O2:10sccm, Pressure:?mTorr; platen power 25W, coil power:300W" perrow="6" widths="200px" heights="150px">

Bghe: /* Profile SEM images */

2025-02-10T05:54:42Z

Profile SEM images

@@ Line 595: / Line 595: @@
 File:C10844_13.jpg
 </gallery>
 <gallery caption=" C12508: SiO2 etch with Cr mask on wafer piece on Si carrier 50 min etch, EM:0/0 H2:0sccm, C4F8:11.5sccm He:100sccm O2:10sccm, Pressure:?mTorr; platen power 25W, coil power:300W" perrow="6" widths="200px" heights="150px">
 File:C12508_03__14.jpg
@@ Line 606: / Line 618: @@
 File:C12508_03__12.jpg
 </gallery>

Bghe: /* Profile SEM images */

2025-02-10T05:53:03Z

Profile SEM images

← Older revision		Revision as of 07:53, 10 February 2025
Line 597:		Line 597:
	\|}		\|}

	~~TEST~~:		<gallery caption=" C12508: SiO2 etch with Cr mask on wafer piece on Si carrier 50 min etch, EM:0/0 H2:0sccm, C4F8:11.5sccm He:100sccm O2:10sccm, Pressure:?mTorr; platen power 25W, coil power:300W" perrow="6" widths="200px" heights="150px">
	[[File:~~C12332_06~~.jpg~~\|400px]]~~		File:C12508_03__14.jpg
			File:C12508_03__02.jpg
			File:C12508_03__04.jpg
			File:C12508_03__06.jpg
			File:C12508_03__07.jpg
			File:C12508_03__09.jpg
			File:C12508_03__12.jpg
			</gallery>

Bghe: /* Results */

2024-10-29T13:54:10Z

Results

← Older revision		Revision as of 15:54, 29 October 2024
Line 411:		Line 411:
	File:C010184tilt20plasmaO2_07.jpg\| tilt 20 degrees		File:C010184tilt20plasmaO2_07.jpg\| tilt 20 degrees
	File:C010184tilt20plasmaO2_05.jpg\| tilt 20 degrees		File:C010184tilt20plasmaO2_05.jpg\| tilt 20 degrees
	~~</gallery>[[~~File:C1018405.jpg\|~~thumb~~\|After RCA clean]]		File:C1018405.jpg\|After RCA clean
			File:C1018402.jpg\|After RCA clean
			File:C1018403.jpg\|After RCA clean
			</gallery>
	\|- style="vertical-align:top;"		\|- style="vertical-align:top;"
	\|		\|

Bghe: /* Results */

2024-10-29T13:45:41Z

Results

← Older revision		Revision as of 15:45, 29 October 2024
Line 411:		Line 411:
	File:C010184tilt20plasmaO2_07.jpg\| tilt 20 degrees		File:C010184tilt20plasmaO2_07.jpg\| tilt 20 degrees
	File:C010184tilt20plasmaO2_05.jpg\| tilt 20 degrees		File:C010184tilt20plasmaO2_05.jpg\| tilt 20 degrees
	</gallery>		</gallery>[[File:C1018405.jpg\|thumb\|After RCA clean]]
	\|- style="vertical-align:top;"		\|- style="vertical-align:top;"
	\|		\|

Bghe at 13:29, 30 September 2024

2024-09-30T13:29:30Z

← Older revision		Revision as of 15:29, 30 September 2024
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	</gallery>		</gallery>
	\|}		\|}

			TEST:
			[[File:C12332_06.jpg\|400px]]

Bghe: /* Profile SEM images */

2024-09-24T09:45:10Z

Profile SEM images

← Older revision		Revision as of 11:45, 24 September 2024
Line 397:		Line 397:
	\|Repeating the 1200W/100W recipes at 14 min but without the EM coils. For this recipe the uniformity over the wafer improved from removing the EM coils, so no need for those and now the recipe could run 14 min without damaging the hardware. The profile looked as before. After removing the Cr I looked from the top and with a tilted view and saw the the sidewall roughness was very bad.		\|Repeating the 1200W/100W recipes at 14 min but without the EM coils. For this recipe the uniformity over the wafer improved from removing the EM coils, so no need for those and now the recipe could run 14 min without damaging the hardware. The profile looked as before. After removing the Cr I looked from the top and with a tilted view and saw the the sidewall roughness was very bad.
	\|		\|
	<gallery perrow="7" widths="200px" heights="150px" caption="~~this one !~~ SiO2 etch with Cr mask on wafer piece on Si carrier 14 min etch, EM:0/0 H2:0sccm, C4F8:13sccm He:205sccm O2:20sccm, Pressure:3.9mTorr; platen power 100W, coil power:1200W">		<gallery perrow="7" widths="200px" heights="150px" caption="C10184: SiO2 etch with Cr mask on wafer piece on Si carrier 14 min etch, EM:0/0 H2:0sccm, C4F8:13sccm He:205sccm O2:20sccm, Pressure:3.9mTorr; platen power 100W, coil power:1200W">
	File:C10184_01.jpg		File:C10184_01.jpg
	File:C10184_05.jpg		File:C10184_05.jpg

Bghe: /* Results */

2024-09-24T09:43:44Z

Results

← Older revision		Revision as of 11:43, 24 September 2024
Line 397:		Line 397:
	\|Repeating the 1200W/100W recipes at 14 min but without the EM coils. For this recipe the uniformity over the wafer improved from removing the EM coils, so no need for those and now the recipe could run 14 min without damaging the hardware. The profile looked as before. After removing the Cr I looked from the top and with a tilted view and saw the the sidewall roughness was very bad.		\|Repeating the 1200W/100W recipes at 14 min but without the EM coils. For this recipe the uniformity over the wafer improved from removing the EM coils, so no need for those and now the recipe could run 14 min without damaging the hardware. The profile looked as before. After removing the Cr I looked from the top and with a tilted view and saw the the sidewall roughness was very bad.
	\|		\|
	<gallery caption="SiO2 etch with Cr mask on wafer piece on Si carrier 14 min etch, EM:0/0 H2:0sccm, C4F8:13sccm He:205sccm O2:20sccm, Pressure:3.9mTorr; platen power 100W, coil power:1200W~~" perrow="7" widths="200px" heights="150px~~">		<gallery perrow="7" widths="200px" heights="150px" caption="this one ! SiO2 etch with Cr mask on wafer piece on Si carrier 14 min etch, EM:0/0 H2:0sccm, C4F8:13sccm He:205sccm O2:20sccm, Pressure:3.9mTorr; platen power 100W, coil power:1200W">
	File:C10184_01.jpg		File:C10184_01.jpg
	File:C10184_05.jpg		File:C10184_05.jpg

← Older revision		Revision as of 15:54, 29 October 2024
Line 411:		Line 411:
	File:C010184tilt20plasmaO2_07.jpg\| tilt 20 degrees		File:C010184tilt20plasmaO2_07.jpg\| tilt 20 degrees
	File:C010184tilt20plasmaO2_05.jpg\| tilt 20 degrees		File:C010184tilt20plasmaO2_05.jpg\| tilt 20 degrees
	~~</gallery>[[~~File:C1018405.jpg\|~~thumb~~\|After RCA clean]]		File:C1018405.jpg\|After RCA clean
			File:C1018402.jpg\|After RCA clean
			File:C1018403.jpg\|After RCA clean
			</gallery>
	\|- style="vertical-align:top;"		\|- style="vertical-align:top;"
	\|		\|