Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4 - Revision history

Bghe: /* Process information */

2025-07-14T12:16:25Z

Process information

← Older revision		Revision as of 14:16, 14 July 2025
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	*[[/Barc Etch\|Barc Etch]]		*[[/Barc Etch\|Barc Etch]]
	*[[/SiO2 Etch\|SiO2 Etch]]		*[[/SiO2 Etch\|SiO2 Etch]]
			*[[/Silicon Nitride Etch\|Silicon Nitride Etch]]
	*[[/Nitride Etch\|Nitride etch with SiO2 etch recipes]]		*[[/Nitride Etch\|Nitride etch with SiO2 etch recipes]]
	*[[/Slow etch\|Slow etch of silicon nitride and silicon oxide]]		*[[/Slow etch\|Slow etch of silicon nitride and silicon oxide]]

Mmat at 14:19, 16 June 2025

2025-06-16T14:19:52Z

← Older revision		Revision as of 16:19, 16 June 2025
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			{{cc-nanolab}}

	'''Feedback to this page:		'''Feedback to this page:
	[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-4 click here]'''		[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-4 click here]'''
	[[Category: Equipment \|Etch DRIE]]		[[Category: Equipment \|Etch DRIE]]
	[[Category: Etch (Dry) Equipment\|DRIE]]		[[Category: Etch (Dry) Equipment\|DRIE]]
	<br> ~~{{CC1}}~~		<br>

	==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==		==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==

Bghe: /* Pegasus 4 - 150mm silicon oxide and silicon nitride etching */

2023-08-22T09:38:53Z

Pegasus 4 - 150mm silicon oxide and silicon nitride etching

← Older revision		Revision as of 11:38, 22 August 2023
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	==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==		==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==
	[[Image:Peg3and4 front 2.JPG \|frame\|right\|~~x300px~~\|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]		[[Image:Peg3and4 front 2.JPG \|frame\|right\|x250px\|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]

	DRIE-Pegasus 4 is dedicated Silicon oxide and Silicon nitride etching. It is originally designed for silicon etching but gas mass flow controllers has been changed to optimize silicon oxide and silicon nitride etching. The system is setup for 6" wafers. Sampler samples has to be bonded to a 6" carrier to be etched in the system.		DRIE-Pegasus 4 is dedicated Silicon oxide and Silicon nitride etching. It is originally designed for silicon etching but gas mass flow controllers has been changed to optimize silicon oxide and silicon nitride etching. The system is setup for 6" wafers. Sampler samples has to be bonded to a 6" carrier to be etched in the system.

Bghe: /* Pegasus 4 - 150mm silicon oxide and silicon nitride etching */

2023-08-22T09:38:07Z

Pegasus 4 - 150mm silicon oxide and silicon nitride etching

← Older revision		Revision as of 11:38, 22 August 2023
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	==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==		==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==
			[[Image:Peg3and4 front 2.JPG \|frame\|right\|x300px\|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]

	DRIE-Pegasus 4 is dedicated Silicon oxide and Silicon nitride etching. It is originally designed for silicon etching but gas mass flow controllers has been changed to optimize silicon oxide and silicon nitride etching. The system is setup for 6" wafers. Sampler samples has to be bonded to a 6" carrier to be etched in the system.		DRIE-Pegasus 4 is dedicated Silicon oxide and Silicon nitride etching. It is originally designed for silicon etching but gas mass flow controllers has been changed to optimize silicon oxide and silicon nitride etching. The system is setup for 6" wafers. Sampler samples has to be bonded to a 6" carrier to be etched in the system.

	~~[[Image:Peg3and4 front 2.JPG \|frame\|right\|x300px\|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]~~

	'''The user manual and contact information can be found in LabManager:'''		'''The user manual and contact information can be found in LabManager:'''

Bghe: /* Pegasus 4 - 150mm silicon oxide and silicon nitride etching */

2023-08-22T09:37:34Z

Pegasus 4 - 150mm silicon oxide and silicon nitride etching

← Older revision		Revision as of 11:37, 22 August 2023
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	==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==		==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==
			DRIE-Pegasus 4 is dedicated Silicon oxide and Silicon nitride etching. It is originally designed for silicon etching but gas mass flow controllers has been changed to optimize silicon oxide and silicon nitride etching. The system is setup for 6" wafers. Sampler samples has to be bonded to a 6" carrier to be etched in the system.

	[[Image:Peg3and4 front 2.JPG \|frame\|right\|x300px\|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]		[[Image:Peg3and4 front 2.JPG \|frame\|right\|x300px\|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]

Bghe: /* Pegasus 4 - 150mm silicon oxide and silicon nitride etching */

2023-08-22T09:33:17Z

Pegasus 4 - 150mm silicon oxide and silicon nitride etching

← Older revision		Revision as of 11:33, 22 August 2023
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	[[Image:Peg3and4 front 2.JPG \|frame\|~~left~~\|x300px\|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]		[[Image:Peg3and4 front 2.JPG \|frame\|right\|x300px\|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]

	'''The user manual and contact information can be found in LabManager:'''		'''The user manual and contact information can be found in LabManager:'''

Bghe: /* Process information */

2023-08-22T09:28:47Z

Process information

← Older revision		Revision as of 11:28, 22 August 2023
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	*[[/Barc Etch\|Barc Etch]]		*[[/Barc Etch\|Barc Etch]]
	*[[/SiO2 Etch\|SiO2 Etch]]		*[[/SiO2 Etch\|SiO2 Etch]]
			*[[/Nitride Etch\|Nitride etch with SiO2 etch recipes]]
	*[[/Slow etch\|Slow etch of silicon nitride and silicon oxide]]		*[[/Slow etch\|Slow etch of silicon nitride and silicon oxide]]

Bghe: /* Process information */

2023-08-22T07:35:08Z

Process information

← Older revision		Revision as of 09:35, 22 August 2023
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	*[[/Slow etch\|Slow etch of silicon nitride and silicon oxide]]		*[[/Slow etch\|Slow etch of silicon nitride and silicon oxide]]

	~~'''Hardware changes'''~~

	~~A few hardware modifications have been made on the Pegasus 3/4 since it was installed in 2019. The changes are listed below.~~

	*[[Specific Process Knowledge/Etch/DRIE-Pegasus 4/showerheadchange\|Change of showerhead in 2019]]

Bghe: /* Pegasus 4 - 150mm silicon oxide and silicon nitride etching */

2023-08-22T07:32:57Z

Pegasus 4 - 150mm silicon oxide and silicon nitride etching

← Older revision		Revision as of 09:32, 22 August 2023
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	<!-- give the link to the equipment info page in LabManager: -->		<!-- give the link to the equipment info page in LabManager: -->
	[http://labmanager~~.nanolab~~.dtu.dk/function.php?module=Machine&view=view&mach=456 DRIE Pegasus 4 in LabManager - requires login]		[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=456 DRIE Pegasus 4 in LabManager - requires login]

	== Process information ==		== Process information ==

Bghe: /* Pegasus 4 - 150mm silicon oxide and silicon nitride etching */

2023-08-22T07:32:27Z

Pegasus 4 - 150mm silicon oxide and silicon nitride etching

← Older revision		Revision as of 09:32, 22 August 2023
Line 10:		Line 10:
	[[Image:Peg3and4 front 2.JPG \|frame\|left\|x300px\|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]		[[Image:Peg3and4 front 2.JPG \|frame\|left\|x300px\|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]

			'''The user manual and contact information can be found in LabManager:'''

	~~The user manual(s), quality control procedure(s) and results, user APV(s) '''are not available''', technical information and contact information can be found~~ in LabManager:		<!-- give the link to the equipment info page in LabManager: -->
			[http://labmanager.nanolab.dtu.dk/function.php?module=Machine&view=view&mach=456 DRIE Pegasus 4 in LabManager - requires login]
	~~Equipment info in~~ [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=456\| LabManager]

	== Process information ==		== Process information ==

← Older revision		Revision as of 14:16, 14 July 2025
Line 24:		Line 24:
	*[[/Barc Etch\|Barc Etch]]		*[[/Barc Etch\|Barc Etch]]
	*[[/SiO2 Etch\|SiO2 Etch]]		*[[/SiO2 Etch\|SiO2 Etch]]
			*[[/Silicon Nitride Etch\|Silicon Nitride Etch]]
	*[[/Nitride Etch\|Nitride etch with SiO2 etch recipes]]		*[[/Nitride Etch\|Nitride etch with SiO2 etch recipes]]
	*[[/Slow etch\|Slow etch of silicon nitride and silicon oxide]]		*[[/Slow etch\|Slow etch of silicon nitride and silicon oxide]]

← Older revision		Revision as of 11:28, 22 August 2023
Line 22:		Line 22:
	*[[/Barc Etch\|Barc Etch]]		*[[/Barc Etch\|Barc Etch]]
	*[[/SiO2 Etch\|SiO2 Etch]]		*[[/SiO2 Etch\|SiO2 Etch]]
			*[[/Nitride Etch\|Nitride etch with SiO2 etch recipes]]
	*[[/Slow etch\|Slow etch of silicon nitride and silicon oxide]]		*[[/Slow etch\|Slow etch of silicon nitride and silicon oxide]]