Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/SiO2 etch - Revision history

Bghe at 10:34, 5 February 2026

2026-02-05T10:34:50Z

← Older revision		Revision as of 12:34, 5 February 2026
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	Pegasus 3 is not meant to be used as an SiO2 etcher. Please do not develop SiO2 recipes on this machine. Often SiO2 etch recipes are very polymerizing and that can disturb the chamber conditions for the silicon etching recipes.		Pegasus 3 is not meant to be used as an SiO2 etcher. Please do not develop SiO2 recipes on this machine. Often SiO2 etch recipes are very polymerizing and that can disturb the chamber conditions for the silicon etching recipes.

	The recipe developed here is only for etching through a very thin SiO2 layer and does not have a high selectivity to silicon to avoid the recipe ~~to become~~ too polymerizing. It is also not very uniform over the wafer, so when it is used for etching down to silicon it will also etch a lot in the silicon and in areas more than other.		The recipe developed here is only for etching through a very thin SiO2 layer and does not have a high selectivity to silicon. This is to avoid the recipe from becoming too polymerizing. It is also not very uniform over the wafer, so when it is used for etching down to silicon it will also etch a lot in the silicon and in areas more than other.

	==Test work done==		==Test work done==

2024-01-29T16:02:39Z

Etching of very thin layer of SiO2

← Older revision		Revision as of 18:02, 29 January 2024
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	! SiO2 etch rate uniformity !! SiO2 etch rate uniformity normalized to center!! Si Etch rate uniformity		! SiO2 etch rate uniformity !! SiO2 etch rate uniformity normalized to center!! Si Etch rate uniformity
	\|-		\|-
	\| [[File:Peg3 SiO2 uniformity Y34 to Y40.jpg]] \|\| [[File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg]] \|\| [[File:Peg3 Si etch uniformity Y38 and Y40.jpg]]		\| [[File:Peg3 SiO2 uniformity Y34 to Y40.jpg]] \|\| [[File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg]] \|\| valign="top"\| [[File:Peg3 Si etch uniformity Y38 and Y40.jpg]]
	\|}		\|}

2024-01-25T14:03:32Z

← Older revision		Revision as of 16:03, 25 January 2024
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	\|}		\|}

			{\| class="wikitable"
	~~<gallery caption~~="Etch rate uniformity~~" widths="400px" heights="2000px" perrow="3">~~		\|+ Etch uniformity
	File:Peg3 SiO2 uniformity Y34 to Y40.jpg		\|-
	File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg		! SiO2 etch rate uniformity !! SiO2 etch rate uniformity normalized to center!! Si Etch rate uniformity
	File:Peg3 Si etch uniformity Y38 and Y40.jpg		\|-
	~~</gallery>~~		\| [[File:Peg3 SiO2 uniformity Y34 to Y40.jpg]] \|\| [[File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg]] \|\| [[File:Peg3 Si etch uniformity Y38 and Y40.jpg]]
			\|}

2024-01-25T13:57:29Z

Test work done

← Older revision		Revision as of 15:57, 25 January 2024
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	<gallery caption="Etch rate uniformity" perrow="3">		<gallery caption="Etch rate uniformity" widths="400px" heights="2000px" perrow="3">
	File:Peg3 SiO2 uniformity Y34 to Y40.jpg		File:Peg3 SiO2 uniformity Y34 to Y40.jpg
	File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg		File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg
	File:Peg3 Si etch uniformity Y38 and Y40.jpg		File:Peg3 Si etch uniformity Y38 and Y40.jpg
	</gallery>		</gallery>

2024-01-25T13:54:16Z

Test work done

← Older revision		Revision as of 15:54, 25 January 2024
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	<gallery>		<gallery caption="Etch rate uniformity" perrow="3">
	File:Peg3 SiO2 uniformity Y34 to Y40.jpg		File:Peg3 SiO2 uniformity Y34 to Y40.jpg
	File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg		File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg
	File:Peg3 Si etch uniformity Y38 and Y40.jpg		File:Peg3 Si etch uniformity Y38 and Y40.jpg
	</gallery>		</gallery>

2024-01-25T13:52:36Z

Test work done

← Older revision		Revision as of 15:52, 25 January 2024
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	\| Y40 \|\| 8.33 sccm\|\| 50 sccm\|\| 100 sccm\|\| 100 W \|\| 10 mTorr \|\| ±15.1% \|\| 35.8 n/min (lowest)\|\| 70.8@15s, 107.5@5min \|\| ± 17.6%@15s, ± 11.1%@4min		\| Y40 \|\| 8.33 sccm\|\| 50 sccm\|\| 100 sccm\|\| 100 W \|\| 10 mTorr \|\| ±15.1% \|\| 35.8 n/min (lowest)\|\| 70.8@15s, 107.5@5min \|\| ± 17.6%@15s, ± 11.1%@4min
	\|}		\|}


	<gallery>		<gallery>

2024-01-25T13:52:03Z

Test work done

← Older revision		Revision as of 15:52, 25 January 2024
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	\| Y40 \|\| 8.33 sccm\|\| 50 sccm\|\| 100 sccm\|\| 100 W \|\| 10 mTorr \|\| ±15.1% \|\| 35.8 n/min (lowest)\|\| 70.8@15s, 107.5@5min \|\| ± 17.6%@15s, ± 11.1%@4min		\| Y40 \|\| 8.33 sccm\|\| 50 sccm\|\| 100 sccm\|\| 100 W \|\| 10 mTorr \|\| ±15.1% \|\| 35.8 n/min (lowest)\|\| 70.8@15s, 107.5@5min \|\| ± 17.6%@15s, ± 11.1%@4min
	\|}		\|}

	<gallery>		<gallery>
	[[File:Peg3 SiO2 uniformity Y34 to Y40.jpg~~\|400px]]~~		File:Peg3 SiO2 uniformity Y34 to Y40.jpg
	[[File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg~~\|400px]]~~		File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg
	[[File:Peg3 Si etch uniformity Y38 and Y40.jpg~~\|400px]]~~		File:Peg3 Si etch uniformity Y38 and Y40.jpg
	</gallery>		</gallery>

2024-01-25T13:51:00Z

Test work done

← Older revision		Revision as of 15:51, 25 January 2024
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	\| Y40 \|\| 8.33 sccm\|\| 50 sccm\|\| 100 sccm\|\| 100 W \|\| 10 mTorr \|\| ±15.1% \|\| 35.8 n/min (lowest)\|\| 70.8@15s, 107.5@5min \|\| ± 17.6%@15s, ± 11.1%@4min		\| Y40 \|\| 8.33 sccm\|\| 50 sccm\|\| 100 sccm\|\| 100 W \|\| 10 mTorr \|\| ±15.1% \|\| 35.8 n/min (lowest)\|\| 70.8@15s, 107.5@5min \|\| ± 17.6%@15s, ± 11.1%@4min
	\|}		\|}
			<gallery>
	[[File:Peg3 SiO2 uniformity Y34 to Y40.jpg\|400px]]		[[File:Peg3 SiO2 uniformity Y34 to Y40.jpg\|400px]]
	[[File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg\|400px]]		[[File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg\|400px]]
	[[File:Peg3 Si etch uniformity Y38 and Y40.jpg\|400px]]		[[File:Peg3 Si etch uniformity Y38 and Y40.jpg\|400px]]
			</gallery>

2024-01-25T13:48:38Z

Test work done

← Older revision		Revision as of 15:48, 25 January 2024
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	[[File:Peg3 SiO2 uniformity Y34 to Y40.jpg\|400px]]		[[File:Peg3 SiO2 uniformity Y34 to Y40.jpg\|400px]]
	[[File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg\|400px]]		[[File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg\|400px]]
			[[File:Peg3 Si etch uniformity Y38 and Y40.jpg\|400px]]

2024-01-25T13:45:16Z

Test work done

← Older revision		Revision as of 15:45, 25 January 2024
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	\| Y37 \|\|25 sccm\|\| 75 sccm\|\| 0 sccm\|\| 100 W \|\| 40 mTorr \|\| ±24.6% \|\| 24.4 nm/min (lowest) \|\| \|\|		\| Y37 \|\|25 sccm\|\| 75 sccm\|\| 0 sccm\|\| 100 W \|\| 40 mTorr \|\| ±24.6% \|\| 24.4 nm/min (lowest) \|\| \|\|
	\|-		\|-
	\| Y38 \|\| 25 sccm\|\| 75 sccm\|\| 0 sccm\|\| 100 W \|\| 60 mTorr \|\| ± 8.1% \|\| 34.0 nm/min (highest in center and at edge) \|\| 141.4@15s, 137.5@2min \|\| ± 13.9%@15s, 16.5%@2min		\| Y38 \|\| 25 sccm\|\| 75 sccm\|\| 0 sccm\|\| 100 W \|\| 60 mTorr \|\| ± 8.1% \|\| 34.0 nm/min (highest in center and at edge) \|\| 141.4@15s, 137.5@2min \|\| ± 13.9%@15s, ± 16.5%@2min
	\|-		\|-
	\| Y39 \|\| 50 sccm\|\| 150 sccm\|\| 0 sccm\|\| 100 W \|\| 10 mTorr \|\| ±25.0% \|\| 34.8 nm/min (lowest)		\| Y39 \|\| 50 sccm\|\| 150 sccm\|\| 0 sccm\|\| 100 W \|\| 10 mTorr \|\| ±25.0% \|\| 34.8 nm/min (lowest)\|\| \|\|
	\|-		\|-
	\| Y40 \|\| 8.33 sccm\|\| 50 sccm\|\| 100 sccm\|\| 100 W \|\| 10 mTorr \|\| ±15.1% \|\| 35.8 n/min (lowest)		\| Y40 \|\| 8.33 sccm\|\| 50 sccm\|\| 100 sccm\|\| 100 W \|\| 10 mTorr \|\| ±15.1% \|\| 35.8 n/min (lowest)\|\| 70.8@15s, 107.5@5min \|\| ± 17.6%@15s, ± 11.1%@4min
	\|}		\|}
	[[File:Peg3 SiO2 uniformity Y34 to Y40.jpg\|400px]]		[[File:Peg3 SiO2 uniformity Y34 to Y40.jpg\|400px]]
	[[File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg\|400px]]		[[File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg\|400px]]

← Older revision		Revision as of 15:48, 25 January 2024
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	[[File:Peg3 SiO2 uniformity Y34 to Y40.jpg\|400px]]		[[File:Peg3 SiO2 uniformity Y34 to Y40.jpg\|400px]]
	[[File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg\|400px]]		[[File:Peg3 SiO2 uniformity normalized Y34 to Y40.jpg\|400px]]
			[[File:Peg3 Si etch uniformity Y38 and Y40.jpg\|400px]]