Specific Process Knowledge/Etch/DRIE-Pegasus/Etch 3 dimensional silicon microstructures - Revision history

Jmli at 06:41, 4 April 2025

2025-04-04T06:41:45Z

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Jmli at 09:21, 9 August 2022

2022-08-09T09:21:40Z

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	* ''This work was done by Henri Jansen and Bingdong Chang in 2017;''		* ''This work was done by Henri Jansen and Bingdong Chang in 2017;''

Jmli at 14:32, 20 January 2020

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Bghe at 11:52, 26 October 2017

2017-10-26T11:52:25Z

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	* ''This work was done by Henri Jansen and Bingdong Chang in 2017;''		* ''This work was done by Henri Jansen and Bingdong Chang in 2017;''

Bghe at 11:44, 26 October 2017

2017-10-26T11:44:29Z

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	* ''This work was done by Henri Jansen and Bingdong Chang in 2017;''		* ''This work was done by Henri Jansen and Bingdong Chang in 2017;''

Bghe: Created page with "* ''This work was done by Henri Jansen and Bingdong Chang in 2017;'' * ''This page was last edited by Bingdong Chang 24 October 2017.'' By combining anisotropic Bosch proc..."

2017-10-26T11:36:40Z

Created page with "* ''This work was done by Henri Jansen and Bingdong Chang in 2017;'' * ''This page was last edited by Bingdong Chang 24 October 2017.'' By combining anisotropic Bosch proc..."

New page

* ''This work was done by Henri Jansen and Bingdong Chang in 2017;''

* ''This page was last edited by Bingdong Chang 24 October 2017.''

By combining anisotropic Bosch process and isotropic etch process, 3 dimensional structures can be fabricated using DRIE-Pegasus, below is an example to show how 3D "sausage-chain-like" micropillars can be achieved. The patterns were defined with DUV lithography (1µm diameter structures with 2µm pitch size), the resist used was 750nm KRF M230Y positive DUV resist.

<gallery caption="Recipe to achieve sausage-chain-like micropillars" widths="400" heights="300" perrow="2">
image: 3Drecipe.jpg
image: 3Drecipe1.jpg
</gallery>

<gallery caption="SEM images of 3D sausage-chain-like micropillars" widths="400" heights="300" perrow="2">
image: 3Dstructures1.png
image: 3Dstructures2.png
</gallery>

Using the similar methods, other types of 3D microstructures can be fabricated, below are some silicon structures etched with UV resist as a mask, the lithography step was performed with Aligner Maskless, with 1.5µm thick AZ nlof negative resist or 1.5µm AZ 5214 positive resist.

<gallery caption="SEM images of other kinds of 3D silicon microstructures" widths="400" heights="300" perrow="2">
image: 3Dstructures3.png
image: 3Dstructures4.png
image: 3Dstructures5.png
image: 3Dstructures6.png
</gallery>

For more details, please contact Henri Jansen (henrija@dtu.dk) or Bingdong Chang (bincha@dtu.dk)