Specific Process Knowledge/Etch/DRIE-Pegasus/DREM - Revision history

Jmli: /* DREM 2kW micro */

2024-11-20T08:20:17Z

DREM 2kW micro

← Older revision		Revision as of 10:20, 20 November 2024
Line 20:		Line 20:
	\|PressureDepDelay= \|PressureDepBoost= \|PressureDepMain=100%		\|PressureDepDelay= \|PressureDepBoost= \|PressureDepMain=100%
	\|PressureEtchDelay= \|PressureEtchBoost= \|PressureEtchMain=100%		\|PressureEtchDelay= \|PressureEtchBoost= \|PressureEtchMain=100%
	\|C4F8DepDelay=0.3@5 \|C4F8DepBoost= 0.5@50 \|C4F8DepMain=200		\|C4F8DepDelay=0.3@5 \|C4F8DepBoost= 0.5@ 50 \|C4F8DepMain=200
	\|C4F8EtchDelay=0.5@ 100 \|C4F8EtchBoost= \|C4F8EtchMain=5		\|C4F8EtchDelay=0.5@ 100 \|C4F8EtchBoost= \|C4F8EtchMain=5
	\|SF6DepDelay=0.3@ 200 \|SF6DepBoost=0.5@ 200 \|SF6DepMain=15		\|SF6DepDelay=0.3@ 200 \|SF6DepBoost=0.5@ 200 \|SF6DepMain=15

Jmli: /* DREM 2kW micro */

2024-11-20T08:19:48Z

DREM 2kW micro

← Older revision		Revision as of 10:19, 20 November 2024
Line 21:		Line 21:
	\|PressureEtchDelay= \|PressureEtchBoost= \|PressureEtchMain=100%		\|PressureEtchDelay= \|PressureEtchBoost= \|PressureEtchMain=100%
	\|C4F8DepDelay=0.3@5 \|C4F8DepBoost= 0.5@50 \|C4F8DepMain=200		\|C4F8DepDelay=0.3@5 \|C4F8DepBoost= 0.5@50 \|C4F8DepMain=200
	\|C4F8EtchDelay=0.5@100 \|C4F8EtchBoost= \|C4F8EtchMain=5		\|C4F8EtchDelay=0.5@ 100 \|C4F8EtchBoost= \|C4F8EtchMain=5
	\|SF6DepDelay=0.3@200 \|SF6DepBoost=0.5@200 \|SF6DepMain=15		\|SF6DepDelay=0.3@ 200 \|SF6DepBoost=0.5@ 200 \|SF6DepMain=15
	\|SF6EtchDelay=2@15 \|SF6EtchBoost=0.3@100 \|SF6EtchMain=200		\|SF6EtchDelay=2@ 15 \|SF6EtchBoost=0.3@ 100 \|SF6EtchMain=200
	\|O2Dep= \|O2Etch= \|ArDep=150 \|ArEtch=150		\|O2Dep= \|O2Etch= \|ArDep=150 \|ArEtch=150
	\|WCoilDep=2 \|WCoilEtch=2 \|WPlatenDep=1		\|WCoilDep=2 \|WCoilEtch=2 \|WPlatenDep=1
	\|WPlatenEtchDelay=1@1 \|WPlatenEtchBoost=1@100 \|WPlatenEtchMain=1		\|WPlatenEtchDelay=1@1 \|WPlatenEtchBoost=1@ 100 \|WPlatenEtchMain=1
	\|WClaritasDep= \|WClaritasEtch=		\|WClaritasDep= \|WClaritasEtch=
	\|%CoilDepLoad=40 \|%CoilDepTune=50 \|%CoilEtchLoad=40 \|%CoilEtchTune=50		\|%CoilDepLoad=40 \|%CoilDepTune=50 \|%CoilEtchLoad=40 \|%CoilEtchTune=50
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	\|PressureDepDelay= \|PressureDepBoost= \|PressureDepMain=100%		\|PressureDepDelay= \|PressureDepBoost= \|PressureDepMain=100%
	\|PressureEtchDelay= \|PressureEtchBoost= \|PressureEtchMain=100%		\|PressureEtchDelay= \|PressureEtchBoost= \|PressureEtchMain=100%
	\|C4F8DepDelay=0.3@5 \|C4F8DepBoost= 0.5@50 \|C4F8DepMain=200		\|C4F8DepDelay=0.3 @5 \|C4F8DepBoost= 0.5@ 50 \|C4F8DepMain=200
	\|C4F8EtchDelay=0.5@100 \|C4F8EtchBoost= \|C4F8EtchMain=5		\|C4F8EtchDelay=0.5@ 100 \|C4F8EtchBoost= \|C4F8EtchMain=5
	\|SF6DepDelay=0.3@200 \|SF6DepBoost=0.5@200 \|SF6DepMain=15		\|SF6DepDelay=0.3@ 200 \|SF6DepBoost=0.5@ 200 \|SF6DepMain=15
	\|SF6EtchDelay=2@15 \|SF6EtchBoost=0.3@100 \|SF6EtchMain=200		\|SF6EtchDelay=2@ 15 \|SF6EtchBoost=0.3@ 100 \|SF6EtchMain=200
	\|O2Dep= \|O2Etch= \|ArDep=150 \|ArEtch=150		\|O2Dep= \|O2Etch= \|ArDep=150 \|ArEtch=150
	\|WCoilDep=2 \|WCoilEtch=2 \|WPlatenDep=1		\|WCoilDep=2 \|WCoilEtch=2 \|WPlatenDep=1
	\|WPlatenEtchDelay=1@1 \|WPlatenEtchBoost=1@100 \|WPlatenEtchMain=1		\|WPlatenEtchDelay=1@1 \|WPlatenEtchBoost=1@ 100 \|WPlatenEtchMain=1
	\|WClaritasDep= \|WClaritasEtch=		\|WClaritasDep= \|WClaritasEtch=
	\|%CoilDepLoad=40 \|%CoilDepTune=50 \|%CoilEtchLoad=40 \|%CoilEtchTune=50		\|%CoilDepLoad=40 \|%CoilDepTune=50 \|%CoilEtchLoad=40 \|%CoilEtchTune=50

Jmli at 08:19, 11 November 2024

2024-11-11T08:19:52Z

← Older revision		Revision as of 10:19, 11 November 2024
Line 5:		Line 5:
	{{Template:Peg1Table9Head		{{Template:Peg1Table9Head
	\|TableHeader=DREM 2kW micro		\|TableHeader=DREM 2kW micro
			\|TableStyle = class="wikitable"
			\|PaddingStyle=padding:0px;
			\|ActualPressure=

	}}		}}
	{{Template:Peg1Table9Row		{{Template:Peg1Table9Row
	\|RecipeName=DREM 2kW micro		\|RecipeName=DREM 2kW micro
	\|PriorProcessSteps= Pump to base, Clamp Substrate, home platen matching unit, stabilisation		\|PriorProcessSteps= Pump to base, Clamp Substrate, home platen matching unit, stabilisation
			\|PaddingStyle=padding:0px;
			\|ActualPressure=
	\|Keywords=		\|Keywords=
	\|PlatenPosition=U \|PlatenFrequency=HF \|StabilisationTime= \|StartCycleEndCycle=D/E		\|PlatenPosition=U \|PlatenFrequency=HF \|StabilisationTime= \|StartCycleEndCycle=D/E
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	\|RecipeName=DREM 2kW micro		\|RecipeName=DREM 2kW micro
	\|PriorProcessSteps= Pump to base, Clamp Substrate, home platen matching unit, stabilisation		\|PriorProcessSteps= Pump to base, Clamp Substrate, home platen matching unit, stabilisation
			\|PaddingStyle=padding:0px;
			\|ActualPressure=
	\|Keywords=		\|Keywords=
	\|PlatenPosition=U \|PlatenFrequency=HF \|StabilisationTime= \|StartCycleEndCycle=D/E		\|PlatenPosition=U \|PlatenFrequency=HF \|StabilisationTime= \|StartCycleEndCycle=D/E

Jmli at 08:18, 11 November 2024

2024-11-11T08:18:01Z

← Older revision		Revision as of 10:18, 11 November 2024
Line 5:		Line 5:
	{{Template:Peg1Table9Head		{{Template:Peg1Table9Head
	\|TableHeader=DREM 2kW micro		\|TableHeader=DREM 2kW micro
	}}		}}
	{{Template:Peg1Table9Row		{{Template:Peg1Table9Row
	\|RecipeName=DREM 2kW micro		\|RecipeName=DREM 2kW micro

Jmli at 08:14, 11 November 2024

2024-11-11T08:14:00Z

← Older revision		Revision as of 10:14, 11 November 2024
Line 3:		Line 3:
	= DREM 2kW micro =		= DREM 2kW micro =

	{{Template:~~Peg1RecipeTableVerBColors~~		{{Template:Peg1Table9Head
	\|TableHeader=DREM 2kW micro		\|TableHeader=DREM 2kW micro
	}}		}}
	{{Template:~~Peg1RecipeTableVerBAddrowColors~~		{{Template:Peg1Table9Row
	\|RecipeName=DREM 2kW micro		\|RecipeName=DREM 2kW micro
	\|PriorProcessSteps= Pump to base, Clamp Substrate, home platen matching unit, stabilisation		\|PriorProcessSteps= Pump to base, Clamp Substrate, home platen matching unit, stabilisation
Line 27:		Line 27:
	\|Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 2kW micro \| '''8''']]		\|Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 2kW micro \| '''8''']]
	}}		}}
	{{Template:~~Peg1RecipeTableVerBAddrowColors~~		{{Template:Peg1Table9Row
	\|RecipeName=DREM 2kW micro		\|RecipeName=DREM 2kW micro
	\|PriorProcessSteps= Pump to base, Clamp Substrate, home platen matching unit, stabilisation		\|PriorProcessSteps= Pump to base, Clamp Substrate, home platen matching unit, stabilisation

Jmli: /* Sandbox area below - disregard content */

2023-02-01T08:48:44Z

Sandbox area below - disregard content

Show changes

Jmli: /* Sandbox area below - disregard content */

2022-12-15T16:10:37Z

Sandbox area below - disregard content

← Older revision		Revision as of 18:10, 15 December 2022
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	\|stepname= 0 Home matching		\|stepname= 0 Home matching
	\|generalbox=		\|generalbox=
	\|timebox=~~90t~~		\|timebox=0 sec
	\|presbox=7T		\|presbox=100%
	\|gasbox=~~sulf~~		\|gasbox=
	\|RFbox= ~~yes, lots~~		\|RFbox= -
	\|matchbox= ~~lit~~		\|matchbox= 1/1
	\|miscbox=na		\|miscbox=
	}}		}}

Jmli: /* Sandbox area below - disregard content */

2022-12-15T16:05:08Z

Sandbox area below - disregard content

← Older revision		Revision as of 18:05, 15 December 2022
Line 165:		Line 165:


	{\| class="wikitable hideable hidden~~" border="1" cellspacing="1" cellpadding="2" align="left" width="430px~~"		{\| class="wikitable hideable hidden"
	~~!colspan="3" style="text-align:left;" \| [[image~~:~~Thermal treat your sample.png\|x100px\|Thermal treatment of your sample]] Thermal treatment of your sample~~		{{Template:Peg2cont1
	\|-		\|stepname= 0 Home matching
	~~!Entry page in LabAdviser~~		\|generalbox=
	~~!Techniques~~		\|timebox=90t
	~~!Materials~~		\|presbox=7T
	\|-		\|gasbox=sulf
	\|~~rowspan~~=~~"5" valign="top"\|[[Specific Process Knowledge/Thermal Process\|Thermal Process]]~~		\|RFbox= yes, lots
	\|~~Annealing (>350C)~~		\|matchbox= lit
	\|~~Si, PECVD layers, Al, BCB curing, Polymer~~		\|miscbox=na
	\|-		}}
	~~\|Oxidation~~
	~~\|Si wafers~~
	\|-
	~~\|Doping with B/P~~
	~~\|Si wafers~~
	\|-
	~~\|Pyrolysis~~
	~~\|Resists: AZ, SU8~~, ~~PDMS~~
	\|-
	\|~~Rapid Thermal Anneal (RTP)~~
	~~\|SiO2, Si3N4, Ti, III-V~~
	\|-
	\|
	~~[[Specific Process Knowledge/Lithography/Baking\| Lithography/Baking]] <br>~~
	~~\|Baking (<300dg)~~
	~~\|baking resist and polymers~~
	\|-
	\|}		\|}
	{\| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"		{\| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"

Jmli: /* Overview of micro and nano fabrication steps - a guide to where you can find fabrication information in LabAdviser */

2022-12-15T15:40:51Z

Overview of micro and nano fabrication steps - a guide to where you can find fabrication information in LabAdviser

← Older revision		Revision as of 17:40, 15 December 2022
Line 93:		Line 93:

	==Overview of micro and nano fabrication steps - a guide to where you can find fabrication information in LabAdviser==		==Overview of micro and nano fabrication steps - a guide to where you can find fabrication information in LabAdviser==

	{\| style="color: black;vertical-align:top" width="100%" border=0 cellpadding="4" cellspacing="0"		{\| style="color: black;vertical-align:top" width="100%" border=0 cellpadding="4" cellspacing="0"
	\| colspan="2" \|		\| colspan="2" \|

Jmli: /* Sandbox area below */

2022-12-15T15:38:22Z

Sandbox area below

← Older revision		Revision as of 17:38, 15 December 2022
Line 51:		Line 51:


	= Sandbox area below =		= Sandbox area below - disregard content =

← Older revision		Revision as of 10:20, 20 November 2024
Line 20:		Line 20:
	\|PressureDepDelay= \|PressureDepBoost= \|PressureDepMain=100%		\|PressureDepDelay= \|PressureDepBoost= \|PressureDepMain=100%
	\|PressureEtchDelay= \|PressureEtchBoost= \|PressureEtchMain=100%		\|PressureEtchDelay= \|PressureEtchBoost= \|PressureEtchMain=100%
	\|C4F8DepDelay=0.3@5 \|C4F8DepBoost= 0.5@50 \|C4F8DepMain=200		\|C4F8DepDelay=0.3@5 \|C4F8DepBoost= 0.5@ 50 \|C4F8DepMain=200
	\|C4F8EtchDelay=0.5@ 100 \|C4F8EtchBoost= \|C4F8EtchMain=5		\|C4F8EtchDelay=0.5@ 100 \|C4F8EtchBoost= \|C4F8EtchMain=5
	\|SF6DepDelay=0.3@ 200 \|SF6DepBoost=0.5@ 200 \|SF6DepMain=15		\|SF6DepDelay=0.3@ 200 \|SF6DepBoost=0.5@ 200 \|SF6DepMain=15

← Older revision		Revision as of 10:19, 20 November 2024
Line 21:		Line 21:
	\|PressureEtchDelay= \|PressureEtchBoost= \|PressureEtchMain=100%		\|PressureEtchDelay= \|PressureEtchBoost= \|PressureEtchMain=100%
	\|C4F8DepDelay=0.3@5 \|C4F8DepBoost= 0.5@50 \|C4F8DepMain=200		\|C4F8DepDelay=0.3@5 \|C4F8DepBoost= 0.5@50 \|C4F8DepMain=200
	\|C4F8EtchDelay=0.5@100 \|C4F8EtchBoost= \|C4F8EtchMain=5		\|C4F8EtchDelay=0.5@ 100 \|C4F8EtchBoost= \|C4F8EtchMain=5
	\|SF6DepDelay=0.3@200 \|SF6DepBoost=0.5@200 \|SF6DepMain=15		\|SF6DepDelay=0.3@ 200 \|SF6DepBoost=0.5@ 200 \|SF6DepMain=15
	\|SF6EtchDelay=2@15 \|SF6EtchBoost=0.3@100 \|SF6EtchMain=200		\|SF6EtchDelay=2@ 15 \|SF6EtchBoost=0.3@ 100 \|SF6EtchMain=200
	\|O2Dep= \|O2Etch= \|ArDep=150 \|ArEtch=150		\|O2Dep= \|O2Etch= \|ArDep=150 \|ArEtch=150
	\|WCoilDep=2 \|WCoilEtch=2 \|WPlatenDep=1		\|WCoilDep=2 \|WCoilEtch=2 \|WPlatenDep=1
	\|WPlatenEtchDelay=1@1 \|WPlatenEtchBoost=1@100 \|WPlatenEtchMain=1		\|WPlatenEtchDelay=1@1 \|WPlatenEtchBoost=1@ 100 \|WPlatenEtchMain=1
	\|WClaritasDep= \|WClaritasEtch=		\|WClaritasDep= \|WClaritasEtch=
	\|%CoilDepLoad=40 \|%CoilDepTune=50 \|%CoilEtchLoad=40 \|%CoilEtchTune=50		\|%CoilDepLoad=40 \|%CoilDepTune=50 \|%CoilEtchLoad=40 \|%CoilEtchTune=50
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	\|PressureDepDelay= \|PressureDepBoost= \|PressureDepMain=100%		\|PressureDepDelay= \|PressureDepBoost= \|PressureDepMain=100%
	\|PressureEtchDelay= \|PressureEtchBoost= \|PressureEtchMain=100%		\|PressureEtchDelay= \|PressureEtchBoost= \|PressureEtchMain=100%
	\|C4F8DepDelay=0.3@5 \|C4F8DepBoost= 0.5@50 \|C4F8DepMain=200		\|C4F8DepDelay=0.3 @5 \|C4F8DepBoost= 0.5@ 50 \|C4F8DepMain=200
	\|C4F8EtchDelay=0.5@100 \|C4F8EtchBoost= \|C4F8EtchMain=5		\|C4F8EtchDelay=0.5@ 100 \|C4F8EtchBoost= \|C4F8EtchMain=5
	\|SF6DepDelay=0.3@200 \|SF6DepBoost=0.5@200 \|SF6DepMain=15		\|SF6DepDelay=0.3@ 200 \|SF6DepBoost=0.5@ 200 \|SF6DepMain=15
	\|SF6EtchDelay=2@15 \|SF6EtchBoost=0.3@100 \|SF6EtchMain=200		\|SF6EtchDelay=2@ 15 \|SF6EtchBoost=0.3@ 100 \|SF6EtchMain=200
	\|O2Dep= \|O2Etch= \|ArDep=150 \|ArEtch=150		\|O2Dep= \|O2Etch= \|ArDep=150 \|ArEtch=150
	\|WCoilDep=2 \|WCoilEtch=2 \|WPlatenDep=1		\|WCoilDep=2 \|WCoilEtch=2 \|WPlatenDep=1
	\|WPlatenEtchDelay=1@1 \|WPlatenEtchBoost=1@100 \|WPlatenEtchMain=1		\|WPlatenEtchDelay=1@1 \|WPlatenEtchBoost=1@ 100 \|WPlatenEtchMain=1
	\|WClaritasDep= \|WClaritasEtch=		\|WClaritasDep= \|WClaritasEtch=
	\|%CoilDepLoad=40 \|%CoilDepTune=50 \|%CoilEtchLoad=40 \|%CoilEtchTune=50		\|%CoilDepLoad=40 \|%CoilDepTune=50 \|%CoilEtchLoad=40 \|%CoilEtchTune=50