Specific Process Knowledge/Etch/DRIE-Pegasus - Revision history

Jmli at 09:41, 21 October 2025

2025-10-21T09:41:44Z

← Older revision		Revision as of 11:41, 21 October 2025
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	{{Template:Author-jmli1}}		{{Template:Author-jmli1}}
	<!--Checked for updates on 2/02-2023 - ok/jmli -->		<!--Checked for updates on 2/02-2023 - ok/jmli -->
			<!--Checked for updates on 21/10-2025 - ok/jmli -->

	In 2010 DTU Nanolab acquired DRIE-Pegasus 1. As a state-of-the-art etch tool with excellent performance and great flexibility, it grew immensely popular and by 2015 it was apparent that we needed yet another tool to cope with the demand. Therefore, in 2016 Pegasus 2 was acquired from a closed-down lab and installed next to Pegasus 1.		In 2010 DTU Nanolab acquired DRIE-Pegasus 1. As a state-of-the-art etch tool with excellent performance and great flexibility, it grew immensely popular and by 2015 it was apparent that we needed yet another tool to cope with the demand. Therefore, in 2016 Pegasus 2 was acquired from a closed-down lab and installed next to Pegasus 1.

Mmat at 15:02, 21 May 2025

2025-05-21T15:02:58Z

← Older revision		Revision as of 17:02, 21 May 2025
Line 8:		Line 8:
	<!--Checked for updates on 2/02-2023 - ok/jmli -->		<!--Checked for updates on 2/02-2023 - ok/jmli -->

	In 2010 DTU Nanolab acquired DRIE-Pegasus 1 ~~(at the time called Danchip and DRIE-Pegasus, respectively)~~. As a state-of-the-art etch tool with excellent performance and great flexibility, it grew immensely popular and by 2015 it was apparent that we needed yet another tool to cope with the demand. Therefore, in 2016 Pegasus 2 was acquired from a closed-down lab and installed next to Pegasus 1.		In 2010 DTU Nanolab acquired DRIE-Pegasus 1. As a state-of-the-art etch tool with excellent performance and great flexibility, it grew immensely popular and by 2015 it was apparent that we needed yet another tool to cope with the demand. Therefore, in 2016 Pegasus 2 was acquired from a closed-down lab and installed next to Pegasus 1.

	Looking to expand our dry etching capabilities in 2017 we got an irresistible offer on a twin Pegasus system with cassette to cassette vacuum robot from a commercial fab. The twin Pegasus system (called Pegasus 3 and 4) is installed at the old cluster 2 location in cleanroom C1 and will run only 6" wafers. Pegasus 3 is the 6" silicon etch work horse and Pegasus 4 is converted (adding extra process gases) into a 6" dielectric etch tool that will supplement/replace the AOE.		Looking to expand our dry etching capabilities in 2017 we got an irresistible offer on a twin Pegasus system with cassette to cassette vacuum robot from a commercial fab. The twin Pegasus system (called Pegasus 3 and 4) is installed at the old cluster 2 location in cleanroom C1 and will run only 6" wafers. Pegasus 3 is the 6" silicon etch work horse and Pegasus 4 is converted (adding extra process gases) into a 6" dielectric etch tool that will supplement/replace the AOE.

Jmli: /* The DRIE Pegasus tools at DTU Nanolab */

2025-02-10T02:29:04Z

The DRIE Pegasus tools at DTU Nanolab

@@ Line 18: / Line 18: @@
 | width="200"| [[file:Pegasus 2 operator.jpg |204px|frameless]]
 | width="275"|[[file:Peg3and4 front 2.JPG |292px|frameless]]
 |-
 | align="center" | The DRIE-Pegasus 1 load lock and cassette loader in the DTU Nanolab cleanroom A-1. {{photo1}}

Jmli: /* The DRIE Pegasus tools at DTU Nanolab */

2025-02-10T02:28:44Z

The DRIE Pegasus tools at DTU Nanolab

← Older revision		Revision as of 04:28, 10 February 2025
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	{\|		{\|
	\|width="100"\| [[file:DRIE-Pegasus.jpg \|~~200px~~\|frameless]]		\|width="100"\| [[file:DRIE-Pegasus.jpg \|100px\|frameless]]
	\| width="200"\| [[file:Pegasus 2 operator.jpg \|~~408px~~\|frameless]]		\| width="200"\| [[file:Pegasus 2 operator.jpg \|204px\|frameless]]
	\| width="275"\|[[file:Peg3and4 front 2.JPG \|~~584px~~\|frameless]]		\| width="275"\|[[file:Peg3and4 front 2.JPG \|292px\|frameless]]
	\|-		\|-
	\| align="center" \| The DRIE-Pegasus 1 load lock and cassette loader in the DTU Nanolab cleanroom A-1. {{photo1}}		\| align="center" \| The DRIE-Pegasus 1 load lock and cassette loader in the DTU Nanolab cleanroom A-1. {{photo1}}

Jmli: /* The DRIE Pegasus tools at DTU Nanolab */

2025-02-10T02:27:52Z

The DRIE Pegasus tools at DTU Nanolab

← Older revision		Revision as of 04:27, 10 February 2025
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	This page was originally intended as a regular one-machine page (the Pegasus 1 page). However, as of 2018 with several tools, the page will serve as common page for all of our Pegasi with subpages for each tool.		This page was originally intended as a regular one-machine page (the Pegasus 1 page). However, as of 2018 with several tools, the page will serve as common page for all of our Pegasi with subpages for each tool.

			{\|
			\|width="100"\| [[file:DRIE-Pegasus.jpg \|200px\|frameless]]
			\| width="200"\| [[file:Pegasus 2 operator.jpg \|408px\|frameless]]
			\| width="275"\|[[file:Peg3and4 front 2.JPG \|584px\|frameless]]
			\|-
			\| align="center" \| The DRIE-Pegasus 1 load lock and cassette loader in the DTU Nanolab cleanroom A-1. {{photo1}}
			\| align="center" \| The DRIE-Pegasus 2 operator station and load lock in the DTU Nanolab cleanroom A-1. {{photo1}}
			\| align="center" \| The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations. {{photo1}}
			\|-
			\|}

	{\|		{\|

Jmli: /* Equipment performance and process related parameters */

2023-12-21T13:28:56Z

Equipment performance and process related parameters

← Older revision		Revision as of 15:28, 21 December 2023
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	\|-		\|-
	\|style="background:LightGrey; color:black"\|Gas flows		\|style="background:LightGrey; color:black"\|Gas flows
			\|style="background:lightgrey; color:black"\|
			* SF<sub>6</sub>: 0 to 1200 sccm
			* O<sub>2</sub>: 0 to 200 sccm
			* C<sub>4</sub>F<sub>8</sub>: 0 to 400 sccm
			* Ar: 0 to 283 sccm
	\|style="background:lightgrey; color:black"\|		\|style="background:lightgrey; color:black"\|
	* SF<sub>6</sub>-1: 0 to 1200 sccm		* SF<sub>6</sub>-1: 0 to 1200 sccm

Jmli: /* Equipment performance and process related parameters */

2023-12-21T13:26:53Z

Equipment performance and process related parameters

← Older revision		Revision as of 15:26, 21 December 2023
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	\|style="background:LightGrey; color:black"\|Gas flows		\|style="background:LightGrey; color:black"\|Gas flows
	\|style="background:lightgrey; color:black"\|		\|style="background:lightgrey; color:black"\|
	* SF<sub>6</sub>: 0 to 1200 sccm		* SF<sub>6</sub>-1: 0 to 1200 sccm
	* O<sub>2</sub>: 0 to ~~200~~ sccm		* SF<sub>6</sub>-2: 0 to 100 sccm
	* C<sub>4</sub>F<sub>8</sub>: 0 to ~~400~~ sccm		* O<sub>2</sub>: 0 to 50 sccm
			* N<sub>2</sub>: 0 to 500 sccm
	* Ar: 0 to 283 sccm		* Ar: 0 to 283 sccm
			* He: 0 to 11 sccm
	\|style="background:lightgrey; color:black"\|		\|style="background:lightgrey; color:black"\|
	* SF<sub>6</sub>: 0 to 1200 sccm		* SF<sub>6</sub>-1: 0 to 1200 sccm
			* SF<sub>6</sub>-2: 0 to 100 sccm
	* O<sub>2</sub>: 0 to 200 sccm		* O<sub>2</sub>: 0 to 200 sccm
	* C<sub>4</sub>F<sub>8</sub>: 0 to 400 sccm		* C<sub>4</sub>F<sub>8</sub>: 0 to 400 sccm
	* Ar: 0 to 283 sccm		* Ar: 0 to 283 sccm
	~~\|style="background:lightgrey; color:black"\|~~
	* SF<sub>6</sub>
	* O<sub>2</sub>
	* C<sub>4</sub>F<sub>8</sub>
	* Ar
	\|style="background:lightgrey; color:black"\|		\|style="background:lightgrey; color:black"\|
	{\|		{\|

Jmli: /* The DRIE Pegasus tools at DTU Nanolab */

2023-12-21T13:18:02Z

The DRIE Pegasus tools at DTU Nanolab

← Older revision		Revision as of 15:18, 21 December 2023
Line 10:		Line 10:
	In 2010 DTU Nanolab acquired DRIE-Pegasus 1 (at the time called Danchip and DRIE-Pegasus, respectively). As a state-of-the-art etch tool with excellent performance and great flexibility, it grew immensely popular and by 2015 it was apparent that we needed yet another tool to cope with the demand. Therefore, in 2016 Pegasus 2 was acquired from a closed-down lab and installed next to Pegasus 1.		In 2010 DTU Nanolab acquired DRIE-Pegasus 1 (at the time called Danchip and DRIE-Pegasus, respectively). As a state-of-the-art etch tool with excellent performance and great flexibility, it grew immensely popular and by 2015 it was apparent that we needed yet another tool to cope with the demand. Therefore, in 2016 Pegasus 2 was acquired from a closed-down lab and installed next to Pegasus 1.

	Looking to expand our dry etching capabilities in 2017 we got an irresistible offer on a twin Pegasus system with cassette to cassette vacuum robot from a ~~commerciel~~ fab. The twin Pegasus system (called Pegasus 3 and 4) is installed at the old cluster 2 location in cleanroom C1 and will run only 6" wafers. Pegasus 3 is the 6" silicon etch work horse and Pegasus 4 is converted (adding extra process gases) into a 6" dielectric etch tool that will supplement/replace the AOE.		Looking to expand our dry etching capabilities in 2017 we got an irresistible offer on a twin Pegasus system with cassette to cassette vacuum robot from a commercial fab. The twin Pegasus system (called Pegasus 3 and 4) is installed at the old cluster 2 location in cleanroom C1 and will run only 6" wafers. Pegasus 3 is the 6" silicon etch work horse and Pegasus 4 is converted (adding extra process gases) into a 6" dielectric etch tool that will supplement/replace the AOE.

	This page was originally intended as a regular one-machine page (the Pegasus 1 page). However, as of 2018 with several tools, the page will serve as common page for all of our Pegasi with subpages for each tool.		This page was originally intended as a regular one-machine page (the Pegasus 1 page). However, as of 2018 with several tools, the page will serve as common page for all of our Pegasi with subpages for each tool.

Jmli: /* The DRIE Pegasus tools at DTU Nanolab */

2023-12-21T13:17:21Z

The DRIE Pegasus tools at DTU Nanolab

← Older revision		Revision as of 15:17, 21 December 2023
Line 8:		Line 8:
	<!--Checked for updates on 2/02-2023 - ok/jmli -->		<!--Checked for updates on 2/02-2023 - ok/jmli -->

	In 2010 DTU Nanolab acquired DRIE-Pegasus 1 (at the time called Danchip and DRIE-Pegasus, respectively). As a state-of-the-art etch tool with excellent performance and great flexibility, it grew immensely popular and by 2015 it was apparent that we needed yet another tool to cope with the demand. Therefore, in 2016 Pegasus 2 was acquired from a closed-down lab ~~in Morocco~~ and installed next to Pegasus 1.		In 2010 DTU Nanolab acquired DRIE-Pegasus 1 (at the time called Danchip and DRIE-Pegasus, respectively). As a state-of-the-art etch tool with excellent performance and great flexibility, it grew immensely popular and by 2015 it was apparent that we needed yet another tool to cope with the demand. Therefore, in 2016 Pegasus 2 was acquired from a closed-down lab and installed next to Pegasus 1.

	Looking to expand our dry etching capabilities in 2017 we got an irresistible offer on a twin Pegasus system with cassette to cassette vacuum robot from a commerciel fab. The twin Pegasus system (called Pegasus 3 and 4) is installed at the old cluster 2 location in cleanroom C1 and will run only 6" wafers. Pegasus 3 is the 6" silicon etch work horse and Pegasus 4 is converted (adding extra process gases) into a 6" dielectric etch tool that will supplement/replace the AOE.		Looking to expand our dry etching capabilities in 2017 we got an irresistible offer on a twin Pegasus system with cassette to cassette vacuum robot from a commerciel fab. The twin Pegasus system (called Pegasus 3 and 4) is installed at the old cluster 2 location in cleanroom C1 and will run only 6" wafers. Pegasus 3 is the 6" silicon etch work horse and Pegasus 4 is converted (adding extra process gases) into a 6" dielectric etch tool that will supplement/replace the AOE.

Jmli: /* Comparison of SEM's in building 346/451 */

2023-11-20T10:32:56Z

Comparison of SEM's in building 346/451

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