Specific Process Knowledge/Cross Contamination - Revision history

Mmat: /* Cross Contamination */

2025-06-17T20:36:40Z

Cross Contamination

← Older revision		Revision as of 22:36, 17 June 2025
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	{\| border="2" style="border: dashed 2px #BB0003" cellspacing="0" cellpadding="10" align="left"		{\| border="2" style="border: dashed 2px #BB0003" cellspacing="0" cellpadding="10" align="left"
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	\|Please note, as a multiuser facility we need to establish working procedures to provide the best possible working environment for all our users, not only in terms of safety, but also regarding reliability of equipment and processes. '''We expect all users to adhere strictly to the guidelines and equipment usage rules, with particular attention to preventing cross-contamination between tools.''' We are happy to assist you in reviewing and refining your process flow to help streamline your work and ensure compatibility with our facility standards. You can find more information on how to create a process flow [[Specific Process Knowledge/Process Flow\|here]].		\|Please note, as a multiuser facility we need to establish working procedures to provide the best possible working environment for all our users, not only in terms of safety, but also regarding reliability of equipment and processes. '''We expect all users to adhere strictly to the guidelines and equipment usage rules, with particular attention to preventing cross-contamination between tools.''' We are happy to assist you in reviewing and refining your process flow to help streamline your work and ensure compatibility with our facility standards. You can find more information on how to create a process flow [[Specific Process Knowledge/Process Flow\|'''here''']].
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Mmat at 21:43, 16 June 2025

2025-06-16T21:43:14Z

← Older revision		Revision as of 23:43, 16 June 2025
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	\|Please note, as a multiuser facility we need to establish working procedures to provide the best possible working environment for all our users, not only in terms of safety, but also regarding reliability of equipment and processes. '''We expect all users to adhere strictly to the guidelines and equipment usage rules, with particular attention to preventing cross-contamination between tools.''' We are happy to assist you in reviewing and refining your process flow to help streamline your work and ensure compatibility with our facility standards. You can find more information on how to create a process flow [[~~LabAdviser~~/Process ~~flow approval~~\|here.]]		\|Please note, as a multiuser facility we need to establish working procedures to provide the best possible working environment for all our users, not only in terms of safety, but also regarding reliability of equipment and processes. '''We expect all users to adhere strictly to the guidelines and equipment usage rules, with particular attention to preventing cross-contamination between tools.''' We are happy to assist you in reviewing and refining your process flow to help streamline your work and ensure compatibility with our facility standards. You can find more information on how to create a process flow [[Specific Process Knowledge/Process Flow\|here]].
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Mmat: /* Cross Contamination */

2025-05-27T15:30:57Z

Cross Contamination

← Older revision		Revision as of 17:30, 27 May 2025
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	= Cross Contamination =		= Cross Contamination =
	As explained at [[Specific Process Knowledge/~~Preparation~~\|'''~~The~~ Process Flow''']] page, there is a large variety of cleanroom fabrication and characterization methods that can be combined to create new materials or structures. Some processes are very sensitive to contaminants and equipment cannot always be cleaned easily running a pre-process cleaning step.		As explained on the [[Specific Process Knowledge/Process Flow\|'''Process Flow''']] page, there is a large variety of cleanroom fabrication and characterization methods that can be combined to create new materials or structures. Some processes are very sensitive to contaminants and equipment cannot always be cleaned easily running a pre-process cleaning step.

	For example, contaminants during a thermal oxidation process to grow silicon dioxide (SiO₂) layers on silicon wafers can significantly degrade the quality and functionality of the resulting oxide layer. Especially metal ions pose a serious issue as they increase leakage currents, reduce the breakdown voltage, reduce the dielectric strength, and cause threshold voltage shifts in MOS devices. But contaminants can also alter the stoichiometry or uniformity of the oxide layer due to non-uniform growth rates and the formation of defective or porous oxides. Therefore, thermal oxidation furnaces have to be maintained extremely clean and the cannot be cleaned easily.		For example, contaminants during a thermal oxidation process to grow silicon dioxide (SiO₂) layers on silicon wafers can significantly degrade the quality and functionality of the resulting oxide layer. Especially metal ions pose a serious issue as they increase leakage currents, reduce the breakdown voltage, reduce the dielectric strength, and cause threshold voltage shifts in MOS devices. But contaminants can also alter the stoichiometry or uniformity of the oxide layer due to non-uniform growth rates and the formation of defective or porous oxides. Therefore, thermal oxidation furnaces have to be maintained extremely clean and the cannot be cleaned easily.

Mmat: /* Cross Contamination Groups in LabManager */

2025-05-27T11:24:51Z

Cross Contamination Groups in LabManager

← Older revision		Revision as of 13:24, 27 May 2025
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	We have created a cross contamination sheet available in Labmanager as a guideline regarding which materials are allowed to enter an equipment. It is also possible to show the cross contamination between two tools. You can find more information below.		We have created a cross contamination sheet available in Labmanager as a guideline regarding which materials are allowed to enter an equipment. It is also possible to show the cross contamination between two tools. You can find more information below.

	Cross contamination can origin from many different sources: the substrate ~~'''~~itself~~'''~~, films deposited or grown on top of the substrate, traces from previous processes, and the environment. To make it easier for our users, we have ~~<s>grouped</s> '''divided/~~sorted~~'''~~ them into groups according to the sources of contamination.		Cross contamination can origin from many different sources: the substrate itself, films deposited or grown on top of the substrate, traces from previous processes, and the environment. To make it easier for our users, we have sorted them into groups according to the sources of contamination.
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Mmat: /* Cross Contamination */

2025-05-20T15:23:56Z

Cross Contamination

← Older revision		Revision as of 17:23, 20 May 2025
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	= Cross Contamination =		= Cross Contamination =
	As explained at [[Specific Process Knowledge/Preparation\|'''The Process Flow''']] page, there is a large variety of cleanroom fabrication and characterization methods that can be combined to create new materials or structures. Some processes are very sensitive to ~~contamina<s>tions</s> '''(I think that you mean~~ contaminants~~)'''~~ and equipment cannot always be cleaned easily running a pre-process cleaning step.		As explained at [[Specific Process Knowledge/Preparation\|'''The Process Flow''']] page, there is a large variety of cleanroom fabrication and characterization methods that can be combined to create new materials or structures. Some processes are very sensitive to contaminants and equipment cannot always be cleaned easily running a pre-process cleaning step.

	For example, ~~contamina'''nts'''<s>tions</s>~~ during a thermal oxidation process to grow silicon dioxide (SiO₂) layers on silicon wafers can significantly degrade the quality and functionality of the resulting oxide layer. Especially metal ions pose a serious issue as they increase leakage currents, reduce the breakdown voltage, reduce the dielectric strength, and cause threshold voltage shifts in MOS devices. But contaminants can also alter the stoichiometry or uniformity of the oxide layer due to non-uniform growth rates and the formation of defective or porous oxides. Therefore, thermal oxidation furnaces have to be maintained extremely clean and the cannot be cleaned easily.		For example, contaminants during a thermal oxidation process to grow silicon dioxide (SiO₂) layers on silicon wafers can significantly degrade the quality and functionality of the resulting oxide layer. Especially metal ions pose a serious issue as they increase leakage currents, reduce the breakdown voltage, reduce the dielectric strength, and cause threshold voltage shifts in MOS devices. But contaminants can also alter the stoichiometry or uniformity of the oxide layer due to non-uniform growth rates and the formation of defective or porous oxides. Therefore, thermal oxidation furnaces have to be maintained extremely clean and the cannot be cleaned easily.
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Elelop at 13:10, 20 May 2025

2025-05-20T13:10:07Z

← Older revision		Revision as of 15:10, 20 May 2025
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	== Cross Contamination Groups in LabManager ==		== Cross Contamination Groups in LabManager ==
	We have created a cross contamination sheet available in ~~labmanager~~ as a guideline regarding which materials are allowed to enter an equipment. It is also possible to show the cross contamination between two tools. You can find more information below.		We have created a cross contamination sheet available in Labmanager as a guideline regarding which materials are allowed to enter an equipment. It is also possible to show the cross contamination between two tools. You can find more information below.

	Cross contamination can origin from many different sources: the substrate, films deposited or grown on top of the substrate, traces from previous processes, and the environment. To make it easier for our users, we have grouped them into groups ~~accorcing~~ to the sources of contamination.		Cross contamination can origin from many different sources: the substrate '''itself''', films deposited or grown on top of the substrate, traces from previous processes, and the environment. To make it easier for our users, we have <s>grouped</s> '''divided/sorted''' them into groups according to the sources of contamination.
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	== How to Access the Cross Contamination Sheet ==		== How to Access the Cross Contamination Sheet ==
	Please note that some cross contamination sheets might be outdated. If you are ~~in doubt if~~ you are allowed to process your wafer in a specific equipment, please contact [mailto:training@nanolab.dtu.dk training@nanolab.dtu.dk].		Please note that some cross contamination sheets might be outdated. If you are unsure whether you are allowed to process your wafer in a specific equipment, please contact [mailto:training@nanolab.dtu.dk training@nanolab.dtu.dk].
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	* Are there process dependent attributes or traces added or removed? ([[image:xccaution.png\|15px\|frameless\|link=]])		* Are there process dependent attributes or traces added or removed? ([[image:xccaution.png\|15px\|frameless\|link=]])
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	As you can see from the screenshot above, you are not allowed to process a sample in the "Si Etch 1: KOH" bath (our cleanest KOH etch bath) that has been previously processed in "PECVD03". Your sample might have picked up traces of material list 3, f.ex. silver, gold, or copper during processing in the PECVD03. Since those contaminants can alter the etching process and ~~further~~ contaminate samples processed in "Si Etch 1: KOH", they are forbidden.		As you can see from the screenshot above, you are not allowed to process a sample in the "Si Etch 1: KOH" bath (our cleanest KOH etch bath) that has been previously been processed in "PECVD03". Your sample might have picked up traces of material list 3, f.ex. silver, gold, or copper during processing in the PECVD03. Since those contaminants can alter the etching process and, even more, contaminate samples processed in "Si Etch 1: KOH", they are forbidden.

Elelop at 12:49, 20 May 2025

2025-05-20T12:49:52Z

← Older revision		Revision as of 14:49, 20 May 2025
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	= Cross Contamination =		= Cross Contamination =
	As explained ~~for~~ [[Specific Process Knowledge/Preparation\|'''The Process Flow''']], there ~~are~~ a large variety of cleanroom fabrication and characterization methods that can be combined to create new materials or structures. Some processes are very sensitive to ~~contaminations~~ and equipment cannot always be cleaned easily running a pre-process cleaning step.		As explained at [[Specific Process Knowledge/Preparation\|'''The Process Flow''']] page, there is a large variety of cleanroom fabrication and characterization methods that can be combined to create new materials or structures. Some processes are very sensitive to contamina<s>tions</s> '''(I think that you mean contaminants)''' and equipment cannot always be cleaned easily running a pre-process cleaning step.

	For example, ~~contaminations~~ during a thermal oxidation process to grow silicon dioxide (SiO₂) layers on silicon wafers can significantly degrade the quality and functionality of the resulting oxide layer. Especially metal ions pose a serious issue as they increase leakage currents, ~~reduced~~ the breakdown voltage, reduce the dielectric strength, and cause threshold voltage shifts in MOS devices. But contaminants can also alter the stoichiometry or uniformity of the oxide layer due to non-uniform growth rates and the formation of defective or porous oxides. Therefore, thermal oxidation furnaces have to be maintained extremely clean and the cannot be cleaned easily.		For example, contamina'''nts'''<s>tions</s> during a thermal oxidation process to grow silicon dioxide (SiO₂) layers on silicon wafers can significantly degrade the quality and functionality of the resulting oxide layer. Especially metal ions pose a serious issue as they increase leakage currents, reduce the breakdown voltage, reduce the dielectric strength, and cause threshold voltage shifts in MOS devices. But contaminants can also alter the stoichiometry or uniformity of the oxide layer due to non-uniform growth rates and the formation of defective or porous oxides. Therefore, thermal oxidation furnaces have to be maintained extremely clean and the cannot be cleaned easily.
	<br>		<br>
	<br>		<br>

Mmat: /* Cross Contamination between two Tools */

2025-05-16T14:38:05Z

Cross Contamination between two Tools

← Older revision		Revision as of 16:38, 16 May 2025
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	=== Cross Contamination between two Tools ===		=== Cross Contamination between two Tools ===
	* ~~commonly~~ the tool you selected is set as default, else click on "Select other equipment"		* Commonly the tool you selected is set as default, else click on "Select other equipment"
	* ~~click~~ on "Select "TO" equipment"		* Click on "Select "TO" equipment"
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	[[image:cross_contamination_between.png\|800px\|frameless\|Example for a cross contamination sheet for the PECVD03]]		[[image:cross_contamination_between.png\|800px\|frameless\|Example for a cross contamination sheet for the PECVD03]]

Mmat at 14:37, 16 May 2025

2025-05-16T14:37:19Z

← Older revision		Revision as of 16:37, 16 May 2025
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	'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Cross_Contamination click here]'''		'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Cross_Contamination click here]'''
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	=<~~span style="background:#FF2800"~~>~~THIS PAGE IS UNDER CONSTRUCTION~~<~~/span~~>=		<br>

	[[image:Cross Contamination - Process Flow.jpg\|800px\|frameless\|link=\|The substrate type is characterized by the bulk material characteristics of the given sample.]]		[[image:Cross Contamination - Process Flow.jpg\|800px\|frameless\|link=\|The substrate type is characterized by the bulk material characteristics of the given sample.]]
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Mmat at 14:30, 16 May 2025

2025-05-16T14:30:54Z

← Older revision		Revision as of 16:30, 16 May 2025
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	=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>=		=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>=

			[[image:Cross Contamination - Process Flow.jpg\|800px\|frameless\|link=\|The substrate type is characterized by the bulk material characteristics of the given sample.]]
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	= Cross Contamination =		= Cross Contamination =