Specific Process Knowledge/Characterization/Tencor P17 - Revision history

Reet: /* Tencor P17 (Stylus Profiler) */

2025-07-07T11:34:22Z

Tencor P17 (Stylus Profiler)

← Older revision		Revision as of 13:34, 7 July 2025
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	<br>		<br>
	= Tencor P17 (Stylus Profiler) =		= Tencor P17 (Stylus Profiler) =

			[[image:KLA-Tencor P17 profiler.jpg\|275x275px\|right\|thumb\|Front of the P17 profiler located in cleanroom F-2.]]

	The P17 Stylus Profiler from KLA Tencor is used in a similar manner to the [[Specific Process Knowledge/Characterization/Dektak XTA\|Dektak XTA]] profiling surfaces with structures in the micro- and submicrometer range as well as for measuring [[Specific_Process_Knowledge/Characterization/Stress_measurement\|stress]]. Both of these tools are inside the cleanroom.		The P17 Stylus Profiler from KLA Tencor is used in a similar manner to the [[Specific Process Knowledge/Characterization/Dektak XTA\|Dektak XTA]] profiling surfaces with structures in the micro- and submicrometer range as well as for measuring [[Specific_Process_Knowledge/Characterization/Stress_measurement\|stress]]. Both of these tools are inside the cleanroom.

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	<br>		<br>
	===Performance and Process Parameters===		===Performance and Process Parameters===

	~~[[image:KLA-Tencor P17 profiler.jpg\|275x275px\|right\|thumb\|Front of the P17 profiler located in cleanroom F-2.]]~~

	{\| border="2" cellspacing="0" cellpadding="10"		{\| border="2" cellspacing="0" cellpadding="10"

Reet: /* Performance and Process Parameters */

2025-07-07T11:31:31Z

Performance and Process Parameters

← Older revision		Revision as of 13:31, 7 July 2025
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	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*All materials that do not stick to the tip or leave residues on the chuck.		*All materials that do not stick to the tip or leave residues on the chuck.
	*For very soft materials we recommend the ~~Dektak150~~, ~~see below~~.		*For very soft materials we recommend the [[Specific Process Knowledge/Characterization/Topographic measurement#Comparison of Stylus Profilers, Optical Profilers and AFMs at Nanolab\| Dektak 150]].
	\|-		\|-
	\|}		\|}
	<br>		<br>
	<br>		<br>

	== Apex Software for Data Analysis ==		== Apex Software for Data Analysis ==
	The Tencor-KLA P17 stylus profiler comes with advanced data analysis software called APEX. We have an extra license for the software on a computer in the basement of building 346. The computer is located at the back of room 904 between the XRD Powder and the AFM. At the moment remote access is not possible, but you are able to access your files on the M-drive from the computer. Let us know if you would like us to find a solution for remote access and/or would like us to move the analysis computer to a room with daylight, as we are not sure how many of you would actually like to use the software.		The Tencor-KLA P17 stylus profiler comes with advanced data analysis software called APEX. We have an extra license for the software on a computer in the basement of building 346. The computer is located at the back of room 904 between the XRD Powder and the AFM. At the moment remote access is not possible, but you are able to access your files on the M-drive from the computer. Let us know if you would like us to find a solution for remote access and/or would like us to move the analysis computer to a room with daylight, as we are not sure how many of you would actually like to use the software.

Reet: /* Tencor P17 (Stylus Profiler) */

2025-07-07T11:30:43Z

Tencor P17 (Stylus Profiler)

← Older revision		Revision as of 13:30, 7 July 2025
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	== Process information ==		== Process information ==
	*Info about [[Specific Process Knowledge/Characterization/~~Dektak XTA#~~Measurement ~~Accuracy~~ \|measurement accuracy]] ~~(''measured with Dektak XTA'')~~		*Info about [[Specific Process Knowledge/Characterization/Stylus Profiler Measurement Uncertainty\|measurement accuracy]]
	*Vendor's description of [https://labmanager.dtu.dk/view_binary.php?fileId=6385 instrument specs including reproducibility and flatness of scans] (''requires login as it seems not freely available from vendor's website'')		*Vendor's description of [https://labmanager.dtu.dk/view_binary.php?fileId=6385 instrument specs including reproducibility and flatness of scans] (''requires login as it seems not freely available from vendor's website'')
	*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]		*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]
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	\|style="background:LightGrey; color:black"\|Scan range X Y		\|style="background:LightGrey; color:black"\|Scan range X Y
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	Line scan X: 20 µm to 200 mm ~~in a single scan. No~~ stitching.		*Line scan: 20 µm to 200 mm (no stitching)
			*Map scan: Any rectangle inscribed in a 200 mm circle
	Map scan XY: ~~In principle any~~ rectangle ~~that can be~~ inscribed in a 200 mm circle~~, but~~ resolution ~~is limited to~~ max. 4 million points and scanning is slow. ~~In practice to~~ get good resolution scan a ~~very~~ small area (e.g., ~~100~~ x 500 µm)		*Map resolution max. 4 million points and scanning is slow. To get good resolution scan a small area (e.g., 200 x 500 µm)
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Scan range Z		\|style="background:LightGrey; color:black"\|Scan range Z
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	50 nm to 900 µm. ~~It is~~ possible ~~to measure smaller steps~~ but ~~not recommended as the results may not be accurate.~~		100 nm to 900 µm. (smaller measurements possible but inaccurate)
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Resolution X Y		\|style="background:LightGrey; color:black"\|Resolution X Y
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	~~Down to~~ 0.025 µm in theory~~, but the~~ tip ~~radius is 2 µm, so the meaningful resolution is at the same order of magnitude~~		*0.025 µm in theory
			*limited by tip shape and size
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Resolution Z		\|style="background:LightGrey; color:black"\|Resolution Z
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	0.01 Å, 0.08 Å, or 0.6 Å ~~according to the manufacturer~~ for ranges 13 µm, 131 µm, and 1 mm~~. Note the smallest of these values are purely theoretical as they are far below the lab's noise level~~.		0.01 Å, 0.08 Å, or 0.6 Å for ranges 13 µm, 131 µm, and 1 mm.
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Height accuracy z (95 % confidence)		\|style="background:LightGrey; color:black"\|Height accuracy z (95 % confidence)
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	~ 2 % ~~for the smallest range~~ for a 1 ~~micron~~ step ~~and~~ ~ 1 % for a 25 ~~micron~~ step '''for well-defined steps that are easy to measure''' ~~(read about reducing and estimating the measurement uncertainty~~ [[Specific Process Knowledge/Characterization/~~Dektak XTA#~~Measurement ~~Accuracy~~ \|here]])		*~ 2 % for a 1 µm step with the 13 µm range
			*~ 1 % for a 25 µm step
			*'''for well-defined steps that are easy to measure'''
			*[[Specific Process Knowledge/Characterization/Stylus Profiler Measurement Uncertainty\|More info here]])
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Max scan depth as a function of trench width W		\|style="background:LightGrey; color:black"\|Max scan depth as a function of trench width W
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	*2 µm 60<sup>o</sup> cone		*2 µm 60<sup>o</sup> cone
	\|-		\|-
	!style="background:silver; color:black" align="left" rowspan="5" valign="top" \|Substrates		!style="background:silver; color:black" align="left" rowspan="5" valign="top" \|Substrates and film materials
	\|style="background:LightGrey; color:black"\|Substrate size		\|style="background:LightGrey; color:black"\|Substrate size
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*Up to 8"		*Up to 8"
	\|-		\|-
	\| style="background:LightGrey; color:black"\|~~Substrate materials~~ allowed		\| style="background:LightGrey; color:black"\|Materials allowed
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*All materials that do not stick to the tip or leave residues on the chuck.		*All materials that do not stick to the tip or leave residues on the chuck.

Reet: /* Process information */

2025-07-07T10:30:08Z

Process information

← Older revision		Revision as of 12:30, 7 July 2025
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	*Vendor's description of [https://labmanager.dtu.dk/view_binary.php?fileId=6385 instrument specs including reproducibility and flatness of scans] (''requires login as it seems not freely available from vendor's website'')		*Vendor's description of [https://labmanager.dtu.dk/view_binary.php?fileId=6385 instrument specs including reproducibility and flatness of scans] (''requires login as it seems not freely available from vendor's website'')
	*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]		*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]
	*Vendor's document on 2D stress measurements (also somewhat informative for 3D stress measurements) including info on the automatic fitting to calculate the local radius of the wafer~~: [https://www.kla.com/wp-content/uploads/KLA_AppNote_Stylus_2D_Stress.pdf]~~.		*[https://www.kla.com/wp-content/uploads/KLA_AppNote_Stylus_2D_Stress.pdf Vendor's document on 2D stress measurements (also somewhat informative for 3D stress measurements)] including info on the automatic fitting to calculate the local radius of the wafer.
	*Tips on making [https://labmanager.dtu.dk/view_binary.php?fileId=5543 2D stress measurements] ''(requires login)''. Most users will make 3D stress measurement as described in the regular Nanolab manual for the P17 in LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan - the software does not allow rotation of the stage for this type of scan.		*Tips on making [https://labmanager.dtu.dk/view_binary.php?fileId=5543 2D stress measurements] ''(requires login)''. Most users will make 3D stress measurement as described in the regular Nanolab manual for the P17 in LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan - the software does not allow rotation of the stage for this type of scan.
	<br>		<br>

Reet: /* Process information */

2025-07-07T10:29:11Z

Process information

← Older revision		Revision as of 12:29, 7 July 2025
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	*Vendor's description of [https://labmanager.dtu.dk/view_binary.php?fileId=6385 instrument specs including reproducibility and flatness of scans] (''requires login as it seems not freely available from vendor's website'')		*Vendor's description of [https://labmanager.dtu.dk/view_binary.php?fileId=6385 instrument specs including reproducibility and flatness of scans] (''requires login as it seems not freely available from vendor's website'')
	*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]		*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]
	*Tips on making [https://labmanager.dtu.dk/view_binary.php?fileId=5543 2D stress measurements] ''(requires login)''
	Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not allow rotation of the stage for this type of scan.

	*Vendor's document on 2D stress measurements (also somewhat informative for 3D stress measurements) including info on the automatic fitting to calculate the local radius of the wafer: [https://www.kla.com/wp-content/uploads/KLA_AppNote_Stylus_2D_Stress.pdf].		*Vendor's document on 2D stress measurements (also somewhat informative for 3D stress measurements) including info on the automatic fitting to calculate the local radius of the wafer: [https://www.kla.com/wp-content/uploads/KLA_AppNote_Stylus_2D_Stress.pdf].
			*Tips on making [https://labmanager.dtu.dk/view_binary.php?fileId=5543 2D stress measurements] ''(requires login)''. Most users will make 3D stress measurement as described in the regular Nanolab manual for the P17 in LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan - the software does not allow rotation of the stage for this type of scan.
	<br>		<br>

Reet: /* Process information */

2025-07-07T10:26:20Z

Process information

← Older revision		Revision as of 12:26, 7 July 2025
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	== Process information ==		== Process information ==
	*Info about [[Specific Process Knowledge/Characterization/Dektak XTA#Measurement Accuracy \|measurement accuracy]] (''measured with Dektak XTA'')		*Info about [[Specific Process Knowledge/Characterization/Dektak XTA#Measurement Accuracy \|measurement accuracy]] (''measured with Dektak XTA'')
	*Vendor's description of ~~stress measurements including reproducibility and flatness of scans~~ [https://labmanager.dtu.dk/view_binary.php?fileId=6385] (''requires login as it seems not freely available from ~~Vendor~~'s website'')		*Vendor's description of [https://labmanager.dtu.dk/view_binary.php?fileId=6385 instrument specs including reproducibility and flatness of scans] (''requires login as it seems not freely available from vendor's website'')
	*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]		*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]
	*Tips on making [https://labmanager.dtu.dk/view_binary.php?fileId=5543 2D stress measurements] ''(requires login)''		*Tips on making [https://labmanager.dtu.dk/view_binary.php?fileId=5543 2D stress measurements] ''(requires login)''
	Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not allow rotation of the stage for this type of scan.		Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not allow rotation of the stage for this type of scan.

	*Vendor's document on 2D stress measurements (also somewhat informative for 3D stress measurements) including info on ~~repeatability and scan flatness as well as how~~ the fitting to calculate the local radius of the wafer ~~is done~~: [https://www.kla.com/wp-content/uploads/KLA_AppNote_Stylus_2D_Stress.pdf].		*Vendor's document on 2D stress measurements (also somewhat informative for 3D stress measurements) including info on the automatic fitting to calculate the local radius of the wafer: [https://www.kla.com/wp-content/uploads/KLA_AppNote_Stylus_2D_Stress.pdf].
	<br>		<br>

Reet: /* Process information */

2025-06-26T14:10:43Z

Process information

← Older revision		Revision as of 16:10, 26 June 2025
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	== Process information ==		== Process information ==
	*Info about [[Specific Process Knowledge/Characterization/Dektak XTA#Measurement Accuracy \|measurement accuracy]] (''measured with Dektak XTA'')		*Info about [[Specific Process Knowledge/Characterization/Dektak XTA#Measurement Accuracy \|measurement accuracy]] (''measured with Dektak XTA'')
			*Vendor's description of stress measurements including reproducibility and flatness of scans [https://labmanager.dtu.dk/view_binary.php?fileId=6385] (''requires login as it seems not freely available from Vendor's website'')
	*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]		*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]
	*~~Info about~~ making [https://labmanager.dtu.dk/view_binary.php?fileId=5543 2D stress measurements] ''(requires login)''		*Tips on making [https://labmanager.dtu.dk/view_binary.php?fileId=5543 2D stress measurements] ''(requires login)''
	Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not allow rotation of the stage for this type of scan.		Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not allow rotation of the stage for this type of scan.

			*Vendor's document on 2D stress measurements (also somewhat informative for 3D stress measurements) including info on repeatability and scan flatness as well as how the fitting to calculate the local radius of the wafer is done: [https://www.kla.com/wp-content/uploads/KLA_AppNote_Stylus_2D_Stress.pdf].
	<br>		<br>

Reet: /* How to use the software */

2025-06-25T09:40:38Z

How to use the software

← Older revision		Revision as of 11:40, 25 June 2025
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	[[image:pick-points-drawing.png\|500x500px\|right\|thumb\|How to choose to show only the measured line scans rather than the interpolated surface that APEX likes to calculate (see orange arrow). Screenshot by reet, DTU Nanolab, from Apex.]]		[[image:pick-points-drawing.png\|500x500px\|right\|thumb\|How to choose to show only the measured line scans rather than the interpolated surface that APEX likes to calculate (see orange arrow). Screenshot by reet, DTU Nanolab, from Apex.]]

	There are a number of tutorials and a ~~thorough~~ help document which you will find when you open the program. There is also a small introduction as an appendix to the [https://labmanager.dtu.dk/view_binary.php?fileId=4699 P17 help document] ''(requires login)''.		There are a number of tutorials and a help document which you will find when you open the program. There is also a small introduction as an appendix to the [https://labmanager.dtu.dk/view_binary.php?fileId=4699 P17 help document] ''(requires login)''.

	Apex offers many formats for saving the data in nice reports and various options for exporting data.		Apex offers many formats for saving the data in nice reports and various options for exporting data.

Reet: /* Process information */

2025-06-25T09:38:41Z

Process information

← Older revision		Revision as of 11:38, 25 June 2025
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	*Info about [[Specific Process Knowledge/Characterization/Dektak XTA#Measurement Accuracy \|measurement accuracy]] (''measured with Dektak XTA'')		*Info about [[Specific Process Knowledge/Characterization/Dektak XTA#Measurement Accuracy \|measurement accuracy]] (''measured with Dektak XTA'')
	*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]		*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]
	*Info about making [https://labmanager.dtu.dk/view_binary.php?fileId=~~4699~~ 2D stress measurements] ''(requires login)''		*Info about making [https://labmanager.dtu.dk/view_binary.php?fileId=5543 2D stress measurements] ''(requires login)''
	~~<br>~~		Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not allow rotation of the stage for this type of scan.
	Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not ~~even~~ allow ~~manual~~ rotation of the stage for this type of scan.
	<br>		<br>

Reet: /* Tencor P17 (Stylus Profiler) */

2025-06-25T09:36:17Z

Tencor P17 (Stylus Profiler)

← Older revision		Revision as of 11:36, 25 June 2025
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	<br>		<br>
	= Tencor P17 (Stylus Profiler) =		= Tencor P17 (Stylus Profiler) =
	The P17 Stylus Profiler from KLA Tencor is used in a similar manner to the Dektak XTA ~~for~~ profiling surfaces with structures in the micro- and submicrometer range as well as for measuring [[Specific_Process_Knowledge/Characterization/Stress_measurement\|stress]].		The P17 Stylus Profiler from KLA Tencor is used in a similar manner to the [[Specific Process Knowledge/Characterization/Dektak XTA\|Dektak XTA]] profiling surfaces with structures in the micro- and submicrometer range as well as for measuring [[Specific_Process_Knowledge/Characterization/Stress_measurement\|stress]]. Both of these tools are inside the cleanroom.

	Compared to the DektakXT, the P17 has more advanced options for stress measurements: It allows the user to measure a stress map with up to 5° radial resolution. Programming and analyzing a sequence of predefined scans in fixed locations on a wafer is also easier and the manual for doing it much better for the P17 than for the DektakXT. A disadvantage of the P17 is that is can be hard to locate structures as the maximum field of view of the camera is 1x1.5 mm. We recommend having a map of the sample design available so you can easily locate the features of interest. Otherwise the P17 is easy to use, fast, and accurate, just like the DektakXT.		Compared to the DektakXT, the P17 has more advanced options for stress measurements: It allows the user to measure a stress map with up to 5° radial resolution. Programming and analyzing a sequence of predefined scans in fixed locations on a wafer is also easier and the manual for doing it much better for the P17 than for the DektakXT. A disadvantage of the P17 is that is can be hard to locate structures as the maximum field of view of the camera is 1x1.5 mm. We recommend having a map of the sample design available so you can easily locate the features of interest. Otherwise the P17 is easy to use, fast, and accurate, just like the DektakXT.
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	== Process information ==		== Process information ==
	*Info about [//~~Dektak_XTA~~ Measurement Accuracy] (''measured with Dektak XTA'')		*Info about [[Specific Process Knowledge/Characterization/Dektak XTA#Measurement Accuracy \|measurement accuracy]] (''measured with Dektak XTA'')
	*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]		*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis\|Apex software access & tips]]
	*Info about making [https://labmanager.dtu.dk/view_binary.php?fileId=4699 2D stress measurements] ''(requires login)''		*Info about making [https://labmanager.dtu.dk/view_binary.php?fileId=4699 2D stress measurements] ''(requires login)''
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	\|style="background:LightGrey; color:black"\|Height accuracy z (95 % confidence)		\|style="background:LightGrey; color:black"\|Height accuracy z (95 % confidence)
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	~ 2 % for the smallest range for a 1 micron step and ~ 1 % for a 25 micron step '''for well-defined steps that are easy to measure''' (read about reducing and estimating the measurement uncertainty [[/~~Stylus profiler measurement uncertainty~~\|here]])		~ 2 % for the smallest range for a 1 micron step and ~ 1 % for a 25 micron step '''for well-defined steps that are easy to measure''' (read about reducing and estimating the measurement uncertainty [[Specific Process Knowledge/Characterization/Dektak XTA#Measurement Accuracy \|here]])
	\|-		\|-
	\|style="background:LightGrey; color:black"\|Max scan depth as a function of trench width W		\|style="background:LightGrey; color:black"\|Max scan depth as a function of trench width W