Specific Process Knowledge/Characterization/Stress measurement - Revision history

Reet: /* Stress measurement using XRD */

2025-06-25T09:20:33Z

Stress measurement using XRD

← Older revision		Revision as of 11:20, 25 June 2025
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	Nanolab has the [[Specific_Process_Knowledge/Characterization/XRD/SLSII_analysis\|SmartLab Studio software]] and the Malvern Panalytical HighScore software available for quantifying the stress (ask staff for details). There is a good summary of the principles of the strain calculation in the last section of the [https://labmanager.dtu.dk/view_binary.php?fileId=4247 associated help document] for the SmartLab Studio software.		Nanolab has the [[Specific_Process_Knowledge/Characterization/XRD/SLSII_analysis\|SmartLab Studio software]] and the Malvern Panalytical HighScore software available for quantifying the stress (ask staff for details). There is a good summary of the principles of the strain calculation in the last section of the [https://labmanager.dtu.dk/view_binary.php?fileId=4247 associated help document] for the SmartLab Studio software.

	You may be able to measure the relaxed lattice directly rather than comparing to a theoretical lattice, but you would have to be able to release the film and measure it separately (if this means scraping the thin film off your sample mechanically, you could potentially measure it in the [[~~Specific_Process_Knowledge~~/Characterization/XRD/XRD ~~Powder~~\|XRD ~~Powder~~]], ~~but~~ it ~~would probably~~ be difficult to get enough powder ~~to get a good signal~~).		You may be able to measure the relaxed lattice directly rather than comparing to a theoretical lattice, but you would have to be able to release the film and measure it separately (if this means scraping the thin film off your sample mechanically, you could potentially measure it in the [[Specific Process Knowledge/Characterization/XRD/XRD SmartLab 9kW Rotating Anode\|XRD Rot Anode]], though it may be difficult to get enough powder).

Mmat: /* When a thin film is deposited on both sides of the wafer */

2025-05-28T08:54:29Z

When a thin film is deposited on both sides of the wafer

← Older revision		Revision as of 10:54, 28 May 2025
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	#Measure the thickness of the wafer		#Measure the thickness of the wafer
	#Deposit the thin film		#Deposit the thin film
	#Make a pre-stress measurement. Measure the wafer bow on one of the profilometers ([[Specific Process Knowledge/Characterization/~~Dekatk_XTA~~\|Dektak XTA]] or [[Specific Process Knowledge/Characterization/Tencor P17\|/Tencor P17]]). Save the measurement. It is a good idea to measure across most of the wafer (at least along 70% of the wafer length) in two directions perpendicular to each other. Using the P17 profiler you can also measure a radially resolved map of the wafer stress with up to 5° resolution.		#Make a pre-stress measurement. Measure the wafer bow on one of the profilometers ([[Specific Process Knowledge/Characterization/Dektak XTA\|Dektak XTA]] or [[Specific Process Knowledge/Characterization/Tencor P17\|/Tencor P17]]). Save the measurement. It is a good idea to measure across most of the wafer (at least along 70% of the wafer length) in two directions perpendicular to each other. Using the P17 profiler you can also measure a radially resolved map of the wafer stress with up to 5° resolution.
	#Remove the thin film from one side of the wafer. If it is a single side polished wafer, then remove it on the non-polished side.		#Remove the thin film from one side of the wafer. If it is a single side polished wafer, then remove it on the non-polished side.
	#Make a post-stress measurement. Measure the wafer bow again:		#Make a post-stress measurement. Measure the wafer bow again:

Mmat: /* When a thin film is deposited on both sides of the wafer */

2025-05-28T08:54:00Z

When a thin film is deposited on both sides of the wafer

← Older revision		Revision as of 10:54, 28 May 2025
Line 44:		Line 44:
	#Measure the thickness of the wafer		#Measure the thickness of the wafer
	#Deposit the thin film		#Deposit the thin film
	#Make a pre-stress measurement. Measure the wafer bow on one of the profilometers ([[Specific Process Knowledge/Characterization/~~Profiler#Dektak XTA_new stylus profiler~~\|Dektak XTA]] or [[Specific Process Knowledge/Characterization/~~Profiler#Stylus Profiler (~~Tencor P17)\|P17 ~~Stylus profiler~~]]). Save the measurement. It is a good idea to measure across most of the wafer (at least along 70% of the wafer length) in two directions perpendicular to each other. Using the P17 profiler you can also measure a radially resolved map of the wafer stress with up to 5° resolution.		#Make a pre-stress measurement. Measure the wafer bow on one of the profilometers ([[Specific Process Knowledge/Characterization/Dekatk_XTA\|Dektak XTA]] or [[Specific Process Knowledge/Characterization/Tencor P17\|/Tencor P17]]). Save the measurement. It is a good idea to measure across most of the wafer (at least along 70% of the wafer length) in two directions perpendicular to each other. Using the P17 profiler you can also measure a radially resolved map of the wafer stress with up to 5° resolution.
	#Remove the thin film from one side of the wafer. If it is a single side polished wafer, then remove it on the non-polished side.		#Remove the thin film from one side of the wafer. If it is a single side polished wafer, then remove it on the non-polished side.
	#Make a post-stress measurement. Measure the wafer bow again:		#Make a post-stress measurement. Measure the wafer bow again:

Mmat: /* Stress measurement */

2025-05-27T18:25:24Z

Stress measurement

← Older revision		Revision as of 20:25, 27 May 2025
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	=Stress measurement=		=Stress measurement=

	The stress in a thin film can be quantified with a [~~http:~~/~~/labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge~~/Characterization/~~Profiler~~ profilometer] by measuring the wafer bow before and after deposition of the film. If the thin film is deposited on both sides of the wafer, you can measure the bow after deposition and again after removing the film from one of the sides.		The stress in a thin film can be quantified with a [//Characterization/Topographic_measurement profilometer] by measuring the wafer bow before and after deposition of the film. If the thin film is deposited on both sides of the wafer, you can measure the bow after deposition and again after removing the film from one of the sides.

	If your thin film is crystalline, you can also measure stress using [[#Stress measurement using XRD\|XRD]].		If your thin film is crystalline, you can also measure stress using [[#Stress measurement using XRD\|XRD]].
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	===When a thin film is deposited on one side of the wafer===		===When a thin film is deposited on one side of the wafer===
	#Measure the thickness of the wafer		#Measure the thickness of the wafer
	#Make a pre-stress measurement. Measure the wafer bow on one of the stylus profilometers in the cleanroom, the ([[~~Specific Process Knowledge~~/~~Characterization~~/~~Profiler#Dektak XTA_new stylus profiler\|~~Dektak XTA]] or [[~~Specific Process Knowledge~~/~~Characterization~~/~~Profiler#Stylus Profiler (Tencor P17~~)\|P17 Stylus profiler]]). Save the measurement. It is a good idea to measure across most of the wafer (at least along 70% of the wafer diameter) in two directions perpendicular to each other. Using the P17 profiler you can measure a full radially resolved map of the wafer stress with up to 5° resolution.		#Make a pre-stress measurement. Measure the wafer bow on one of the stylus profilometers in the cleanroom, the ([[//Dektak_XTA Dektak XTA]] or [[//Tencor_P17) P17 Stylus profiler]]). Save the measurement. It is a good idea to measure across most of the wafer (at least along 70% of the wafer diameter) in two directions perpendicular to each other. Using the P17 profiler you can measure a full radially resolved map of the wafer stress with up to 5° resolution.
	#Deposit the thin film		#Deposit the thin film
	#Measure the thickness of the thin film (ex. using the FilmTek or the Ellipsometer).		#Measure the thickness of the thin film (ex. using the FilmTek or the Ellipsometer).

Mmat: /* Types of stress and their origin */

2025-05-27T18:22:02Z