Specific Process Knowledge/Characterization/PL mapper - Revision history

Mmat: /* PhotoLuminescence Mapper RPM2000 */

2025-05-27T17:44:11Z

PhotoLuminescence Mapper RPM2000

← Older revision		Revision as of 19:44, 27 May 2025
Line 13:		Line 13:
	It can also be used to map out voids after silicon wafer-bonding. This is done using the reflectance mapping and is using the fact that silicon is transparent for wavelengths above ~1000nm. A void will therefor change the reflectance in that wavelength range. See datasheet below (Thanks to Jens Hemmingsen for the data).		It can also be used to map out voids after silicon wafer-bonding. This is done using the reflectance mapping and is using the fact that silicon is transparent for wavelengths above ~1000nm. A void will therefor change the reflectance in that wavelength range. See datasheet below (Thanks to Jens Hemmingsen for the data).

	The user manual and contact information can be found in [http://www.labmanager.dtu.dk/function.php?module=Machine&view=view&mach=152 ~~PL mapper\|~~'''LabManager''']		The user manual and contact information can be found in [http://www.labmanager.dtu.dk/function.php?module=Machine&view=view&mach=152 '''LabManager'''].

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Mmat: /* PhotoLuminescence Mapper RPM2000 */

2025-05-27T17:43:45Z

PhotoLuminescence Mapper RPM2000

← Older revision		Revision as of 19:43, 27 May 2025
Line 13:		Line 13:
	It can also be used to map out voids after silicon wafer-bonding. This is done using the reflectance mapping and is using the fact that silicon is transparent for wavelengths above ~1000nm. A void will therefor change the reflectance in that wavelength range. See datasheet below (Thanks to Jens Hemmingsen for the data).		It can also be used to map out voids after silicon wafer-bonding. This is done using the reflectance mapping and is using the fact that silicon is transparent for wavelengths above ~1000nm. A void will therefor change the reflectance in that wavelength range. See datasheet below (Thanks to Jens Hemmingsen for the data).

	~~'''~~The user manual and contact information can be found in ~~LabManager:'''~~		The user manual and contact information can be found in [http://www.labmanager.dtu.dk/function.php?module=Machine&view=view&mach=152 PL mapper\|'''LabManager''']

	[http://www.labmanager.dtu.dk/function.php?module=Machine&view=view&mach=152 PL mapper]

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Mmat at 17:42, 27 May 2025

2025-05-27T17:42:54Z

← Older revision		Revision as of 19:42, 27 May 2025
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			{{cc-nanolab}}

	'''Feedback to this page''': '''[mailto:labadviser@Nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.Nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/characterisation/PL_Mapper click here]'''		'''Feedback to this page''': '''[mailto:labadviser@Nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.Nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/characterisation/PL_Mapper click here]'''
			<br>
			<br>
	==PhotoLuminescence Mapper RPM2000 ==		==PhotoLuminescence Mapper RPM2000 ==

	[[Image:PL-mapper.jpg\|500px\|right\|thumb\|Positioned in the MOCVD room: F-1, {{photo1}}]]		[[Image:PL-mapper.jpg\|500px\|right\|thumb\|Positioned in the MOCVD room: F-1, {{photo1}}]]
	~~{{CC1}}<br>~~
	Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.		Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.

Bghe: /* PhotoLuminescence Mapper RPM2000 */

2023-02-03T09:27:17Z

PhotoLuminescence Mapper RPM2000

← Older revision		Revision as of 11:27, 3 February 2023
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	==PhotoLuminescence Mapper RPM2000 ==		==PhotoLuminescence Mapper RPM2000 ==

	[[Image:PL-mapper.jpg\|500px\|right\|thumb\|Positioned in the MOCVD room: F-1, ~~photo: DTU Nanolab internal~~]]		[[Image:PL-mapper.jpg\|500px\|right\|thumb\|Positioned in the MOCVD room: F-1, {{photo1}}]]
	{{CC1}}<br>		{{CC1}}<br>
	Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.		Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.

Bghe at 09:26, 3 February 2023

2023-02-03T09:26:24Z

← Older revision		Revision as of 11:26, 3 February 2023
Line 4:		Line 4:

	[[Image:PL-mapper.jpg\|500px\|right\|thumb\|Positioned in the MOCVD room: F-1, photo: DTU Nanolab internal]]		[[Image:PL-mapper.jpg\|500px\|right\|thumb\|Positioned in the MOCVD room: F-1, photo: DTU Nanolab internal]]
	~~''This page is done by DTU Nanolab internal''~~		{{CC1}}<br>
	Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.		Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.

Bghe at 10:58, 31 January 2023

2023-01-31T10:58:58Z

← Older revision		Revision as of 12:58, 31 January 2023
Line 7:		Line 7:
	Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.		Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.

	[[Image:Wafer-bonding PL-mapper (LabAdviser) Jehem.jpg\|500px\|right\|thumb\|Map of two bonded silicon wafers. Red areas are voids between the wafers]]		[[Image:Wafer-bonding PL-mapper (LabAdviser) Jehem.jpg\|500px\|right\|thumb\|Map of two bonded silicon wafers. Red areas are voids between the wafers, Made by Jens Hemmingsen @ DTU Nanolab]]
	It can also be used to map out voids after silicon wafer-bonding. This is done using the reflectance mapping and is using the fact that silicon is transparent for wavelengths above ~1000nm. A void will therefor change the reflectance in that wavelength range. See datasheet below (Thanks to Jens Hemmingsen for the data).		It can also be used to map out voids after silicon wafer-bonding. This is done using the reflectance mapping and is using the fact that silicon is transparent for wavelengths above ~1000nm. A void will therefor change the reflectance in that wavelength range. See datasheet below (Thanks to Jens Hemmingsen for the data).

	'''The user manual and contact information can be found in LabManager:'''		'''The user manual and contact information can be found in LabManager:'''

	[http://www.labmanager.dtu.dk/function.php?module=Machine&view=view&mach=152 PL mapper~~, Made by Jens Hemmingsen @ DTU Nanolab~~]		[http://www.labmanager.dtu.dk/function.php?module=Machine&view=view&mach=152 PL mapper]

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Bghe at 10:58, 31 January 2023

2023-01-31T10:58:04Z

← Older revision		Revision as of 12:58, 31 January 2023
Line 12:		Line 12:
	'''The user manual and contact information can be found in LabManager:'''		'''The user manual and contact information can be found in LabManager:'''

	[http://www.labmanager.dtu.dk/function.php?module=Machine&view=view&mach=152 PL mapper]		[http://www.labmanager.dtu.dk/function.php?module=Machine&view=view&mach=152 PL mapper, Made by Jens Hemmingsen @ DTU Nanolab]

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Bghe: /* PhotoLuminescence Mapper RPM2000 */

2023-01-31T10:57:03Z

PhotoLuminescence Mapper RPM2000

← Older revision		Revision as of 12:57, 31 January 2023
Line 3:		Line 3:
	==PhotoLuminescence Mapper RPM2000 ==		==PhotoLuminescence Mapper RPM2000 ==

	[[Image:PL-mapper.jpg\|500px\|right\|thumb\|Positioned in the MOCVD room: F-1]]		[[Image:PL-mapper.jpg\|500px\|right\|thumb\|Positioned in the MOCVD room: F-1, photo: DTU Nanolab internal]]
	''This page is done by DTU Nanolab internal''		''This page is done by DTU Nanolab internal''
	Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.		Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.

Bghe: /* PhotoLuminescence Mapper RPM2000 */

2023-01-31T10:56:10Z

PhotoLuminescence Mapper RPM2000

← Older revision		Revision as of 12:56, 31 January 2023
Line 4:		Line 4:

	[[Image:PL-mapper.jpg\|500px\|right\|thumb\|Positioned in the MOCVD room: F-1]]		[[Image:PL-mapper.jpg\|500px\|right\|thumb\|Positioned in the MOCVD room: F-1]]
			''This page is done by DTU Nanolab internal''
	Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.		Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.

Bghe at 14:20, 6 September 2022

2022-09-06T14:20:59Z

← Older revision		Revision as of 16:20, 6 September 2022
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	\|style="background:LightGrey; color:black"\|RPM viewer		\|style="background:LightGrey; color:black"\|RPM viewer
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*~~Software (free) to view and re-analyse~~ the ~~maps and spectra can be found on Labmanager.~~		*Only on the local PC at the system
	*Direct link to file download [http://labmanager.dtu.dk/view_binary.php?fileId=832 RPM2000 analysis software].
	*The software will request you to get a (free) license key from Nanometrics.
	\|}		\|}