Specific Process Knowledge/Back-end processing/Wire Bonder/new page name - Revision history

Prakus at 08:22, 8 September 2025

2025-09-08T08:22:27Z

← Older revision		Revision as of 10:22, 8 September 2025
Line 113:		Line 113:
	! rowspan="3" align="center" style="background:#f0f0f0;"\| First Bond		! rowspan="3" align="center" style="background:#f0f0f0;"\| First Bond
	\| Ultrasonic Power (US)		\| Ultrasonic Power (US)
	\| ~~150-200~~		\| 160
	\|-		\|-
	\| Bond Time		\| Bond Time
	\| 80~~-200~~		\| 80
	\|-		\|-
	\| Bond Force		\| Bond Force
	\| ~~250-450~~		\| 350
	\|-		\|-
	! rowspan="3" align="center" style="background:#f0f0f0;"\| Second Bond		! rowspan="3" align="center" style="background:#f0f0f0;"\| Second Bond
	\| Ultrasonic Power (US)		\| Ultrasonic Power (US)
	\| ~~150-200~~		\| 180
	\|-		\|-
	\| Bond Time		\| Bond Time
	\| 80~~-200~~		\| 80
	\|-		\|-
	\| Bond Force		\| Bond Force
	\| ~~300-400~~		\| 350
	\|-		\|-
	! rowspan="2" align="center" style="background:#f0f0f0;"\| Wire		! rowspan="2" align="center" style="background:#f0f0f0;"\| Wire
Line 140:		Line 140:
	! rowspan="2" align="center" style="background:#f0f0f0;"\| Loop		! rowspan="2" align="center" style="background:#f0f0f0;"\| Loop
	\| Loop Height		\| Loop Height
	\| 500~~(short length bonds)~~-~~5000 (long length bonds)~~		\| 500-2500
	\|-		\|-
	\| Tail Mode (Clamp Feed Length)		\| Tail Mode (Clamp Feed Length)
	\| 350~~-500~~		\| 200-350
	\|-		\|-
	! rowspan="2" align="center" style="background:#f0f0f0;"\| Temperature		! rowspan="2" align="center" style="background:#f0f0f0;"\| Temperature
	\|-		\|-
	\| Stage		\| Stage
	\|0-120 ~~(No need of temp when high US(>300))~~		\|80-120
	\|-		\|-
	! rowspan="2" align="center" style="background:#f0f0f0;"\| Bond Positions		! rowspan="2" align="center" style="background:#f0f0f0;"\| Bond Positions
	\| First Bond (X1, Y1)		\| First Bond (X1, Y1)
	\| Teach first bond ~~to register coordinates~~		\| Teach first bond
	\|-		\|-
	\| Second Bond (X2, Y2)		\| Second Bond (X2, Y2)
	\|Teach second bond ~~to register coordinates~~		\|Teach second bond
	\|-
	~~! rowspan="2" align="center" style="background:#f0f0f0;"\|Bond directions~~
	\|-
	~~\|Package (P) & chip (1)~~
	~~\|P>P~~

	~~1>1~~

	~~P>1~~

	~~1>P~~
	\|-		\|-
	\|}		\|}


	~~=== Automatic process ===~~

	When creating a new recipe, the bonding plan must be defined at the startup. While setting up a new wire, specify the first and second bond locations, this will automatically register the bonding plan (visible in the Bonding Plan screen).

	The number of wires created will correspond to the number of bonds required. After registering the wires, check the bond direction under the Wire and Chips columns. These directions may appear as P>P, 1>P, or 1>2. Adjust them as needed to match your bonding requirements.

	~~To perform multiple bonds in sequence, select Continue Package. This will make multiple bonds and ensure the ball is created after each bond process.~~

	~~[[File:3_longbond_AltoAu_1to2_8microdistance_Auto_test3_2outof3Autosucess.png\|400px\|left\|thumb\|Autoprocess with bonding plans for different bond lengths and directions ]]~~




	* For more details contact thcl@dtu.dk or prakus@dtu.dk		* For more details contact thcl@dtu.dk or prakus@dtu.dk

Prakus at 15:02, 27 August 2025

2025-08-27T15:02:53Z

@@ Line 169: / Line 169: @@
 |-
 |}
 * For  more details contact  thcl@dtu.dk or prakus@dtu.dk

Prakus at 14:34, 26 August 2025

2025-08-26T14:34:11Z

← Older revision		Revision as of 16:34, 26 August 2025
Line 113:		Line 113:
	! rowspan="3" align="center" style="background:#f0f0f0;"\| First Bond		! rowspan="3" align="center" style="background:#f0f0f0;"\| First Bond
	\| Ultrasonic Power (US)		\| Ultrasonic Power (US)
	\| ~~160~~		\| 150-200
	\|-		\|-
	\| Bond Time		\| Bond Time
	\| 80		\| 80-200
	\|-		\|-
	\| Bond Force		\| Bond Force
	\| ~~350~~		\| 250-450
	\|-		\|-
	! rowspan="3" align="center" style="background:#f0f0f0;"\| Second Bond		! rowspan="3" align="center" style="background:#f0f0f0;"\| Second Bond
	\| Ultrasonic Power (US)		\| Ultrasonic Power (US)
	\| ~~180~~		\| 150-200
	\|-		\|-
	\| Bond Time		\| Bond Time
	\| 80		\| 80-200
	\|-		\|-
	\| Bond Force		\| Bond Force
	\| ~~350~~		\| 300-400
	\|-		\|-
	! rowspan="2" align="center" style="background:#f0f0f0;"\| Wire		! rowspan="2" align="center" style="background:#f0f0f0;"\| Wire
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	! rowspan="2" align="center" style="background:#f0f0f0;"\| Loop		! rowspan="2" align="center" style="background:#f0f0f0;"\| Loop
	\| Loop Height		\| Loop Height
	\| 500-~~2500~~		\| 500(short length bonds)-5000 (long length bonds)
	\|-		\|-
	\| Tail Mode (Clamp Feed Length)		\| Tail Mode (Clamp Feed Length)
	\| ~~200~~-~~350~~		\| 350-500
	\|-		\|-
	! rowspan="2" align="center" style="background:#f0f0f0;"\| Temperature		! rowspan="2" align="center" style="background:#f0f0f0;"\| Temperature
	\|-		\|-
	\| Stage		\| Stage
	\|80-120		\|0-120 (No need of temp when high US(>300))
	\|-		\|-
	! rowspan="2" align="center" style="background:#f0f0f0;"\| Bond Positions		! rowspan="2" align="center" style="background:#f0f0f0;"\| Bond Positions
	\| First Bond (X1, Y1)		\| First Bond (X1, Y1)
	\| Teach first bond		\| Teach first bond to register coordinates
	\|-		\|-
	\| Second Bond (X2, Y2)		\| Second Bond (X2, Y2)
	\|Teach second bond		\|Teach second bond to register coordinates
			\|-
			! rowspan="2" align="center" style="background:#f0f0f0;"\|Bond directions
			\|-
			\|Package (P) & chip (1)
			\|P>P

			1>1

			P>1

			1>P
	\|-		\|-
	\|}		\|}

Prakus at 09:35, 13 August 2025

2025-08-13T09:35:39Z

← Older revision		Revision as of 11:35, 13 August 2025
Line 160:		Line 160:


	* For more details contact ~~tool responsible personal~~. or prakus@dtu.dk		* For more details contact thcl@dtu.dk or prakus@dtu.dk

Prakus at 09:02, 13 August 2025

2025-08-13T09:02:13Z

← Older revision		Revision as of 11:02, 13 August 2025
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	\|-		\|-
	\|}		\|}


			* For more details contact tool responsible personal. or prakus@dtu.dk

Prakus: /* Process parameters for Gold wire (25µm) */

2025-08-13T08:56:22Z

Process parameters for Gold wire (25µm)

@@ Line 106: / Line 106: @@
 The TPT HB100 wire bonder is supplied with wires and tools, and can be configured to mount either 25 µm diameter gold wire or 33 µm diameter aluminium wire. To change the wire, please contact the tool’s responsible person.
 The system features motorized Z, Y, and X axes along with bond head rotation, enabling precise and flexible operation. The integrated TPT software includes a library of recipe templates, allowing users to create and customize process recipes according to the bonding method and wire type.
-===Process parameters for Gold wire (25µm)===
+=== HB100 Bonding Parameters – 25 µm Gold Wire===

Prakus at 08:50, 13 August 2025

2025-08-13T08:50:45Z

← Older revision		Revision as of 10:50, 13 August 2025
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	=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png\|200px]]=		=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png\|200px]]=







	~~TPT HB100 wire bonder comes with wires and tools and has option for mounting Gold wire (dia.: 25µm) or Aluminum wire (dia.: 33µm). write to the tool responsible person for changing wire.~~
	~~The system has motorized Z-Y-X Axes and Bond Head Rotation. The TPT software has template of recipes allowing user to set up their own process recipe based on type of bonding and wire.~~

Prakus at 08:50, 13 August 2025

2025-08-13T08:50:27Z

← Older revision		Revision as of 10:50, 13 August 2025
Line 13:		Line 13:
	TPT HB100 wire bonder comes with wires and tools and has option for mounting Gold wire (dia.: 25µm) or Aluminum wire (dia.: 33µm). write to the tool responsible person for changing wire.		TPT HB100 wire bonder comes with wires and tools and has option for mounting Gold wire (dia.: 25µm) or Aluminum wire (dia.: 33µm). write to the tool responsible person for changing wire.
	The system has motorized Z-Y-X Axes and Bond Head Rotation. The TPT software has template of recipes allowing user to set up their own process recipe based on type of bonding and wire.		The system has motorized Z-Y-X Axes and Bond Head Rotation. The TPT software has template of recipes allowing user to set up their own process recipe based on type of bonding and wire.




Line 113:		Line 111:
	\|}		\|}
	''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.''		''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.''
			-------------------------------------
			The TPT HB100 wire bonder is supplied with wires and tools, and can be configured to mount either 25 µm diameter gold wire or 33 µm diameter aluminium wire. To change the wire, please contact the tool’s responsible person.
			The system features motorized Z, Y, and X axes along with bond head rotation, enabling precise and flexible operation. The integrated TPT software includes a library of recipe templates, allowing users to create and customize process recipes according to the bonding method and wire type.
	===Process parameters for Gold wire (25µm)===		===Process parameters for Gold wire (25µm)===

Prakus: /* Table: HB100 Full Technical Specifications */

2025-08-13T08:49:18Z

Table: HB100 Full Technical Specifications

← Older revision		Revision as of 10:49, 13 August 2025
Line 16:		Line 16:


	~~===Table: HB100 Full Technical Specifications===~~

	{\| border="2" cellpadding="4" cellspacing="0" style="border-collapse:collapse; width:100%;"		{\| border="2" cellpadding="4" cellspacing="0" style="border-collapse:collapse; width:100%;"
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	\|}		\|}
	''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.''		''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.''


	===Process parameters for Gold wire (25µm)===		===Process parameters for Gold wire (25µm)===

Prakus at 08:48, 13 August 2025

2025-08-13T08:48:58Z

← Older revision		Revision as of 10:48, 13 August 2025
Line 21:		Line 21:
	\|+ style="font-weight:bold; font-size:110%;" \| '''HB100 Full Technical Specifications'''		\|+ style="font-weight:bold; font-size:110%;" \| '''HB100 Full Technical Specifications'''
	\|-		\|-
	! rowspan="6" align="center" style="background:#f0f0f0;"\| Bonding Specifications		! rowspan="4" align="center" style="background:#f0f0f0;"\| Bonding Specifications
	\| Bonding Methods		\| Bonding Methods
	\| Wedge–Wedge, Ball–Wedge, Ribbon, Bump		\| Wedge–Wedge, Ball–Wedge, Ribbon, Bump
Line 58:		Line 58:
	\|-		\|-
	\| Bonding Tool Size		\| Bonding Tool Size
	\| 1.58 mm Ø × 19 mm length (0.~~0624”~~ × 0.~~750”~~)		\| 1.58 mm Ø × 19 mm length (0.0624" × 0.750")
	\|-		\|-
	\| Wire Termination		\| Wire Termination
Line 68:		Line 68:
	\|-		\|-
	\| Motorized Z Travel		\| Motorized Z Travel
	\| 100 mm (3.9”)		\| 100 mm (3.9")
	\|-		\|-
	\| X–Y Drive / Resolution		\| X–Y Drive / Resolution
Line 74:		Line 74:
	\|-		\|-
	\| Motorized X–Y Travel		\| Motorized X–Y Travel
	\| 100 mm (3.9”)		\| 100 mm (3.9")
	\|-		\|-
	\| Max. Component Width		\| Max. Component Width
	\| 400 mm (15.7”)		\| 400 mm (15.7")
	\|-		\|-
	\| Rotation Drive Accuracy		\| Rotation Drive Accuracy
Line 87:		Line 87:
	\|-		\|-
	\| Screen Size		\| Screen Size
	\| ~~21”~~ touchscreen		\| 21" touchscreen
	\|-		\|-
	\| Software Environment		\| Software Environment
Line 114:		Line 114:
	\|}		\|}
	''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.''		''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.''


	===Process parameters for Gold wire (25µm)===		===Process parameters for Gold wire (25µm)===