Specific Process Knowledge/Back-end processing/Disco Saw - Revision history

Jesyup at 13:33, 9 June 2026

2026-06-09T13:33:29Z

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 *UV curing station (Powatec U200)
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2026-06-09T13:30:45Z

Comparison of Disco DAD 321 and DAD 3241 Dicing tools

2026-06-09T13:29:55Z

Comparison of Disco DAD 321 and DAD 3241 Dicing tools

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 *UV curing station (Powatec U200)
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2026-06-09T12:58:40Z

Recommended dicing parameters

← Older revision		Revision as of 14:58, 9 June 2026
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	\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm		\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm
	\|-		\|-
	\|SiC***\|\|~~DAD321~~ \|\|ZP07 \|\|1 mm/s \|\|15'000 \|\|0.5mm		\|SiC***\|\|DAD3241 \|\|ZP07 \|\|1 mm/s \|\|15'000 \|\|0.5mm
	\|}		\|}
	(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>		(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>

2026-06-09T12:55:33Z

Recommended dicing parameters

← Older revision		Revision as of 14:55, 9 June 2026
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	\|}		\|}
	(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>		(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>
	(**) Tested once 26-05-08, no systematic test done		(**) Tested once 26-05-08, no systematic test done <br>
	(***) Tested once 25-10-29, no systematic test done		(***) Tested once 25-10-29, no systematic test done

2026-06-09T12:55:13Z

Recommended dicing parameters

← Older revision		Revision as of 14:55, 9 June 2026
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	\|-		\|-
	\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm		\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm
			\|-
			\|SiC***\|\|DAD321 \|\|ZP07 \|\|1 mm/s \|\|15'000 \|\|0.5mm
	\|}		\|}
	(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>		(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>
	(**) Tested once 26-05-08, no systematic test done		(**) Tested once 26-05-08, no systematic test done
			(***) Tested once 25-10-29, no systematic test done

	=== Available blades ===		=== Available blades ===

2026-05-08T10:37:01Z

Recommended dicing parameters

← Older revision		Revision as of 12:37, 8 May 2026
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	=== Recommended dicing parameters ===		=== Recommended dicing parameters ===
	WIP		WIP
	DTU Nanolab offers 2 different blades for different ~~use cases~~. See recommended parameters below.		DTU Nanolab offers 2 different blades for different bulk materials. See recommended parameters below. If your sample consists of a thinfilm (less than 5µm) on a bulk carrier, then use parameters for the bulk material.

	For other materials/blades consult tool responsible.		For other materials/blades consult tool responsible.
Line 183:		Line 183:
	\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm		\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm
	\|}		\|}
	(*) Multiple cuts at the same location can be done if deeper cuts are needed		(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>
	(**) Tested once 26-05-08, no systematic test done		(**) Tested once 26-05-08, no systematic test done

2026-05-08T10:31:46Z

Recommended dicing parameters: LiNbO3 added

← Older revision		Revision as of 12:31, 8 May 2026
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	\|-		\|-
	\|Bonded Si/Pyrex\|\|DAD321 \|\|B1A862 \|\|0.5 mm/s \|\|15'000 \|\|0.5mm		\|Bonded Si/Pyrex\|\|DAD321 \|\|B1A862 \|\|0.5 mm/s \|\|15'000 \|\|0.5mm
			\|-
			\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm
	\|}		\|}
	(*) Multiple cuts at the same location can be done if deeper cuts are needed		(*) Multiple cuts at the same location can be done if deeper cuts are needed
			(**) Tested once 26-05-08, no systematic test done

	=== Available blades ===		=== Available blades ===

2026-02-03T09:46:34Z

Recommended dicing parameters

← Older revision		Revision as of 11:46, 3 February 2026
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	=== Recommended dicing parameters ===		=== Recommended dicing parameters ===
			WIP
	DTU Nanolab offers 2 different blades for different use cases. See recommended parameters below.		DTU Nanolab offers 2 different blades for different use cases. See recommended parameters below.

2026-01-29T14:27:46Z

@@ Line 10: / Line 10: @@
 In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.
-'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
+==Comparison of Disco DAD 321 and DAD 3241 Dicing tools==
 {| border="2" cellspacing="0" cellpadding="10"
@@ Line 155: / Line 127: @@
-<br clear="all" />
+== Process information ==
 ===Comparing dicing parameters for different materials '''DAD 321'''===