Specific Process Knowledge/Back-end processing/Disco Saw - Revision history

Jesyup: /* Recommended dicing parameters */

2026-05-08T10:37:01Z

Recommended dicing parameters

← Older revision		Revision as of 12:37, 8 May 2026
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	=== Recommended dicing parameters ===		=== Recommended dicing parameters ===
	WIP		WIP
	DTU Nanolab offers 2 different blades for different ~~use cases~~. See recommended parameters below.		DTU Nanolab offers 2 different blades for different bulk materials. See recommended parameters below. If your sample consists of a thinfilm (less than 5µm) on a bulk carrier, then use parameters for the bulk material.

	For other materials/blades consult tool responsible.		For other materials/blades consult tool responsible.
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	\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm		\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm
	\|}		\|}
	(*) Multiple cuts at the same location can be done if deeper cuts are needed		(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>
	(**) Tested once 26-05-08, no systematic test done		(**) Tested once 26-05-08, no systematic test done

Jesyup: /* Recommended dicing parameters */ LiNbO3 added

2026-05-08T10:31:46Z

Recommended dicing parameters: LiNbO3 added

← Older revision		Revision as of 12:31, 8 May 2026
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	\|-		\|-
	\|Bonded Si/Pyrex\|\|DAD321 \|\|B1A862 \|\|0.5 mm/s \|\|15'000 \|\|0.5mm		\|Bonded Si/Pyrex\|\|DAD321 \|\|B1A862 \|\|0.5 mm/s \|\|15'000 \|\|0.5mm
			\|-
			\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm
	\|}		\|}
	(*) Multiple cuts at the same location can be done if deeper cuts are needed		(*) Multiple cuts at the same location can be done if deeper cuts are needed
			(**) Tested once 26-05-08, no systematic test done

	=== Available blades ===		=== Available blades ===

Jesyup: /* Recommended dicing parameters */

2026-02-03T09:46:34Z

Recommended dicing parameters

← Older revision		Revision as of 11:46, 3 February 2026
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	=== Recommended dicing parameters ===		=== Recommended dicing parameters ===
			WIP
	DTU Nanolab offers 2 different blades for different use cases. See recommended parameters below.		DTU Nanolab offers 2 different blades for different use cases. See recommended parameters below.

Jesyup at 14:27, 29 January 2026

2026-01-29T14:27:46Z

@@ Line 10: / Line 10: @@
 In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.
-'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
+==Comparison of Disco DAD 321 and DAD 3241 Dicing tools==
 {| border="2" cellspacing="0" cellpadding="10"
@@ Line 155: / Line 127: @@
-<br clear="all" />
+== Process information ==
 ===Comparing dicing parameters for different materials '''DAD 321'''===

Jesyup at 13:17, 29 January 2026

2026-01-29T13:17:49Z

← Older revision		Revision as of 15:17, 29 January 2026
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	\|-		\|-
	\|}		\|}





	{\|		{\|
	\| [[Image:IMG 20230228 113101.jpg\|thumb~~\|left~~\|Wafer mounting table for DAD 321]]\|\| [[Image:IMG 20230228 ~~113035~~.jpg\|thumb\|~~UV curing/Tape release~~]]\|\| [[Image:IMG 20230228 ~~113020~~.jpg\|thumb\|Wafer ~~mounter~~ for DAD 3241]]		\|-
			\|[[Image:IMG 20230228 113101.jpg\|thumb\|Wafer mounting table for DAD 321]]
			\|rowspan="2"\|[[Image:IMG 20230228 113020.jpg\|thumb\|Wafer mounter for DAD 3241]]
			\|rowspan="2"\|[[Image:IMG 20230228 113045.jpg\|thumb\|Wafer cleaning station DCS 1441]]
			\|-
			\|[[Image:IMG 20230228 113035.jpg\|thumb\|UV curing/Tape release for DAD 3241]]
			\|
	\|}		\|}


	<br clear="all" />		<br clear="all" />

	===Comparing dicing parameters for different materials '''DAD 321'''===		===Comparing dicing parameters for different materials '''DAD 321'''===

	~~[[Image:IMG 20230228 113045.jpg\|300px\|thumb\|Wafer cleaning station DCS 1441]]~~

	Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters		Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters

Jesyup at 13:01, 29 January 2026

2026-01-29T13:01:37Z

← Older revision		Revision as of 15:01, 29 January 2026
Line 1:		Line 1:
	'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Disco_Saw click here]'''		'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Disco_Saw click here]'''

	==Disco Automatic dicing saw, model DAD321 and DAD3241==		=Disco Automatic dicing saw, model DAD321 and DAD3241=
	DTU nanolab ~~has~~ 2 ~~saw~~ available for dicing substrates into separate chips. Both tools offer versatile processing capabilities, high precision and reliability.		DTU nanolab have 2 saws available for dicing substrates into separate chips. Both tools offer versatile processing capabilities, high precision and reliability.

	The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this room is not under filter. Generally speaking the dicing process is very dirty, and you should expect particle contaminants on your device.		The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this room is not under filter. Generally speaking the dicing process is very dirty, and you should expect particle contaminants on your device.
Line 10:		Line 10:
	In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom\|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.		In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom\|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.

			== Process information ==

			'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
			<!-- remember to remove the type of documents that are not present -->
			<!-- give the link to the equipment info page in LabManager: -->
			*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=168 DAD 321 Saw in LabManager]
			*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=489 DAD 3241 Saw in LabManager]

	===Dicing layout===		===Dicing layout===
	~~Please consider your layout of dies on your wafer.~~ The dicer ~~can~~ only ~~cut~~ straight lines across the entire ~~wafer~~.		The dicer is only capable of cutting straight, uninterrupted lines across the entire substrate. Therefore each the position of each individual die must be carefully considered to maximize yield.
	Please see the illustrations for a good and a bad design.		Please see the below illustrations for a good and a bad design.

	{\| cellpadding="2" style="border: 2px solid darkgray;"		{\| cellpadding="2" style="border: 2px solid darkgray;"
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	\|}		\|}

	~~== Process information ==~~		The simplest design consists of identically sized chips placed at constant pitch across an entire wafer. While it is possible to cut at varying pitches, it requires a more complex program and leaves more room for user errors.

	*'''The ~~user manual, user APV~~, ~~technical information~~ and ~~contact information can be found in LabManager:'''~~
	~~<!-- remember to remove the type of documents that are not present -->~~
	~~<!-- give the link to the equipment info page in LabManager: -->~~
	**[http://labmanager.nanolab.dtu.dk/function.php?module=Machine&view=view&mach=168 DAD 321 Saw in LabManager]
	**[http://labmanager.nanolab.dtu.dk/function.php?module=Machine&view=view&mach=489 DAD 3241 Saw in LabManager]

	*[[Specific Process Knowledge/Back-end processing/Disco Saw#Comparing dicing parameters for ~~different materials \|Comparing dicing parameters for different materials]]~~
	~~<!--*[[Specific Process Knowledge/Back-end processing/Disco Saw#Images of diced samples \|Images of diced samples]]~~
	*Dicing work sheet: [[Media:Dicing Work Sheet v2.docx \|Dicing Work Sheet v2.docx]] Fill out before requesting dicing.


	===Overview of the performance Disco DAD 321 and DAD 3241 Dicer===		===Overview of the performance Disco DAD 321 and DAD 3241 Dicer===

	~~[[Image:IMG 20230228 113020.jpg\|thumb\|Wafer mounter for DAD 3241]]~~

	{\| border="2" cellspacing="0" cellpadding="10"		{\| border="2" cellspacing="0" cellpadding="10"
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	*Color screen		*Color screen
	\|-		\|-
	!style="background:silver; color:black;" align="left" rowspan="2"\|Purpose		!style="background:silver; color:black;" align="left" rowspan="3"\|Purpose
	\|style="background:LightGrey; color:black"\|Main usage		\|style="background:LightGrey; color:black"\|Main usage
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	~~Dicing~~ Borofloat ~~and~~ Fused Silica ~~wafers~~		*Borofloat
			*Fused Silica
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	~~Dicing~~ Silicon wafers		*Silicon wafers
	\|-		\|-
	\|style="background:LightGrey; color:black"\|~~Wafer~~ type		\|style="background:LightGrey; color:black" rowspan="2"\|Substrate type
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|

	*'''Pyrex/Borofloat'''		*'''Pyrex/Borofloat'''
	*'''~~Fused Silica~~'''		*'''Silicon bonded to Silicon'''
	*'''Silicon bonded to Pyrex/Borofloat'''		*'''Silicon bonded to Pyrex/Borofloat'''
	*~~'''~~Silicon ~~bonded to Silicon'''~~		*Silicon
	* Other materials - ask
	*Pure Silicon samples
	\|style="background:WhiteSmoke; color:black"\|		\|style="background:WhiteSmoke; color:black"\|
	*'''~~Pure~~ Silicon ~~samples~~'''		*'''Silicon'''
	*Pyrex/Borofloat		*Pyrex/Borofloat
	*Silicon bonded to Silicon		*Silicon bonded to Silicon
	*Silicon bonded to Pyrex/Borofloat		*Silicon bonded to Pyrex/Borofloat
	* Other materials ~~- ask~~		\|-
			\|style="background:WhiteSmoke; color:black" colspan="2"\|
			For other materials, contact tool responsible
			(See Labmanager)
	\|-		\|-
	!style="background:silver; color:black" align="left" valign="top" rowspan="5"\|Performance		!style="background:silver; color:black" align="left" valign="top" rowspan="5"\|Performance
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	\|}		\|}

	[[Image:IMG 20230228 113101.jpg\|thumb~~\|600px~~\|left\|Wafer mounting table for DAD 321]]
	[[Image:IMG 20230228 113035.jpg\|thumb~~\|600px~~\|UV curing/Tape release]]


			{\|
			\| [[Image:IMG 20230228 113101.jpg\|thumb\|left\|Wafer mounting table for DAD 321]]\|\| [[Image:IMG 20230228 113035.jpg\|thumb\|UV curing/Tape release]]\|\| [[Image:IMG 20230228 113020.jpg\|thumb\|Wafer mounter for DAD 3241]]
			\|}

	<br clear="all" />		<br clear="all" />

Jesyup at 10:10, 29 January 2026

2026-01-29T10:10:18Z

← Older revision		Revision as of 12:10, 29 January 2026
Line 6:		Line 6:
	The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this room is not under filter. Generally speaking the dicing process is very dirty, and you should expect particle contaminants on your device.		The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this room is not under filter. Generally speaking the dicing process is very dirty, and you should expect particle contaminants on your device.

	[[File:IMG_20230228_112922.jpg~~\|center~~\|thumb\|\|Dicers positioned on 1. floor bldg 346 room 157]]		[[File:IMG_20230228_112922.jpg\|thumb\|\|Dicers positioned on 1. floor bldg 346 room 157]]
	~~<div style="clear: both"></div>~~

	In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom\|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.		In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom\|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.

Jesyup at 10:07, 29 January 2026

2026-01-29T10:07:37Z

← Older revision		Revision as of 12:07, 29 January 2026
Line 1:		Line 1:
	'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Disco_Saw click here]'''		'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Disco_Saw click here]'''

	==Disco Automatic dicing saw, model DAD321 ~~(old)~~ and DAD3241 ~~(new 2021)~~==		==Disco Automatic dicing saw, model DAD321 and DAD3241==
	~~The dicers feature~~ versatile processing capabilities, ~~compact designs, and~~ high precision and reliability~~. Users perform workpiece loading, alignment, and unloading manually~~.		DTU nanolab has 2 saw available for dicing substrates into separate chips. Both tools offer versatile processing capabilities, high precision and reliability.

	The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this is not ~~a cleanroom and that~~ the dicing process is very dirty.		The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this room is not under filter. Generally speaking the dicing process is very dirty, and you should expect particle contaminants on your device.
	~~<!--~~
	~~[[Image:Disco_DAD_321_Dicer.jpg\|thumb\|Dicer positioned~~ on 1. ~~floor bldg 346 room 157]]~~
	~~[[Image:DAD_3241_picture.jpg\|thumb\|Dicer positioned on 1. floor bldg 346 room 157]]~~
	~~-->~~

	~~In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions~~ [[~~Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom~~\|~~here~~]] to apply for approval. Your samples have to be thoroughly cleaned in the gowning area and get a Piranha cleaning. You will only be allowed to use a limited number of tools for the processing after dicing.		[[File:IMG_20230228_112922.jpg\|center\|thumb\|\|Dicers positioned on 1. floor bldg 346 room 157]]
			<div style="clear: both"></div>

	[[~~File:IMG_20230228_112922.jpg\|thumb\|800px~~\|~~Dicers positioned on 1. floor bldg 346 room 157~~]]		In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom\|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.

	Please consider your layout of dies on your wafer. The dicer can only cut straight lines across the ~~wafer and you can not end a line in the middle of the~~ wafer.
			===Dicing layout===
			Please consider your layout of dies on your wafer. The dicer can only cut straight lines across the entire wafer.
	Please see the illustrations for a good and a bad design.		Please see the illustrations for a good and a bad design.

Line 41:		Line 40:

	*[[Specific Process Knowledge/Back-end processing/Disco Saw#Comparing dicing parameters for different materials \|Comparing dicing parameters for different materials]]		*[[Specific Process Knowledge/Back-end processing/Disco Saw#Comparing dicing parameters for different materials \|Comparing dicing parameters for different materials]]
	*[[Specific Process Knowledge/Back-end processing/Disco Saw#Images of diced samples \|Images of diced samples]]		<!--*[[Specific Process Knowledge/Back-end processing/Disco Saw#Images of diced samples \|Images of diced samples]]
	*Dicing work sheet: [[Media:Dicing Work Sheet v2.docx \|Dicing Work Sheet v2.docx]] Fill out before requesting dicing.		*Dicing work sheet: [[Media:Dicing Work Sheet v2.docx \|Dicing Work Sheet v2.docx]] Fill out before requesting dicing.

Jesyup at 13:18, 23 January 2026

2026-01-23T13:18:19Z

@@ Line 234: / Line 234: @@
 ===Images of diced samples===
 [[Image:Dicetest_001.jpg|300x300px|thumb|Si V-groove diced with ZH05 blade |left]]
 -->

Jesyup: Linked page for brining in samples to cleanroom

2025-04-07T09:31:19Z

Linked page for brining in samples to cleanroom

← Older revision		Revision as of 11:31, 7 April 2025
Line 10:		Line 10:
	-->		-->

	In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this. Your samples have to be thoroughly cleaned in the gowning area and get a Piranha cleaning. You will only be allowed to use a limited number of tools for the processing after dicing.		In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom\|here]] to apply for approval. Your samples have to be thoroughly cleaned in the gowning area and get a Piranha cleaning. You will only be allowed to use a limited number of tools for the processing after dicing.

	[[File:IMG_20230228_112922.jpg\|thumb\|800px\|Dicers positioned on 1. floor bldg 346 room 157]]		[[File:IMG_20230228_112922.jpg\|thumb\|800px\|Dicers positioned on 1. floor bldg 346 room 157]]