Specific Process Knowledge/Back-end processing/Disco Saw - Revision history

Mmat: /* Disco Automatic dicing saw, model DAD321 and DAD3241 */

2026-09-25T13:45:59Z

Disco Automatic dicing saw, model DAD321 and DAD3241

← Older revision		Revision as of 15:45, 25 September 2026
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	[[File:IMG_20230228_112922.jpg\|thumb\|\|Dicers positioned on 1. floor bldg 346 room 157]]		[[File:IMG_20230228_112922.jpg\|thumb\|\|Dicers positioned on 1. floor bldg 346 room 157]]

	In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/~~Bring samples into cleanroom~~\|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.		In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring_samples_into_Cleanroom_or_PolyFabLab\|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.

2026-06-09T13:33:29Z

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 *UV curing station (Powatec U200)
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2026-06-09T13:30:45Z

Comparison of Disco DAD 321 and DAD 3241 Dicing tools

2026-06-09T13:29:55Z

Comparison of Disco DAD 321 and DAD 3241 Dicing tools

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 *UV curing station (Powatec U200)
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2026-06-09T12:58:40Z

Recommended dicing parameters

← Older revision		Revision as of 14:58, 9 June 2026
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	\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm		\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm
	\|-		\|-
	\|SiC***\|\|~~DAD321~~ \|\|ZP07 \|\|1 mm/s \|\|15'000 \|\|0.5mm		\|SiC***\|\|DAD3241 \|\|ZP07 \|\|1 mm/s \|\|15'000 \|\|0.5mm
	\|}		\|}
	(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>		(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>

2026-06-09T12:55:33Z

Recommended dicing parameters

← Older revision		Revision as of 14:55, 9 June 2026
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	\|}		\|}
	(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>		(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>
	(**) Tested once 26-05-08, no systematic test done		(**) Tested once 26-05-08, no systematic test done <br>
	(***) Tested once 25-10-29, no systematic test done		(***) Tested once 25-10-29, no systematic test done

2026-06-09T12:55:13Z

Recommended dicing parameters

← Older revision		Revision as of 14:55, 9 June 2026
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	\|-		\|-
	\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm		\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm
			\|-
			\|SiC***\|\|DAD321 \|\|ZP07 \|\|1 mm/s \|\|15'000 \|\|0.5mm
	\|}		\|}
	(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>		(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>
	(**) Tested once 26-05-08, no systematic test done		(**) Tested once 26-05-08, no systematic test done
			(***) Tested once 25-10-29, no systematic test done

	=== Available blades ===		=== Available blades ===

2026-05-08T10:37:01Z

Recommended dicing parameters

← Older revision		Revision as of 12:37, 8 May 2026
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	=== Recommended dicing parameters ===		=== Recommended dicing parameters ===
	WIP		WIP
	DTU Nanolab offers 2 different blades for different ~~use cases~~. See recommended parameters below.		DTU Nanolab offers 2 different blades for different bulk materials. See recommended parameters below. If your sample consists of a thinfilm (less than 5µm) on a bulk carrier, then use parameters for the bulk material.

	For other materials/blades consult tool responsible.		For other materials/blades consult tool responsible.
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	\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm		\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm
	\|}		\|}
	(*) Multiple cuts at the same location can be done if deeper cuts are needed		(*) Multiple cuts at the same location can be done if deeper cuts are needed <br>
	(**) Tested once 26-05-08, no systematic test done		(**) Tested once 26-05-08, no systematic test done

2026-05-08T10:31:46Z

Recommended dicing parameters: LiNbO3 added

← Older revision		Revision as of 12:31, 8 May 2026
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	\|-		\|-
	\|Bonded Si/Pyrex\|\|DAD321 \|\|B1A862 \|\|0.5 mm/s \|\|15'000 \|\|0.5mm		\|Bonded Si/Pyrex\|\|DAD321 \|\|B1A862 \|\|0.5 mm/s \|\|15'000 \|\|0.5mm
			\|-
			\|LiNbO3**\|\|DAD321 \|\|B1A862 \|\|1-3 mm/s \|\|15'000 \|\|0.5mm
	\|}		\|}
	(*) Multiple cuts at the same location can be done if deeper cuts are needed		(*) Multiple cuts at the same location can be done if deeper cuts are needed
			(**) Tested once 26-05-08, no systematic test done

	=== Available blades ===		=== Available blades ===

2026-02-03T09:46:34Z

Recommended dicing parameters

← Older revision		Revision as of 11:46, 3 February 2026
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	=== Recommended dicing parameters ===		=== Recommended dicing parameters ===
			WIP
	DTU Nanolab offers 2 different blades for different use cases. See recommended parameters below.		DTU Nanolab offers 2 different blades for different use cases. See recommended parameters below.