Specific Process Knowledge/Back-end processing/Die Bonder - Revision history

Mmat: /* Process information */

2025-07-03T14:52:22Z

Process information

← Older revision		Revision as of 16:52, 3 July 2025
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	== Process information ==		== Process information ==

	*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding\|Au-Sn eutectic die bonding]]		none
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Mmat: /* Die bonder (eutectic metal soldering) */

2025-07-03T14:50:49Z

Die bonder (eutectic metal soldering)

← Older revision		Revision as of 16:50, 3 July 2025
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	The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.		The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

	~~[[Image:section under construction.jpg\|70px]]~~ ''~~Will be~~ temporary taken out of service during the PolyFabLab construction.''		''The Cammax EDB80 Die bonder is currently (only temporary) taken out of service during the PolyFabLab construction.''

	The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.		The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.

Jehan at 13:59, 6 March 2023

2023-03-06T13:59:36Z

← Older revision		Revision as of 15:59, 6 March 2023
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	The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.		The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

			[[Image:section under construction.jpg\|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.''

	The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.		The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.

Kabi: /* Equipment performance and process related parameters */

2022-03-23T11:11:18Z

Equipment performance and process related parameters

← Older revision		Revision as of 13:11, 23 March 2022
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	!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment		!colspan="2" border="none" style="background:silver; color:black;" align="center"\|Equipment
	\|style="background:WhiteSmoke; color:black"\|<b>Die bonder</b>		\|style="background:WhiteSmoke; color:black"\|<b>Die bonder</b>
	~~\|style="background:WhiteSmoke; color:black"\|<b>Flip-chip bonder</b>~~
	\|-		\|-
	!style="background:silver; color:black;" align="center" width="60"\|Purpose		!style="background:silver; color:black;" align="center" width="60"\|Purpose
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	*Fine placement of dies		*Fine placement of dies
	*Eutectic metal soldering		*Eutectic metal soldering
	~~\|style="background:WhiteSmoke; color:black"\|~~
	*Fine placement of dies
	*Glue attachment
	\|-		\|-
	!style="background:silver; color:black;" align="center" width="60"\|Performance		!style="background:silver; color:black;" align="center" width="60"\|Performance
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	*Low thermal resistance		*Low thermal resistance
	*Always conducting		*Always conducting
	~~\|style="background:WhiteSmoke; color:black"\|~~
	*Medium or High thermal resistance
	*Possibility of both conducting and isolating adhesives
	*If an epoxy based adhesive is used the user is required to have the epoxy course.
	\|-		\|-
	!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates		!style="background:silver; color:black" align="center" valign="center" rowspan="3"\|Substrates
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	*Should be able to withstand the soldering temperature		*Should be able to withstand the soldering temperature
	*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)		*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)
	~~\|style="background:WhiteSmoke; color:black"\|~~
	*Any that is compatible with the glue and temperature used
	\|-		\|-
	\|}		\|}

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Kabi: /* Flip-chip bonder (glue attachment) */

2022-03-23T11:07:58Z

Flip-chip bonder (glue attachment)

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 ==Equipment performance and process related parameters==

Jmli at 16:40, 25 November 2019

2019-11-25T16:40:27Z

← Older revision		Revision as of 18:40, 25 November 2019
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	<!-- Replace "http://labadviser.nanolab.dtu.dk/..." with the link to the Labadviser page-->		<!-- Replace "http://labadviser.nanolab.dtu.dk/..." with the link to the Labadviser page-->

	[[image:Die-bonder_Cammax_EDB-80.jpg\|200x200px\|thumb\|The Die-bonder Cammax EDB-80 is placed in ~~Danchip's~~ Packlab building 347, 1. floor.]]		[[image:Die-bonder_Cammax_EDB-80.jpg\|200x200px\|thumb\|The Die-bonder Cammax EDB-80 is placed in the Packlab in building 347, 1st floor.]]
	[[image:DieBonderHeatingChuck.jpg\|200x300px\|thumb\|Heating Chuck on the Die-bonder]]		[[image:DieBonderHeatingChuck.jpg\|200x300px\|thumb\|Heating Chuck on the Die-bonder]]
	== Die bonder (eutectic metal soldering) ==		== Die bonder (eutectic metal soldering) ==

Jmli at 16:30, 25 November 2019

2019-11-25T16:30:21Z

Jehan: /* Process information */

2017-11-21T15:42:02Z

Process information

← Older revision		Revision as of 17:42, 21 November 2017
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	*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding\|Au-Sn eutectic die bonding]]		*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding\|Au-Sn eutectic die bonding]]
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Jehan: /* Process information */

2017-11-21T15:41:44Z

Process information

← Older revision		Revision as of 17:41, 21 November 2017
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	*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding\|Au-Sn eutectic die bonding]]		*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding\|Au-Sn eutectic die bonding]]
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	== Flip-chip bonder (glue attachment) ==		== Flip-chip bonder (glue attachment) ==

Jehan: /* Process information */

2017-11-21T15:41:23Z

Process information

← Older revision		Revision as of 17:41, 21 November 2017
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	*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding\|Au-Sn eutectic die bonding]]		*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding\|Au-Sn eutectic die bonding]]





	== Flip-chip bonder (glue attachment) ==		== Flip-chip bonder (glue attachment) ==

← Older revision		Revision as of 18:30, 25 November 2019
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	'''Feedback to this page''': '''[mailto:~~danchipsupport~~@~~danchip~~.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.~~danchip~~.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''		'''Feedback to this page''': '''[mailto:fabricationsupport@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''
	<!-- Replace "http://labadviser.~~danchip~~.dtu.dk/..." ~~wih~~ the link to the Labadviser page-->		<!-- Replace "http://labadviser.nanolab.dtu.dk/..." with the link to the Labadviser page-->

	[[image:Die-bonder_Cammax_EDB-80.jpg\|200x200px\|thumb\|The Die-bonder Cammax EDB-80 is placed in Danchip's Packlab building 347, 1. floor.]]		[[image:Die-bonder_Cammax_EDB-80.jpg\|200x200px\|thumb\|The Die-bonder Cammax EDB-80 is placed in Danchip's Packlab building 347, 1. floor.]]
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	<!-- give the link to the equipment info page in LabManager: -->		<!-- give the link to the equipment info page in LabManager: -->
	[http://labmanager~~.danchip~~.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager]		[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager]

	== Process information ==		== Process information ==
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	== Flip-chip bonder (glue attachment) ==		== Flip-chip bonder (glue attachment) ==
	[[image:Flip_chip_Bonder_dr_Tresky.jpg\|200x200px\|right\|thumb\|The Flip chip bonder is placed in ~~Danchip's~~ Packlab building 347, 1. floor.]]		[[image:Flip_chip_Bonder_dr_Tresky.jpg\|200x200px\|right\|thumb\|The Flip chip bonder is placed in the Packlab in building 347, 1. floor.]]

	The flip chip bonder can be used to place chips on a substrate with high precision. This way electrical contacts can be made between contact pads on the chip and substrate.		The flip chip bonder can be used to place chips on a substrate with high precision. This way electrical contacts can be made between contact pads on the chip and substrate.
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	With a dispensing tool small amounts of solder paste or glue is dispensed on the substrate with high accuracy. The substrate could for example be a printed circuit board (PCB). After some experience with the machine, it is possible to place dots with different shapes and sizes on the surface. With a placement tool a chip can then be picked up upside down and by the use of a camera unit, it is possible to align the contacts on the chip to the solder/glue dots on the on the substrate before joining the two surfaces with a light pressure. The stack is subsequently cured and an underfill glue can be dispensed to enhance the bonding strength between chip and substrate.		With a dispensing tool small amounts of solder paste or glue is dispensed on the substrate with high accuracy. The substrate could for example be a printed circuit board (PCB). After some experience with the machine, it is possible to place dots with different shapes and sizes on the surface. With a placement tool a chip can then be picked up upside down and by the use of a camera unit, it is possible to align the contacts on the chip to the solder/glue dots on the on the substrate before joining the two surfaces with a light pressure. The stack is subsequently cured and an underfill glue can be dispensed to enhance the bonding strength between chip and substrate.

	The Flip Chip Bonder is placed in ~~Danchip's~~ Packlab building 347, 1. floor.		The Flip Chip Bonder is placed in Nanolab Packlab building 347, 1. floor.

	'''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''		'''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''

	<!-- give the link to the equipment info page in LabManager: -->		<!-- give the link to the equipment info page in LabManager: -->
	[http://labmanager~~.danchip~~.dtu.dk/function.php?module=Machine&view=view&mach=319 Flip-chip Bonder in LabManager]		[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=319 Flip-chip Bonder in LabManager]

	==Equipment performance and process related parameters==		==Equipment performance and process related parameters==